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Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, "Pitch" refers to the distance between the center of one pin or lead to the center of the adjacent pin or lead on a component, such as an integrated circuit (IC) or a connector. It is a crucial parameter as it determines the spacing and alignment of the pins or leads on a component, which in turn affects how the component can be mounted on a circuit board or connected to other components.The pitch measurement is typically expressed in millimeters (mm) or inches (in) and plays a significant role in determining the overall size and layout of a circuit board. Components with different pitches may require specific types of circuit boards or connectors to ensure proper alignment and connection. Designers must carefully consider the pitch of components when designing circuit layouts to ensure compatibility and proper functionality of the electronic system.

Housing color in electronic components refers to the color of the protective casing or enclosure that surrounds the component. It can play a role in visual identification, aiding in easy recognition during assembly or maintenance. Additionally, the housing color may also have implications for heat dissipation, aesthetic considerations, or regulatory compliance depending on the application or industry standards.

a group of products which fulfill a similar need for a market segment or market as a whole.

The parameter "Current Rating (Max)" in electronic components specifies the maximum amount of electric current that the component can safely handle without overheating or being damaged. It is a crucial specification that ensures reliable operation in a circuit, as exceeding this limit can lead to failure or reduced lifespan of the component. This rating is typically expressed in amperes (A) and varies depending on the type of component, its design, and its intended application. Knowing the current rating is essential for designers to ensure that components are adequately rated for their specific use cases.

The "Mounting Angle" parameter in electronic components refers to the angle at which a component is mounted on a circuit board or within an electronic system. It is important to consider the mounting angle during the design and assembly process to ensure proper functionality and performance of the component. The mounting angle can affect factors such as signal integrity, thermal management, and mechanical stress on the component. Manufacturers often provide specific guidelines or recommendations for the mounting angle of their components to ensure optimal operation and reliability.

a particular group of related products.

Board Thickness in electronic components refers to the measurement of the thickness of the printed circuit board (PCB) on which the electronic components are mounted. The board thickness is an important parameter as it determines the overall mechanical strength and rigidity of the PCB. It also affects the electrical performance of the circuit, such as impedance control and signal integrity. Different applications may require different board thicknesses based on factors like the size of the components, the complexity of the circuit, and the environmental conditions in which the PCB will be used. Manufacturers typically provide a range of board thickness options to accommodate various design requirements.

Product Height (mm) in electronic components refers to the measurement of the component's vertical dimension. It indicates how tall the component is when installed in a circuit or system. This parameter is crucial for determining compatibility with enclosures, ensuring adequate space for components on printed circuit boards, and facilitating proper airflow and cooling in electronic designs.