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In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

"Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

the variation of output frequency of a crystal oscillator due to external conditions like temperature variation, voltage variation, output load variation, and frequency aging.

"Termination style" in electronic components refers to the method used to connect the component to a circuit board or other electronic devices. It determines how the component's leads or terminals are designed for soldering or mounting onto the circuit board. Common termination styles include through-hole, surface mount, and wire lead terminations.Through-hole components have leads that are inserted through holes in the circuit board and soldered on the other side. Surface mount components have flat terminals that are soldered directly onto the surface of the circuit board. Wire lead terminations involve attaching wires to the component for connection.The choice of termination style depends on factors such as the type of component, the manufacturing process, and the space available on the circuit board. Different termination styles offer various advantages in terms of ease of assembly, reliability, and space efficiency in electronic designs.

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

the amount of capacitance measured or computed across the crystal terminals on the PCB. Frequency Tolerance. Frequency tolerance refers to the allowable deviation from nominal, in parts per million (PPM), at a specific temperature, usually +25°C.

In the context of electronic components, "Usage" refers to the intended or recommended application or operation of the component within an electronic system. This parameter provides guidance on how the component should be utilized to ensure optimal performance, reliability, and longevity. It may include specifications such as voltage ratings, current ratings, temperature ranges, environmental conditions, and other factors that impact the proper functioning of the component. Understanding and adhering to the usage guidelines provided by the manufacturer is crucial in designing and implementing electronic circuits to prevent damage and ensure the component operates within its specified parameters.

Shelf life in electronic components refers to the duration that a component can remain in storage under recommended conditions without significant degradation in its performance or reliability. It is an important factor for manufacturers and users, as prolonged storage may lead to changes in the material properties or functionality of the component. Typically, shelf life is specified for components such as capacitors, resistors, and semiconductors to ensure they perform as intended when implemented in electronic systems. Proper storage conditions, including temperature and humidity control, are crucial to preserving the shelf life of electronic components.

Adhesive in electronic components refers to materials used to bond various parts together within an electronic assembly. These adhesives can provide structural integrity and durability to components such as circuit boards, connectors, and housing. They may also offer protective properties against environmental factors, such as moisture and heat, and can enhance electrical insulation. The selection of a suitable adhesive is critical to the performance and reliability of the final electronic product.

The parameter "Storage/Refrigeration Temperature" in electronic components refers to the recommended temperature range at which the components should be stored to maintain their integrity and functionality. This parameter indicates the temperature limits within which the components can be safely stored without risking damage or degradation. Storage temperature is crucial for preserving the performance and reliability of electronic components over time, especially for sensitive components such as integrated circuits and semiconductors. Refrigeration temperature may be specified for certain components that require lower temperatures to prevent degradation or prolong shelf life. It is important to adhere to the recommended storage/refrigeration temperature guidelines to ensure the longevity and proper functioning of electronic components.

a group of products which fulfill a similar need for a market segment or market as a whole.

Shelf Life Start refers to the point in time when the shelf life of an electronic component begins. The shelf life is the duration for which a component can be stored under specific conditions and still meet its performance specifications. The Shelf Life Start is typically marked by the date of manufacture or the date when the component is packaged and sealed. It is important to adhere to the specified shelf life guidelines to ensure the reliability and functionality of electronic components, especially in critical applications where performance is crucial.

Backing, Carrier in electronic components refers to a material or structure that provides support or a base for the component. It is often used to enhance the mechanical stability, thermal performance, or electrical properties of the component. The backing or carrier can be made of various materials such as ceramics, metals, or polymers, depending on the specific requirements of the component and its intended application. Overall, the backing or carrier plays a crucial role in ensuring the reliability and functionality of the electronic component.

In electronic components, the parameter "Outline" refers to the physical dimensions and shape of the component. It includes details such as the length, width, height, and overall form of the component. The outline is important for determining how the component will fit into a circuit board or system, as well as for ensuring compatibility with other components and devices. Manufacturers typically provide outline drawings or specifications to help designers and engineers understand the physical characteristics of the component. Paying attention to the outline parameter is crucial for proper installation, assembly, and functionality of electronic components in a circuit or system.

Output formats are used to determine which data is exported and how data is displayed in many areas of OLIB.

a measure of a material's ability to?conduct heat.?

Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance.

a particular group of related products.

Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.