TE Connectivity 2-104078-2

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Contact shape in electronic components refers to the physical geometry of the interface where electrical connections are made. It plays a critical role in determining the quality and reliability of the connection, impacting factors such as resistance, current density, and heat dissipation. Various shapes, such as flat, cylindrical, or custom profiles, influence the contact area, enabling designers to optimize performance for specific applications. The contact shape also affects the mechanical stability of the connection, influencing wear and longevity.

The parameter "Housing Material" in electronic components refers to the material used to encase or protect the internal circuitry of the component. The housing material plays a crucial role in providing physical protection, insulation, and environmental resistance to the electronic component. Common housing materials include plastics, metals, ceramics, and composites, each offering different levels of durability, heat resistance, and electrical properties. The choice of housing material is important in determining the overall performance, reliability, and longevity of the electronic component in various operating conditions.

The PCB Mounting Orientation refers to the specific position or alignment in which an electronic component is mounted onto a printed circuit board (PCB). This parameter is crucial for ensuring proper functionality and performance of the component within the electronic system. The orientation can include factors such as the physical placement, angle, and direction in which the component is mounted on the PCB. It is important to follow the manufacturer's guidelines and specifications for the correct PCB Mounting Orientation to avoid potential issues such as electrical shorts, mechanical stress, or interference with other components on the board.

Underplate Material in electronic components refers to the material used for the underplate layer, which is a thin metallic coating applied to the surface of a component. The underplate material is typically chosen based on its ability to provide a stable and reliable surface for subsequent processes such as soldering or wire bonding. Common materials used for underplate include nickel, gold, silver, and tin. The choice of underplate material can impact the component's performance, durability, and overall quality. It is important to select the appropriate underplate material based on the specific requirements of the electronic component and its intended application.

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

In electronic components, "Pitch" refers to the distance between the center of one pin or lead to the center of the adjacent pin or lead on a component, such as an integrated circuit (IC) or a connector. It is a crucial parameter as it determines the spacing and alignment of the pins or leads on a component, which in turn affects how the component can be mounted on a circuit board or connected to other components.The pitch measurement is typically expressed in millimeters (mm) or inches (in) and plays a significant role in determining the overall size and layout of a circuit board. Components with different pitches may require specific types of circuit boards or connectors to ensure proper alignment and connection. Designers must carefully consider the pitch of components when designing circuit layouts to ensure compatibility and proper functionality of the electronic system.

In electronic components, the parameter "Orientation" refers to the specific alignment or positioning of the component with respect to its intended installation or operation. This parameter is crucial for ensuring proper functionality and performance of the component within a circuit or system. Orientation may include factors such as the physical orientation of the component on a circuit board, the direction of current flow through the component, or the alignment of specific features or terminals for correct connection. Manufacturers often provide orientation guidelines in datasheets or technical specifications to help users correctly install and use the component. Paying attention to the orientation of electronic components is essential to prevent errors, ensure reliability, and optimize the overall performance of electronic devices.

Housing color in electronic components refers to the color of the protective casing or enclosure that surrounds the component. It can play a role in visual identification, aiding in easy recognition during assembly or maintenance. Additionally, the housing color may also have implications for heat dissipation, aesthetic considerations, or regulatory compliance depending on the application or industry standards.

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

The measurement of insulation resistance is carried out by means of a megohmmeter – high resistance range ohmmeter. A general rule-of-thumb is 10 Megohm or more.

the space needed between rows to allow room for people or farm equipment to get through.

High Temperature Compatible refers to the ability of an electronic component to withstand and operate effectively in high-temperature environments without experiencing performance degradation or failure. Components labeled as high temperature compatible are designed to maintain their functionality and reliability even when exposed to elevated temperatures, which can be crucial in applications where heat generation is a concern. These components are typically constructed using materials and manufacturing processes that can withstand higher temperatures than standard components, ensuring their durability and longevity in challenging operating conditions. Overall, the high temperature compatibility of electronic components is essential for maintaining the stability and efficiency of electronic systems in demanding environments.

Plating thickness in electronic components refers to the measurement of the thickness of the metal plating applied to various surfaces of the component. This plating is typically done to enhance the component's conductivity, corrosion resistance, and solderability. The plating thickness is an important parameter as it directly affects the performance and reliability of the electronic component. Manufacturers specify the required plating thickness to ensure that the component meets the desired electrical and mechanical properties for its intended application. Testing and quality control measures are often employed to verify that the plating thickness meets the specified requirements.

PCB thickness refers to the measurement of the thickness of a printed circuit board, typically expressed in millimeters or mils. It plays a crucial role in determining the mechanical strength, flexibility, and thermal performance of the PCB. Standard thicknesses commonly range from 0.2 mm to 3.2 mm, with the most common thickness being 1.6 mm. The choice of PCB thickness affects the overall design and functionality of electronic devices, influencing factors such as signal integrity and power management.

The Flammability Rating of electronic components refers to the material's ability to resist catching fire or burning when exposed to heat or flames. It is an important safety consideration in electronic design and manufacturing, especially for components that may be used in environments where fire hazards are a concern. The rating is typically expressed using a standardized scale, such as UL94, which classifies materials based on their flammability characteristics. Components with higher flammability ratings are more resistant to ignition and contribute to overall fire safety in electronic devices. It is crucial to select components with appropriate flammability ratings to ensure the reliability and safety of electronic products.