

Zilog Z8523020PSC
Interface 2.54mm 5V Specialized Interface IC 40 Pin
Manufacturer No:
Z8523020PSC
Tiny WHSLManufacturer:
Utmel No:
1276-Z8523020PSC
Package:
40-DIP (0.620, 15.75mm)
Description:
2.54mm 5V Specialized Interface IC Z85230 40 Pin 20MHz 5V 40-DIP (0.620, 15.75mm)
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In Stock : 10
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- TypeParameter
- Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Through Hole - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Through Hole - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
40-DIP (0.620, 15.75mm) - Number of Pins40
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tube - Published2009
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e0 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
no - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Obsolete - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Number of Terminations40
- Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Tin/Lead (Sn/Pb) - Max Operating Temperature
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
70°C - Min Operating Temperature
The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.
0°C - Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO - HTS Code
HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.
8542.31.00.01 - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
4.5V~5.5V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
NOT SPECIFIED - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
5V - Terminal Pitch
The center distance from one pole to the next.
2.54mm - Frequency
In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.
20MHz - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
NOT SPECIFIED - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
Z85230 - Pin Count
a count of all of the component leads (or pins)
40 - Qualification Status
An indicator of formal certification of qualifications.
Not Qualified - Power Supplies
an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?
5V - Temperature Grade
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
COMMERCIAL - Interface
In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.
Bus - uPs/uCs/Peripheral ICs Type
The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL - Access Time
Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.
20 μs - Address Bus Width
A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.
1 - Boundary Scan
Boundary scan is a testing technique used in electronic components to verify the interconnections between integrated circuits on a printed circuit board. It allows for the testing of digital circuits by providing a way to shift data in and out of devices through a serial interface. This method helps in identifying faults such as short circuits, open circuits, and incorrect connections without the need for physical access to the individual components. Boundary scan is commonly used during manufacturing, testing, and debugging processes to ensure the quality and reliability of electronic products.
NO - Low Power Mode
Low Power Mode is a feature found in electronic components, such as microcontrollers, processors, and devices, that allows them to operate at reduced power consumption levels. When activated, the component typically reduces its clock speed, voltage, or disables certain functions to conserve energy. This mode is often used to extend battery life in portable devices or reduce overall power consumption in energy-efficient systems. Low Power Mode can be triggered automatically based on certain conditions, such as low battery levels, or manually by the user or software. It is a crucial feature in modern electronics to balance performance with energy efficiency.
NO - External Data Bus Width
The External Data Bus Width refers to the number of bits that can be transmitted simultaneously between a microprocessor and external components, such as memory or peripherals. It determines the amount of data that can be transferred in a single clock cycle. A wider data bus allows for faster data transfer rates and can improve overall system performance. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with larger widths generally offering higher throughput but requiring more complex circuitry. The External Data Bus Width is an important parameter to consider when designing or evaluating electronic components to ensure compatibility and optimal performance.
8 - RAM (words)
RAM (words) is a parameter used to describe the memory capacity of a random access memory (RAM) module in terms of the number of words it can store. In the context of electronic components, a word typically refers to the amount of data that can be processed or stored by the RAM module in a single operation. The RAM (words) specification indicates the total number of words that can be stored in the RAM module, with each word typically consisting of a fixed number of bits. This parameter is important for determining the overall memory capacity and performance of the RAM module in electronic devices.
0 - Number of Serial I/Os2
- Data Transfer Rate-Max
The parameter "Data Transfer Rate-Max" in electronic components refers to the maximum rate at which data can be transferred between different devices or components within a system. It is typically measured in bits per second (bps) or bytes per second (Bps) and indicates the peak speed at which data can be transmitted. This parameter is crucial for determining the overall performance and efficiency of a system, especially in applications where high-speed data transfer is essential, such as in networking equipment, storage devices, and communication systems. Manufacturers often specify the Data Transfer Rate-Max to help users understand the capabilities and limitations of the component when it comes to transferring data quickly and reliably.
0.625 MBps - Communication Protocol
In electronic components, the communication protocol refers to a set of rules and conventions that devices use to exchange information with each other. It defines the format, timing, sequencing, and error checking of data transmission between devices. Different communication protocols are used for various applications, such as serial communication (e.g., UART, SPI, I2C) and network communication (e.g., Ethernet, Wi-Fi, Bluetooth). Choosing the appropriate communication protocol is crucial for ensuring compatibility and reliable data transfer between electronic components in a system.
ASYNC, BIT; SYNC, HDLC; SYNC, SDLC; BISYNC - Data Encoding/Decoding Method
Data Encoding/Decoding Method in electronic components refers to the process of converting data from one format to another for transmission or storage purposes. This method involves encoding the data into a specific format before transmission and decoding it back to its original form upon reception. The encoding process typically involves converting the data into a series of bits or symbols that can be easily transmitted over a communication channel. Common encoding methods include techniques such as Manchester encoding, NRZ (Non-Return-to-Zero) encoding, and differential encoding. Decoding, on the other hand, involves reversing the encoding process to retrieve the original data from the received signals. The choice of data encoding/decoding method can impact factors such as data transmission speed, error detection, and compatibility with different communication protocols.
NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) - Length52.325mm
- Height Seated (Max)
Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.
4.24mm - Width15.24mm
- RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
Non-RoHS Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Contains Lead