TE Connectivity AMP Connectors 3-147070-1

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

The "Mounting Hole Diameter" in electronic components refers to the size of the hole or opening in the component that is used for mounting or securing it onto a circuit board or other surface. This parameter is crucial for ensuring that the component can be properly and securely attached to the intended location. The mounting hole diameter is typically specified in millimeters or inches and must match the corresponding mounting hardware or fasteners to ensure a proper fit. It is important to consider the mounting hole diameter when designing and assembling electronic circuits to ensure proper installation and functionality of the components.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

Contact finish refers to the surface coating or treatment applied to the electrical contacts of electronic components. This finish is crucial for ensuring reliable electrical connections and preventing corrosion or oxidation of the contacts. Common contact finishes include gold, silver, tin, and nickel, each offering different levels of conductivity, durability, and resistance to environmental factors. The choice of contact finish depends on the specific application requirements, such as operating conditions, cost considerations, and compatibility with other components in the circuit. Selecting the appropriate contact finish is essential for maintaining the performance and longevity of electronic devices.

The measurement of insulation resistance is carried out by means of a megohmmeter – high resistance range ohmmeter. A general rule-of-thumb is 10 Megohm or more.

ELV stands for Extra-Low Voltage, which refers to a specific voltage range used in electronic components and systems. This voltage range typically falls below 50 volts AC or 120 volts DC. ELV systems are designed to operate at lower voltages for safety reasons, as they pose a reduced risk of electric shock compared to higher voltage systems. Components and devices operating within the ELV range are commonly used in various applications, such as telecommunications, data centers, and low-power electronics. Adhering to ELV standards helps ensure the safety of both users and equipment in these systems.

The current rating of a contact is defined as the current level that creates a certain temperature rise of the contact spring — usually 20°C or 30°C. Both electrical and thermal factors govern the heat created by the current.

Insulation in electronic components refers to the material properties that prevent the flow of electric current between conductive parts. It is critical for ensuring safety and reliability in circuits by minimizing unintended current paths. High insulation resistance helps protect against short circuits and enhances the durability of electronic devices by insulating high-voltage components from sensitive areas. Insulation can also affect signal integrity and can be a key factor in high-frequency applications.

Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.

The term "Terminal Style" in electronic components refers to the physical design and configuration of the terminals or connection points on the component. These terminals are used for connecting the component to a circuit or other components. The terminal style can vary depending on the type of component and its intended application.Common terminal styles include through-hole, surface mount, wire lead, and solder tab terminals. Through-hole terminals are typically cylindrical pins that pass through holes in a circuit board for soldering. Surface mount terminals are flat pads on the surface of the component that are soldered directly to the circuit board. Wire lead terminals are wires attached to the component for connection, while solder tab terminals are metal tabs that are soldered to the circuit board.The choice of terminal style can impact the ease of assembly, reliability, and overall performance of the electronic component in a circuit. Designers must consider the terminal style when selecting components to ensure compatibility with the circuit design and manufacturing processes.

Pin Size - Above Flange is a parameter that refers to the dimensions of the pins of an electronic component above the flange. The flange is a flat, typically circular component that serves as a mounting surface or connection point for the electronic component. The pin size above the flange is important for determining how the component will fit into a circuit board or other mounting structure. It includes measurements such as the length and diameter of the pins that extend above the flange, which are crucial for ensuring proper alignment and connection within the electronic system. Understanding this parameter is essential for selecting and integrating electronic components effectively in a design.

Pin Size - Below Flange is a parameter that refers to the size of the pins on an electronic component below the flange. The flange is a flat, projecting rim or collar on an object, often used for attachment or stability. In electronic components, the pins are the small metal legs or connectors that are used to connect the component to a circuit board or other components. The "Pin Size - Below Flange" measurement specifies the dimensions of the pins below the flange, including their length, diameter, and spacing. This parameter is important for ensuring proper fit and compatibility when integrating the component into a circuit or system.

Contact Finish Thickness refers to the measurement of the layer of conductive material applied to the surfaces of electrical contacts in electronic components. This thickness is critical as it influences the electrical conductivity, solderability, wear resistance, and overall performance of the connection. The materials used for the contact finish can include gold, silver, or other metals, and the specified thickness is designed to ensure reliable operation over the component's lifespan.

Length - Overall is a crucial parameter in electronic components that refers to the total length of a component from one end to the other. It encompasses any protruding features or attachments, providing a complete measurement of the component's size. This dimension is essential for determining compatibility with circuit boards, housing, and other components in an assembly. Accurate knowledge of the overall length helps ensure proper fit and function in electronic designs.

Board Thickness in electronic components refers to the measurement of the thickness of the printed circuit board (PCB) on which the electronic components are mounted. The board thickness is an important parameter as it determines the overall mechanical strength and rigidity of the PCB. It also affects the electrical performance of the circuit, such as impedance control and signal integrity. Different applications may require different board thicknesses based on factors like the size of the components, the complexity of the circuit, and the environmental conditions in which the PCB will be used. Manufacturers typically provide a range of board thickness options to accommodate various design requirements.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.