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Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

The parameter "Housing Material" in electronic components refers to the material used to encase or protect the internal circuitry of the component. The housing material plays a crucial role in providing physical protection, insulation, and environmental resistance to the electronic component. Common housing materials include plastics, metals, ceramics, and composites, each offering different levels of durability, heat resistance, and electrical properties. The choice of housing material is important in determining the overall performance, reliability, and longevity of the electronic component in various operating conditions.

The PCB Mounting Orientation refers to the specific position or alignment in which an electronic component is mounted onto a printed circuit board (PCB). This parameter is crucial for ensuring proper functionality and performance of the component within the electronic system. The orientation can include factors such as the physical placement, angle, and direction in which the component is mounted on the PCB. It is important to follow the manufacturer's guidelines and specifications for the correct PCB Mounting Orientation to avoid potential issues such as electrical shorts, mechanical stress, or interference with other components on the board.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

In electronic components, "Pitch" refers to the distance between the center of one pin or lead to the center of the adjacent pin or lead on a component, such as an integrated circuit (IC) or a connector. It is a crucial parameter as it determines the spacing and alignment of the pins or leads on a component, which in turn affects how the component can be mounted on a circuit board or connected to other components.The pitch measurement is typically expressed in millimeters (mm) or inches (in) and plays a significant role in determining the overall size and layout of a circuit board. Components with different pitches may require specific types of circuit boards or connectors to ensure proper alignment and connection. Designers must carefully consider the pitch of components when designing circuit layouts to ensure compatibility and proper functionality of the electronic system.

In electronic components, the parameter "Orientation" refers to the specific alignment or positioning of the component with respect to its intended installation or operation. This parameter is crucial for ensuring proper functionality and performance of the component within a circuit or system. Orientation may include factors such as the physical orientation of the component on a circuit board, the direction of current flow through the component, or the alignment of specific features or terminals for correct connection. Manufacturers often provide orientation guidelines in datasheets or technical specifications to help users correctly install and use the component. Paying attention to the orientation of electronic components is essential to prevent errors, ensure reliability, and optimize the overall performance of electronic devices.

"Termination style" in electronic components refers to the method used to connect the component to a circuit board or other electronic devices. It determines how the component's leads or terminals are designed for soldering or mounting onto the circuit board. Common termination styles include through-hole, surface mount, and wire lead terminations.Through-hole components have leads that are inserted through holes in the circuit board and soldered on the other side. Surface mount components have flat terminals that are soldered directly onto the surface of the circuit board. Wire lead terminations involve attaching wires to the component for connection.The choice of termination style depends on factors such as the type of component, the manufacturing process, and the space available on the circuit board. Different termination styles offer various advantages in terms of ease of assembly, reliability, and space efficiency in electronic designs.

Housing color in electronic components refers to the color of the protective casing or enclosure that surrounds the component. It can play a role in visual identification, aiding in easy recognition during assembly or maintenance. Additionally, the housing color may also have implications for heat dissipation, aesthetic considerations, or regulatory compliance depending on the application or industry standards.

Lead length refers to the distance from the body of an electronic component to the end of its leads or terminals. It is an important specification in component design and packaging, as it affects the ease of soldering, the overall fit within a circuit board, and the electrical performance. Longer leads can facilitate easier connections but may also introduce increased resistance or inductance in high-frequency applications. Proper lead length is crucial for ensuring reliable connections and optimal performance in electronic circuits.

the space needed between rows to allow room for people or farm equipment to get through.

ELV stands for Extra-Low Voltage, which refers to a specific voltage range used in electronic components and systems. This voltage range typically falls below 50 volts AC or 120 volts DC. ELV systems are designed to operate at lower voltages for safety reasons, as they pose a reduced risk of electric shock compared to higher voltage systems. Components and devices operating within the ELV range are commonly used in various applications, such as telecommunications, data centers, and low-power electronics. Adhering to ELV standards helps ensure the safety of both users and equipment in these systems.

a group of products which fulfill a similar need for a market segment or market as a whole.

The parameter "Stackable" in electronic components refers to the ability of certain components to be physically layered or stacked on top of each other without compromising their functionality or performance. This feature is particularly common in modules, such as memory or power supplies, allowing for compact designs and efficient use of space in electronic systems. Stackable components often include features like alignment guides or electrical interconnects that facilitate easy assembly and reliable connections in multi-layer configurations.

High Temperature Compatible refers to the ability of an electronic component to withstand and operate effectively in high-temperature environments without experiencing performance degradation or failure. Components labeled as high temperature compatible are designed to maintain their functionality and reliability even when exposed to elevated temperatures, which can be crucial in applications where heat generation is a concern. These components are typically constructed using materials and manufacturing processes that can withstand higher temperatures than standard components, ensuring their durability and longevity in challenging operating conditions. Overall, the high temperature compatibility of electronic components is essential for maintaining the stability and efficiency of electronic systems in demanding environments.

In the context of electronic components, the parameter "Product" typically refers to the specific item or device being discussed or analyzed. It can refer to a physical electronic component such as a resistor, capacitor, transistor, or integrated circuit. The product parameter may also encompass more complex electronic devices like sensors, displays, microcontrollers, or communication modules.Understanding the product parameter is crucial in electronics as it helps identify the characteristics, specifications, and functionality of the component or device in question. This information is essential for selecting the right components for a circuit design, troubleshooting issues, or comparing different products for a particular application. Manufacturers often provide detailed product datasheets that outline key specifications, performance characteristics, and application guidelines to assist engineers and designers in utilizing the component effectively.

The "Mounting Angle" parameter in electronic components refers to the angle at which a component is mounted on a circuit board or within an electronic system. It is important to consider the mounting angle during the design and assembly process to ensure proper functionality and performance of the component. The mounting angle can affect factors such as signal integrity, thermal management, and mechanical stress on the component. Manufacturers often provide specific guidelines or recommendations for the mounting angle of their components to ensure optimal operation and reliability.

a particular group of related products.

Plating thickness in electronic components refers to the measurement of the thickness of the metal plating applied to various surfaces of the component. This plating is typically done to enhance the component's conductivity, corrosion resistance, and solderability. The plating thickness is an important parameter as it directly affects the performance and reliability of the electronic component. Manufacturers specify the required plating thickness to ensure that the component meets the desired electrical and mechanical properties for its intended application. Testing and quality control measures are often employed to verify that the plating thickness meets the specified requirements.

PCB thickness refers to the measurement of the thickness of a printed circuit board, typically expressed in millimeters or mils. It plays a crucial role in determining the mechanical strength, flexibility, and thermal performance of the PCB. Standard thicknesses commonly range from 0.2 mm to 3.2 mm, with the most common thickness being 1.6 mm. The choice of PCB thickness affects the overall design and functionality of electronic devices, influencing factors such as signal integrity and power management.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.