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Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

In the context of electronic components, the parameter "Gender" typically refers to the physical characteristics of connectors or interfaces that determine how they can be mated together. Connectors are often designed with specific gender types, such as male or female, to ensure proper alignment and connection between devices. A male connector typically has protruding pins or plugs that fit into a corresponding female connector, which has receptacles or sockets to receive the pins. This design helps prevent incorrect connections and ensures a secure and reliable electrical connection. Understanding the gender of connectors is crucial when designing or assembling electronic systems to ensure compatibility and proper functionality. It is essential to match the gender of connectors correctly to avoid damage and ensure optimal performance of the electronic components.

In electronic components, the parameter "Orientation" refers to the specific alignment or positioning of the component with respect to its intended installation or operation. This parameter is crucial for ensuring proper functionality and performance of the component within a circuit or system. Orientation may include factors such as the physical orientation of the component on a circuit board, the direction of current flow through the component, or the alignment of specific features or terminals for correct connection. Manufacturers often provide orientation guidelines in datasheets or technical specifications to help users correctly install and use the component. Paying attention to the orientation of electronic components is essential to prevent errors, ensure reliability, and optimize the overall performance of electronic devices.

Contact finish refers to the surface coating or treatment applied to the electrical contacts of electronic components. This finish is crucial for ensuring reliable electrical connections and preventing corrosion or oxidation of the contacts. Common contact finishes include gold, silver, tin, and nickel, each offering different levels of conductivity, durability, and resistance to environmental factors. The choice of contact finish depends on the specific application requirements, such as operating conditions, cost considerations, and compatibility with other components in the circuit. Selecting the appropriate contact finish is essential for maintaining the performance and longevity of electronic devices.

Lead length refers to the distance from the body of an electronic component to the end of its leads or terminals. It is an important specification in component design and packaging, as it affects the ease of soldering, the overall fit within a circuit board, and the electrical performance. Longer leads can facilitate easier connections but may also introduce increased resistance or inductance in high-frequency applications. Proper lead length is crucial for ensuring reliable connections and optimal performance in electronic circuits.

The parameter "Contact Style" in electronic components refers to the specific design and arrangement of the contact points that enable electrical connection in various devices. It dictates how components interface with each other, affecting factors such as reliability, durability, and performance. Different contact styles can include configurations like pin, socket, blade, or surface mount, each designed to cater to specific applications and requirements in circuit assembly.

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

ELV stands for Extra-Low Voltage, which refers to a specific voltage range used in electronic components and systems. This voltage range typically falls below 50 volts AC or 120 volts DC. ELV systems are designed to operate at lower voltages for safety reasons, as they pose a reduced risk of electric shock compared to higher voltage systems. Components and devices operating within the ELV range are commonly used in various applications, such as telecommunications, data centers, and low-power electronics. Adhering to ELV standards helps ensure the safety of both users and equipment in these systems.

In the context of electronic components, "Plating" refers to a process of depositing a thin layer of metal onto a substrate material. This plating is often used to enhance the component's performance, durability, and conductivity. The plating material can vary depending on the specific requirements of the component, with common choices including gold, silver, tin, and nickel. Plating can also be used for corrosion resistance, solderability, and to improve the overall appearance of the component. Overall, plating plays a crucial role in ensuring the reliability and functionality of electronic components in various applications.

Contact termination in electronic components refers to the method used to connect the component to a circuit or system. It is the point where the component's electrical connection is terminated or connected to the external circuit. Common contact termination methods include soldering, wire bonding, press-fit connectors, and surface mount technology (SMT). The choice of contact termination method depends on factors such as the type of component, the application requirements, and the manufacturing process. Proper contact termination is crucial for ensuring reliable electrical connections and overall performance of the electronic component.

The parameter "Pin or Socket" in electronic components refers to the method of connecting a component to a circuit or board. Pins are metal protrusions that insert into holes on a circuit board, creating a secure connection. Sockets, on the other hand, are receptacles that allow components to be easily inserted and removed without soldering. This distinction impacts the ease of replacement, the reliability of connections, and the overall design flexibility of electronic assemblies.

Contact Finish Thickness refers to the measurement of the layer of conductive material applied to the surfaces of electrical contacts in electronic components. This thickness is critical as it influences the electrical conductivity, solderability, wear resistance, and overall performance of the connection. The materials used for the contact finish can include gold, silver, or other metals, and the specified thickness is designed to ensure reliable operation over the component's lifespan.

Plating thickness in electronic components refers to the measurement of the thickness of the metal plating applied to various surfaces of the component. This plating is typically done to enhance the component's conductivity, corrosion resistance, and solderability. The plating thickness is an important parameter as it directly affects the performance and reliability of the electronic component. Manufacturers specify the required plating thickness to ensure that the component meets the desired electrical and mechanical properties for its intended application. Testing and quality control measures are often employed to verify that the plating thickness meets the specified requirements.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.