Texas Instruments BQ4011MA-150
Texas Instruments BQ4011MA-150
BQ4011(Y,LY)  Pinout Diagram_1
BQ4011(Y,LY) Outline Dimensions_1
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Texas Instruments BQ4011MA-150

Memory IC 50mA mA Memory IC

Manufacturer No:

BQ4011MA-150

Manufacturer:

Texas Instruments

Utmel No:

2502-BQ4011MA-150

Package:

28-DIP Module (0.61, 15.49mm)

Datasheet:

BQ4011(Y,LY)

ECAD Model:

Description:

5V V Through Hole Memory IC BQ4011 256 kb kb 37.72mm mm 50mA mA 8b b

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BQ4011MA-150 information

Specifications
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Texas Instruments BQ4011MA-150 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments BQ4011MA-150.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Through Hole
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    28-DIP Module (0.61, 15.49mm)
  • Number of Pins
    28
  • Memory Types
    Non-Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    no
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    28
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.41
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    4.75V~5.5V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5V
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54mm
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    BQ4011
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    5V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    256Kb 32K x 8
  • Operating Supply Current

    Operating Supply Current, also known as supply current or quiescent current, is a crucial parameter in electronic components that indicates the amount of current required for the device to operate under normal conditions. It represents the current drawn by the component from the power supply while it is functioning. This parameter is important for determining the power consumption of the component and is typically specified in datasheets to help designers calculate the overall power requirements of their circuits. Understanding the operating supply current is essential for ensuring proper functionality and efficiency of electronic systems.

    50mA
  • Nominal Supply Current

    Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.

    50mA
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    NVSRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    8b
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    32KX8
  • Memory Width

    Memory width refers to the number of bits that can be read or written to memory at one time. It is an important specification in electronic components, particularly in memory devices like RAM and cache. A wider memory width allows for greater data throughput, enabling faster performance as more data can be processed simultaneously. Memory width can vary among different types of memory and can impact both the complexity and efficiency of data handling within electronic systems.

    8
  • Write Cycle Time - Word, Page

    Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.

    150ns
  • Density

    In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.

    256 kb
  • Standby Current-Max

    Standby Current-Max refers to the maximum amount of current that an electronic component or device consumes while in a low-power standby mode. This parameter is critical for power management, especially in battery-operated devices, as it indicates how efficiently the device can conserve energy when not actively in use. A lower Standby Current-Max value is typically desirable, as it contributes to longer battery life and reduced energy consumption. Manufacturers specify this value to help engineers select components that meet specific power efficiency requirements in their designs.

    0.004A
  • Access Time (Max)

    Access Time (Max) is a parameter in electronic components, particularly in memory devices such as RAM (Random Access Memory) and storage devices like hard drives and SSDs (Solid State Drives). It refers to the maximum amount of time it takes for the component to retrieve data after receiving a request. In simpler terms, it measures the speed at which data can be accessed from the component. A lower access time indicates faster performance, as the component can quickly retrieve and deliver data to the system. Manufacturers often specify the maximum access time in the component's datasheet to help users understand its performance capabilities.

    150 ns
  • Word Size

    Word "size" refers to the amount of data a CPU's internal data registers can hold and process at one time.

    8b
  • Length
    37.72mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    9.53mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Contains Lead
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Download datasheets and manufacturer documentation for Texas Instruments BQ4011MA-150.

BQ4011MA-150 Overview

It is available in a case with a Tube shape. As you can see, it is embedded in 28-DIP Module (0.61, 15.49mm) case. There is an 256Kb 32K x 8 memory capacity on the chip. In this device, the memory is of the NVSRAM-format, which is a popular format in the mainstream computing sector. Due to its extended operating temperature range, the device is well suited for a wide range of demanding applications. A voltage of 4.75V~5.5V is possible to be applied to the supply. There is a recommendation that Through Hole mounting type should be used for this product. As you can see from the diagram, the chip is planted with 28 terminations. In total, 1 functions are supported by this part. The memory device designed for this application has been designed to be powered by an 5V power supply. To select similar parts, many people use the device's base part number BQ4011. It is encased in an 28-pin package that contains this ic memory chip. It is noted that the operating supply voltage of this memory is 5V. Chips such as this one are mounted using Through Hole mounting, a straightforward method of mounting that is effective. Memory chip's nominal supply current is 50mA. This memory chip requires a mere 5V of power. Devices operating at 50mA volts are recommended.

BQ4011MA-150 Features

Package / Case: 28-DIP Module (0.61, 15.49mm)
28 Pins
Operating Supply Voltage:5V

BQ4011MA-150 Applications

There are a lot of Texas Instruments
BQ4011MA-150 Memory applications.


  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card
  • hard disk drive (HDD)
The three parts on the right have similar specifications to Texas Instruments & BQ4011MA-150.
BQ4011MA-150 Relevant information

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