Texas Instruments TMS320DM647CUT9
Texas Instruments TMS320DM647CUT9
pid_6115965_tms320dm647cut9-texas-instruments-datasheet-41218140.pdf  Pinout Diagram_1
pid_6115965_tms320dm647cut9-texas-instruments-datasheet-41218140.pdf  Pinout Diagram_2
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pid_6115965_tms320dm647cut9-texas-instruments-datasheet-41218140.pdf  Pinout Diagram_4
pid_6115965_tms320dm647cut9-texas-instruments-datasheet-41218140.pdf  Pinout Diagram_5
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Texas Instruments TMS320DM647CUT9

64kB 1.21.83.3V CPLD 529 Pin

Manufacturer No:

TMS320DM647CUT9

Manufacturer:

Texas Instruments

Utmel No:

2502-TMS320DM647CUT9

Package:

529-BFBGA, FCBGA

ECAD Model:

Description:

1.21.83.3V 64kB CPLD TMS320DM64x, DaVinci™ Series 320DM647 529 Pin 900MHz 1.2V 529-BFBGA, FCBGA

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TMS320DM647CUT9 information

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Texas Instruments TMS320DM647CUT9 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments TMS320DM647CUT9.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    NRND (Last Updated: 1 week ago)
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    529-BFBGA, FCBGA
  • Number of Pins
    529
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~90°C TC
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    TMS320DM64x, DaVinci™
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e1
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    4 (72 Hours)
  • Number of Terminations
    520
  • Type
    Fixed Point
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    245
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.2V
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    900MHz
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    320DM647
  • Pin Count

    a count of all of the component leads (or pins)

    529
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.2V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    1.21.83.3V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    Host Interface, I2C, McASP, PCI, SPI, UART
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    1.26V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    1.14V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    64kB
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    320kB
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    32
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    32b
  • Boundary Scan

    Boundary scan is a testing technique used in electronic components to verify the interconnections between integrated circuits on a printed circuit board. It allows for the testing of digital circuits by providing a way to shift data in and out of devices through a serial interface. This method helps in identifying faults such as short circuits, open circuits, and incorrect connections without the need for physical access to the individual components. Boundary scan is commonly used during manufacturing, testing, and debugging processes to ensure the quality and reliability of electronic products.

    YES
  • Low Power Mode

    Low Power Mode is a feature found in electronic components, such as microcontrollers, processors, and devices, that allows them to operate at reduced power consumption levels. When activated, the component typically reduces its clock speed, voltage, or disables certain functions to conserve energy. This mode is often used to extend battery life in portable devices or reduce overall power consumption in energy-efficient systems. Low Power Mode can be triggered automatically based on certain conditions, such as low battery levels, or manually by the user or software. It is a crucial feature in modern electronics to balance performance with energy efficiency.

    YES
  • Integrated Cache

    Integrated Cache refers to a type of memory storage that is built directly into a microprocessor or other electronic component. It is used to temporarily store frequently accessed data and instructions to speed up processing and reduce latency. The integrated cache is designed to provide quick access to data that the processor needs to perform its tasks efficiently. By storing data closer to the processor, the integrated cache helps improve overall system performance by reducing the time it takes to retrieve information from the main memory. The size and speed of the integrated cache can have a significant impact on the performance of the electronic component, making it an important parameter to consider when evaluating the capabilities of a device.

    YES
  • RAM (words)

    RAM (words) is a parameter used to describe the memory capacity of a random access memory (RAM) module in terms of the number of words it can store. In the context of electronic components, a word typically refers to the amount of data that can be processed or stored by the RAM module in a single operation. The RAM (words) specification indicates the total number of words that can be stored in the RAM module, with each word typically consisting of a fixed number of bits. This parameter is important for determining the overall memory capacity and performance of the RAM module in electronic devices.

    8192
  • Voltage - I/O

    Voltage - I/O is a parameter that refers to the voltage levels at the input and output pins of an electronic component, such as an integrated circuit or a semiconductor device. It specifies the range of voltages that the component can accept at its input pins and the voltages it will output at its output pins under normal operating conditions. This parameter is crucial for ensuring proper functionality and compatibility with other components in a circuit. It helps designers determine the appropriate voltage levels to use when interfacing with the component to prevent damage and ensure reliable operation.

