WAGO 742-850

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Parameter "Composition" in electronic components refers to the specific materials and substances used in the construction of the component. It encompasses the chemical and physical elements that make up the component, influencing its electrical, thermal, and mechanical properties. The composition can affect the performance, reliability, and durability of the component in various applications. Understanding the composition is essential for optimizing the design and functionality of electronic devices.

In electronic components, the parameter "Connection Type" refers to the method used to establish an electrical connection between the component and the circuit or system it is being used in. This parameter describes the physical interface or terminal configuration of the component that allows for the flow of electrical signals or power. Common connection types include through-hole, surface mount, wire leads, solder pads, and various types of connectors.The connection type is an important consideration when selecting electronic components as it determines how the component will be mounted or integrated into the circuit board or system. Different connection types have different advantages and limitations in terms of ease of assembly, reliability, space requirements, and electrical performance. Understanding the connection type of a component is crucial for proper installation and ensuring the overall functionality and performance of the electronic system.

Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.