Advanced Thermal Solutions Inc. ATS-02H-206-C1-R0

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

Package Cooled refers to a type of thermal management in electronic components where the device packaging is designed to dissipate heat efficiently. This involves integrating cooling features such as heat sinks or specialized materials that enhance heat transfer away from the component. The goal is to maintain optimal operating temperatures and improve reliability and performance of the electronic device. It is commonly used in high-power applications where excessive heat generation can affect functionality.

Material Finish in electronic components refers to the surface treatment applied to the component to enhance its performance, durability, and reliability. The finish can protect the component from environmental factors such as moisture, corrosion, and mechanical stress. Common material finishes include gold plating, tin plating, silver plating, and organic coatings. The choice of material finish depends on the specific requirements of the application, such as conductivity, solderability, and cost-effectiveness. Proper material finish selection is crucial to ensure the long-term functionality and quality of electronic components.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

The attachment method in electronic components refers to the technique used to connect a component to a circuit board or assembly. This can include methods such as soldering, bonding, or using connectors. The choice of attachment method can affect the reliability, performance, and manufacturability of the electronic device. Different methods may be suited for specific applications based on factors like mechanical stress, thermal conductivity, and ease of assembly.

The parameter "Height Off Base (Height of Fin)" in electronic components refers to the distance between the base of the component and the top of any fins or protrusions on the component. This measurement is important for determining the overall dimensions and clearance requirements of the component within a circuit or system. It helps in ensuring proper fit and alignment of the component during installation and assembly. Manufacturers provide this specification to assist designers and engineers in selecting the appropriate components for their applications based on the available space and mechanical constraints.

Thermal Resistance @ Forced Air Flow is a measure of how effectively an electronic component can dissipate heat when subjected to airflow. It quantifies the resistance to heat transfer from the component to the surrounding air in scenarios where forced ventilation is employed, such as with fans. This parameter is crucial for evaluating thermal performance, as it impacts the component's operating temperature and reliability under conditions of active cooling. Lower thermal resistance values indicate better heat dissipation capabilities, essential for maintaining optimal performance in high-power applications.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.