

Texas Instruments TMS320DM6441BZWT
0.8mm CPLD 361 Pin
Manufacturer No:
TMS320DM6441BZWT
Tiny WHSLManufacturer:
Utmel No:
2502-TMS320DM6441BZWT
Package:
361-LFBGA
Description:
0.8mm CPLD TMS320DM644x, DaVinci™ Series 320DM6441 361 Pin 256MHz 1.05V 361-LFBGA
Quantity:
Unit Price: $120.460803
Ext Price: $120.46
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In Stock : 2360
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- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 3 days ago) - Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
361-LFBGA - Number of Pins361
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
0°C~85°C TC - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tube - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
TMS320DM644x, DaVinci™ - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e1 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Not For New Designs - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
3 (168 Hours) - Number of Terminations316
- TypeDigital Media System-on-Chip (DMSoC)
- Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Tin/Silver/Copper (Sn/Ag/Cu) - Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
ALSO OPERATES AT 1.2 V AND 1.1 V TYP - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
BOTTOM - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
BALL - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
1.05V - Terminal Pitch
The center distance from one pole to the next.
0.8mm - Frequency
In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.
256MHz - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
320DM6441 - Pin Count
a count of all of the component leads (or pins)
361 - Supply Voltage-Max (Vsup)
The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.
1.1V - Supply Voltage-Min (Vsup)
The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.
1V - Interface
In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.
ASP, EBI/EMI, Host Interface, I2C, SPI, UART, USB - Bit Size
In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.
32 - Core Architecture
In electronic components, the term "Core Architecture" refers to the fundamental design and structure of the component's internal circuitry. It encompasses the arrangement of key components, such as processors, memory units, and input/output interfaces, within the device. The core architecture plays a crucial role in determining the component's performance, power efficiency, and overall capabilities. Different core architectures are optimized for specific applications and requirements, such as high-speed processing, low power consumption, or specialized functions. Understanding the core architecture of electronic components is essential for engineers and designers to select the most suitable components for their projects.
ARM - Format
In electronic components, the parameter "Format" typically refers to the physical size, shape, and configuration of the component. It describes the overall dimensions and layout of the component, including factors such as package type, lead spacing, and mounting options. The format of an electronic component is important for determining how it can be installed, connected, and integrated into a circuit or system. Different formats are designed to meet specific requirements for space constraints, heat dissipation, electrical performance, and compatibility with other components. Manufacturers often provide detailed specifications for the format of their components to ensure proper selection and usage in electronic designs.
FIXED-POINT - RAM (words)
RAM (words) is a parameter used to describe the memory capacity of a random access memory (RAM) module in terms of the number of words it can store. In the context of electronic components, a word typically refers to the amount of data that can be processed or stored by the RAM module in a single operation. The RAM (words) specification indicates the total number of words that can be stored in the RAM module, with each word typically consisting of a fixed number of bits. This parameter is important for determining the overall memory capacity and performance of the RAM module in electronic devices.
20480 - Voltage - I/O
Voltage - I/O is a parameter that refers to the voltage levels at the input and output pins of an electronic component, such as an integrated circuit or a semiconductor device. It specifies the range of voltages that the component can accept at its input pins and the voltages it will output at its output pins under normal operating conditions. This parameter is crucial for ensuring proper functionality and compatibility with other components in a circuit. It helps designers determine the appropriate voltage levels to use when interfacing with the component to prevent damage and ensure reliable operation.
1.8V 3.3V - Number of UART Channels3
- Bus Compatibility
Bus compatibility in electronic components refers to the ability of a device to communicate effectively with other devices on a shared data bus. This parameter is crucial in ensuring that different components can exchange information seamlessly and operate together without compatibility issues. It involves factors such as voltage levels, signal timing, and data protocols that need to be standardized for proper communication. Components with good bus compatibility can work together efficiently in a system, while those with poor compatibility may lead to communication errors or system malfunctions. Manufacturers often specify the bus compatibility of their components to help users ensure proper integration and functionality within their electronic systems.
ETHERNET; I2C; SPI; UART; USB - Non-Volatile Memory
Non-Volatile Memory refers to a type of storage technology that retains data even when power is turned off. It is essential for preserving important information in electronic devices, such as computers and smartphones. Common examples of non-volatile memory include Flash memory, EEPROM, and ROM. This characteristic makes non-volatile memory crucial for applications where data integrity and retention are required without a continuous power supply.
ROM (8kB) - Voltage - Core
Voltage - Core is a parameter that refers to the voltage required to power the core of an electronic component, such as a microprocessor or a graphics processing unit (GPU). The core voltage is essential for the proper functioning of the component, as it provides the necessary power for the core to perform its operations. The voltage level is typically specified by the manufacturer and must be within a certain range to ensure the component operates reliably and efficiently. Monitoring and controlling the core voltage is crucial in maintaining the stability and performance of the electronic component.
1.05V 1.20V - On Chip Data RAM
On Chip Data RAM refers to a type of memory that is integrated directly onto a microprocessor or other integrated circuit. This RAM is used for storing data temporarily while the device is in operation, allowing for quick access and retrieval of information. On Chip Data RAM is typically faster than external memory due to its proximity to the processor, which helps improve overall system performance. It is commonly used in various electronic components such as microcontrollers, CPUs, and DSPs to facilitate efficient data processing and manipulation.
160kB - Clock Rate
the frequency at which the clock generator of a processor can generate pulses, which are used to synchronize the operations of its components,[1] and is used as an indicator of the processor's speed.
513MHz DSP, 256MHz ARM® - Height1.4mm
- Length16mm
- Width16mm
- Thickness
Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.
900μm - Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free
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