Texas Instruments TMS320DM335CZCE135
Texas Instruments TMS320DM335CZCE135
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Texas Instruments TMS320DM335CZCE135

CPLD 337 Pin

Manufacturer No:

TMS320DM335CZCE135

Manufacturer:

Texas Instruments

Utmel No:

2502-TMS320DM335CZCE135

Package:

337-LFBGA

Datasheet:

TMS320DM335

ECAD Model:

Description:

CPLD TMS320DM3x, DaVinci™ Series 320DM335 337 Pin 135MHz 337-LFBGA

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TMS320DM335CZCE135 information

Specifications
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Texas Instruments TMS320DM335CZCE135 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments TMS320DM335CZCE135.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    337-LFBGA
  • Number of Pins
    337
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~85°C TC
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    TMS320DM3x, DaVinci™
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Type
    Digital Media System-on-Chip (DMSoC)
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    135MHz
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    320DM335
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.3V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    ASP, EBI/EMI, I2C, SPI, UART, USB
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    1.365V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    1.235V
  • Voltage - I/O

    Voltage - I/O is a parameter that refers to the voltage levels at the input and output pins of an electronic component, such as an integrated circuit or a semiconductor device. It specifies the range of voltages that the component can accept at its input pins and the voltages it will output at its output pins under normal operating conditions. This parameter is crucial for ensuring proper functionality and compatibility with other components in a circuit. It helps designers determine the appropriate voltage levels to use when interfacing with the component to prevent damage and ensure reliable operation.

    1.8V 3.3V
  • Non-Volatile Memory

    Non-Volatile Memory refers to a type of storage technology that retains data even when power is turned off. It is essential for preserving important information in electronic devices, such as computers and smartphones. Common examples of non-volatile memory include Flash memory, EEPROM, and ROM. This characteristic makes non-volatile memory crucial for applications where data integrity and retention are required without a continuous power supply.

    ROM (8kB)
  • Voltage - Core

    Voltage - Core is a parameter that refers to the voltage required to power the core of an electronic component, such as a microprocessor or a graphics processing unit (GPU). The core voltage is essential for the proper functioning of the component, as it provides the necessary power for the core to perform its operations. The voltage level is typically specified by the manufacturer and must be within a certain range to ensure the component operates reliably and efficiently. Monitoring and controlling the core voltage is crucial in maintaining the stability and performance of the electronic component.

    1.30V
  • On Chip Data RAM

    On Chip Data RAM refers to a type of memory that is integrated directly onto a microprocessor or other integrated circuit. This RAM is used for storing data temporarily while the device is in operation, allowing for quick access and retrieval of information. On Chip Data RAM is typically faster than external memory due to its proximity to the processor, which helps improve overall system performance. It is commonly used in various electronic components such as microcontrollers, CPUs, and DSPs to facilitate efficient data processing and manipulation.

    56kB
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Texas Instruments TMS320DM335CZCE135.

TMS320DM335CZCE135 Overview

It is a type of electronic component available in package 337-LFBGA.There is a packaging method of Tray provided with it.Due to its membership in Digital Media System-on-Chip (DMSoC), it is ideally suited for a wide range of uses.Surface Mount is mounted in a manner that allows it to be moved.The operation of the device at the temperature of 0°C~85°C TC ensures the normal operation of the device.The digital voltage range of 1.8V 3.3V refers to the voltage that can be input or output.The TMS320DM3x, DaVinci™ series contains this digital signal processor.In its configuration, 337 pins can be found.Many related parts can be identified by using the 320DM335 part number as a base.135MHz is a frequency at which the device operates according to a specific design.Surface Mount is used as the mounting method.1.235V is the minimum voltage that can be supplied to this device.This device can be powered by 1.365V voltages.The device operates on a voltage of 1.3V as its supply voltage.

TMS320DM335CZCE135 Features

Supplied in the 337-LFBGA package
Operating supply voltage of 1.3V

TMS320DM335CZCE135 Applications

There are a lot of Texas Instruments
TMS320DM335CZCE135 DSP applications.


  • Seismology
  • Audio
  • Sonar
  • Voice recognition
  • Financial signals
  • Other sensor array processing
  • Spectral density estimation
  • Statistical signal processing
  • Digital image processing, data compression
  • Video coding, audio coding
The three parts on the right have similar specifications to Texas Instruments & TMS320DM335CZCE135.
TMS320DM335CZCE135 Relevant information

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