TE Connectivity 5223116-1

Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The parameter "Housing Material" in electronic components refers to the material used to encase or protect the internal circuitry of the component. The housing material plays a crucial role in providing physical protection, insulation, and environmental resistance to the electronic component. Common housing materials include plastics, metals, ceramics, and composites, each offering different levels of durability, heat resistance, and electrical properties. The choice of housing material is important in determining the overall performance, reliability, and longevity of the electronic component in various operating conditions.

The PCB Mounting Orientation refers to the specific position or alignment in which an electronic component is mounted onto a printed circuit board (PCB). This parameter is crucial for ensuring proper functionality and performance of the component within the electronic system. The orientation can include factors such as the physical placement, angle, and direction in which the component is mounted on the PCB. It is important to follow the manufacturer's guidelines and specifications for the correct PCB Mounting Orientation to avoid potential issues such as electrical shorts, mechanical stress, or interference with other components on the board.

PCB Mount Retention refers to the ability of an electronic component to securely attach to a printed circuit board (PCB) and remain in place during operation and handling. This parameter is crucial for ensuring the reliability and stability of the component within the electronic system. Components with good PCB mount retention are less likely to become dislodged or detached from the PCB due to factors such as vibration, thermal cycling, or mechanical stress. Manufacturers often provide specifications or guidelines for PCB mount retention to help designers and engineers select the appropriate components for their applications.

PCB Mount Alignment refers to the process of ensuring that electronic components are correctly positioned and aligned on a printed circuit board (PCB) during assembly. Proper alignment is crucial for the components to function correctly and for the overall functionality and reliability of the electronic device. This process involves precise placement of the components according to the design specifications, which may include factors such as orientation, spacing, and mechanical fit. Improper alignment can lead to issues such as electrical shorts, poor solder connections, or mechanical stress on the components, which can result in malfunction or failure of the device.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

In electronic components, "Pitch" refers to the distance between the center of one pin or lead to the center of the adjacent pin or lead on a component, such as an integrated circuit (IC) or a connector. It is a crucial parameter as it determines the spacing and alignment of the pins or leads on a component, which in turn affects how the component can be mounted on a circuit board or connected to other components.The pitch measurement is typically expressed in millimeters (mm) or inches (in) and plays a significant role in determining the overall size and layout of a circuit board. Components with different pitches may require specific types of circuit boards or connectors to ensure proper alignment and connection. Designers must carefully consider the pitch of components when designing circuit layouts to ensure compatibility and proper functionality of the electronic system.

In electronic components, the parameter "Orientation" refers to the specific alignment or positioning of the component with respect to its intended installation or operation. This parameter is crucial for ensuring proper functionality and performance of the component within a circuit or system. Orientation may include factors such as the physical orientation of the component on a circuit board, the direction of current flow through the component, or the alignment of specific features or terminals for correct connection. Manufacturers often provide orientation guidelines in datasheets or technical specifications to help users correctly install and use the component. Paying attention to the orientation of electronic components is essential to prevent errors, ensure reliability, and optimize the overall performance of electronic devices.

a count of all of the component leads (or pins)

Housing color in electronic components refers to the color of the protective casing or enclosure that surrounds the component. It can play a role in visual identification, aiding in easy recognition during assembly or maintenance. Additionally, the housing color may also have implications for heat dissipation, aesthetic considerations, or regulatory compliance depending on the application or industry standards.

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

The parameter "Contact Style" in electronic components refers to the specific design and arrangement of the contact points that enable electrical connection in various devices. It dictates how components interface with each other, affecting factors such as reliability, durability, and performance. Different contact styles can include configurations like pin, socket, blade, or surface mount, each designed to cater to specific applications and requirements in circuit assembly.

The measurement of insulation resistance is carried out by means of a megohmmeter – high resistance range ohmmeter. A general rule-of-thumb is 10 Megohm or more.

the space needed between rows to allow room for people or farm equipment to get through.

ELV stands for Extra-Low Voltage, which refers to a specific voltage range used in electronic components and systems. This voltage range typically falls below 50 volts AC or 120 volts DC. ELV systems are designed to operate at lower voltages for safety reasons, as they pose a reduced risk of electric shock compared to higher voltage systems. Components and devices operating within the ELV range are commonly used in various applications, such as telecommunications, data centers, and low-power electronics. Adhering to ELV standards helps ensure the safety of both users and equipment in these systems.

In the context of electronic components, "Plating" refers to a process of depositing a thin layer of metal onto a substrate material. This plating is often used to enhance the component's performance, durability, and conductivity. The plating material can vary depending on the specific requirements of the component, with common choices including gold, silver, tin, and nickel. Plating can also be used for corrosion resistance, solderability, and to improve the overall appearance of the component. Overall, plating plays a crucial role in ensuring the reliability and functionality of electronic components in various applications.