    1.8V 3.3V
  • Number of UART Channels
    0
  • Number of Timers
    8
  • ROM Programmability

    ROM Programmability refers to the ability of a Read-Only Memory (ROM) electronic component to be programmed or written with data or instructions during the manufacturing process. Unlike Random-Access Memory (RAM), ROM is non-volatile memory, meaning that the data stored in it is retained even when the power is turned off. ROM programmability allows manufacturers to pre-load specific data or instructions onto the ROM chip before it is integrated into a device, ensuring that the necessary information is readily available for the device's operation. This feature is commonly used in devices such as microcontrollers, embedded systems, and other electronic devices where specific data needs to be permanently stored and accessed.

    MROM
  • Barrel Shifter

    A barrel shifter is a digital circuit component commonly found in computer systems and microprocessors. It is used to shift binary data by a specified number of positions in a parallel manner. The term "barrel shifter" comes from the cylindrical shape of the circuit, which contains multiple shifters arranged in a circular pattern.Barrel shifters are efficient for shifting operations as they can perform shifts of multiple bits in a single clock cycle. They are often used in arithmetic and logic units (ALUs) for tasks such as multiplication, division, and bitwise operations. The flexibility and speed of barrel shifters make them essential for optimizing the performance of digital systems that require fast data manipulation.

    NO
  • Internal Bus Architecture

    The Internal Bus Architecture in electronic components refers to the design and layout of the internal communication pathways within the component. It determines how different parts of the component, such as the processor, memory, and peripherals, communicate with each other. The internal bus architecture includes the data bus, address bus, and control bus, which facilitate the transfer of data and instructions between different components. The efficiency and speed of data transfer within the component are influenced by the design and implementation of the internal bus architecture.

    MULTIPLE
  • Non-Volatile Memory

    Non-Volatile Memory refers to a type of storage technology that retains data even when power is turned off. It is essential for preserving important information in electronic devices, such as computers and smartphones. Common examples of non-volatile memory include Flash memory, EEPROM, and ROM. This characteristic makes non-volatile memory crucial for applications where data integrity and retention are required without a continuous power supply.

    ROM (64kB)
  • Voltage - Core

    Voltage - Core is a parameter that refers to the voltage required to power the core of an electronic component, such as a microprocessor or a graphics processing unit (GPU). The core voltage is essential for the proper functioning of the component, as it provides the necessary power for the core to perform its operations. The voltage level is typically specified by the manufacturer and must be within a certain range to ensure the component operates reliably and efficiently. Monitoring and controlling the core voltage is crucial in maintaining the stability and performance of the electronic component.

    1.20V
  • Length
    19mm
  • Width
    19mm
  • Thickness

    Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

    2.65mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for Texas Instruments TMS320DM647CUT9.

TMS320DM647CUT9 Overview

It is a kind of electronic component that comes in a package of 529-BFBGA, FCBGA.Packaging is provided in the form of Tray.In addition to meeting a wide range of requirements, it is a member of Fixed Point.The machine is mounted in the way of Surface Mount in order to facilitate its operation.By operating the device at the temperature of 0°C~90°C TC, a normal operation is ensured.It refers to the analog voltage range of 1.8V 3.3V that may be input or output.Digital signal processors such as this one are included in the TMS320DM64x, DaVinci™ series.In order to use it, it has 520 terminations.Using 1.2V as the supply voltage, it operates.529 components have pins.The configuration of this board includes 529 pins.The base part number 320DM647 allows identification of a wide range of related parts.Specifically, the device is designed to operate at a frequency of 900MHz.Surface Mount is the method of mounting it.Devices like this can be powered with as little as 1.14V volts.It is capable of receiving a maximum voltage of 1.26V.1.2V is the supply voltage for this device.There is a memory on this device that can store 64kB data.A 1.21.83.3V electric power source is used to power it.Data format and transmission speed can be configured for asynchronous serial communication on 0 UART channels.Industrial environments use 8 timers to provide accurate feedback and event activation.

TMS320DM647CUT9 Features

Supplied in the 529-BFBGA, FCBGA package
Operating supply voltage of 1.2V

TMS320DM647CUT9 Applications

There are a lot of Texas Instruments
TMS320DM647CUT9 DSP applications.


  • Sonar
  • Voice recognition
  • Financial signals
  • Other sensor array processing
  • Spectral density estimation
  • Statistical signal processing
  • Digital image processing, data compression
  • Video coding, audio coding
  • Image compression
  • Signal processing for telecommunications
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