The parameter "Sealable" in electronic components refers to the ability of the component to be securely sealed or enclosed to protect it from environmental factors such as moisture, dust, and other contaminants. Components that are sealable are designed to prevent damage or malfunction caused by exposure to these external elements. This sealing can be achieved through various methods such as encapsulation, potting, or conformal coating. Ensuring that electronic components are sealable is important for maintaining their reliability and longevity in various operating conditions.

The current rating of a contact is defined as the current level that creates a certain temperature rise of the contact spring — usually 20°C or 30°C. Both electrical and thermal factors govern the heat created by the current.

Mating Post Length refers to the length of the protruding contact elements in electronic connectors that engage with corresponding contacts in a mating component. It is a critical dimension that ensures proper alignment and electrical connectivity between two parts. The measurement can influence the reliability of the connection and may impact the overall design and layout of electronic assemblies. Proper mating post length is essential for maintaining signal integrity and preventing mechanical issues during operation.

a group of products which fulfill a similar need for a market segment or market as a whole.

In electronic components, the term "Screening Level" refers to the level of testing and inspection that a component undergoes to ensure its reliability and performance. This process involves subjecting the component to various tests, such as temperature cycling, burn-in, and electrical testing, to identify any defects or weaknesses that could affect its functionality. The screening level is typically determined based on the application requirements and the criticality of the component in the system. Components that undergo higher screening levels are generally more reliable but may also be more expensive. Overall, the screening level helps to ensure that electronic components meet the necessary quality standards for their intended use.

Mating alignment in electronic components refers to the precise positioning and orientation required for two components to connect or fit together properly. This parameter is crucial for ensuring that electrical connections are made correctly and securely. It involves factors such as the physical dimensions, shape, and alignment features of the components that need to be matched for successful mating. Proper mating alignment is essential for maintaining signal integrity, preventing damage to the components, and ensuring reliable performance of the electronic system. Manufacturers often provide specifications and guidelines for mating alignment to help users achieve optimal connections and functionality.

The parameter "Stackable" in electronic components refers to the ability of certain components to be physically layered or stacked on top of each other without compromising their functionality or performance. This feature is particularly common in modules, such as memory or power supplies, allowing for compact designs and efficient use of space in electronic systems. Stackable components often include features like alignment guides or electrical interconnects that facilitate easy assembly and reliable connections in multi-layer configurations.

a particular group of related products.

The parameter "Product Length (mm)" in electronic components refers to the physical length of the component, typically measured in millimeters. This measurement is important for determining the size and dimensions of the component, which is crucial for fitting it into a circuit board or enclosure. It helps in ensuring proper alignment and spacing within the overall design of the electronic system. Manufacturers provide this specification to assist engineers and designers in selecting components that will fit and function correctly within their intended application.

Contact Finish Thickness - Mating is a parameter in electronic components that refers to the thickness of the plating or finish on the contact surfaces of a connector or terminal that come into direct contact with mating components. This parameter is crucial for ensuring proper electrical conductivity and mechanical stability during mating and unmating processes. The contact finish thickness affects the overall reliability and performance of the connection by influencing factors such as contact resistance, wear resistance, and corrosion resistance. Manufacturers specify this parameter to ensure compatibility and optimal performance in various applications.

PCB thickness refers to the measurement of the thickness of a printed circuit board, typically expressed in millimeters or mils. It plays a crucial role in determining the mechanical strength, flexibility, and thermal performance of the PCB. Standard thicknesses commonly range from 0.2 mm to 3.2 mm, with the most common thickness being 1.6 mm. The choice of PCB thickness affects the overall design and functionality of electronic devices, influencing factors such as signal integrity and power management.

Product Height (mm) in electronic components refers to the measurement of the component's vertical dimension. It indicates how tall the component is when installed in a circuit or system. This parameter is crucial for determining compatibility with enclosures, ensuring adequate space for components on printed circuit boards, and facilitating proper airflow and cooling in electronic designs.

The Flammability Rating of electronic components refers to the material's ability to resist catching fire or burning when exposed to heat or flames. It is an important safety consideration in electronic design and manufacturing, especially for components that may be used in environments where fire hazards are a concern. The rating is typically expressed using a standardized scale, such as UL94, which classifies materials based on their flammability characteristics. Components with higher flammability ratings are more resistant to ignition and contribute to overall fire safety in electronic devices. It is crucial to select components with appropriate flammability ratings to ensure the reliability and safety of electronic products.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.