ALTERA 5CSEMA6U23I7N
ALTERA 5CSEMA6U23I7N
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ALTERA 5CSEMA6U23I7N

SoC Cyclone® V SE Series System On Chip

Manufacturer No:

5CSEMA6U23I7N

Manufacturer:

ALTERA

Utmel No:

117-5CSEMA6U23I7N

Package:

672-FBGA

ECAD Model:

Description:

-40°C ~ 100°C (TJ) 5CSEMA6 System On Chip Cyclone® V SE Series

Quantity:

Unit Price: $286.671183

Ext Price: $286.67

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 2674

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $286.671183

    $286.67

  • 10

    $270.444512

    $2,704.45

  • 100

    $255.136332

    $25,513.63

  • 500

    $240.694653

    $120,347.33

  • 1000

    $227.070427

    $227,070.43

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User Guide

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
5CSEMA6U23I7N information

Specifications
Product Details
ALTERA 5CSEMA6U23I7N technical specifications, attributes, parameters and parts with similar specifications to ALTERA 5CSEMA6U23I7N.
  • Type
    Parameter
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    672-FBGA
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    672-UBGA (23x23)
  • Number of I/Os
    MCU - 181, FPGA - 145
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 100°C (TJ)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Cyclone® V SE
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    5CSEMA6
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    800MHz
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    64KB
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    DMA, POR, WDT
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture

    In electronic components, the parameter "Architecture" refers to the overall design and structure of the component. It encompasses the arrangement of internal components, the layout of circuitry, and the physical form of the component. The architecture of an electronic component plays a crucial role in determining its functionality, performance, and compatibility with other components in a system. Different architectures can result in variations in power consumption, speed, size, and other key characteristics of the component. Designers often consider the architecture of electronic components carefully to ensure optimal performance and integration within a larger system.

    MCU, FPGA
  • Primary Attributes

    Primary attributes in electronic components refer to the essential characteristics that define the performance and functionality of the component. These attributes typically include parameters such as voltage rating, current rating, resistance, capacitance, and power dissipation. Understanding these primary attributes is crucial for selecting the appropriate component for specific applications and ensuring reliable operation within the desired electrical specifications.

    FPGA - 110K Logic Elements
  • Flash Size

    Flash size refers to the amount of non-volatile memory available in an electronic component, typically measured in bytes, kilobytes, megabytes, or gigabytes. It determines how much data or instructions can be stored permanently even when power is removed. Flash memory is commonly used in devices such as microcontrollers, smartphones, USB drives, and solid-state drives to store firmware, applications, and user data. The flash size can significantly impact the functionality and performance of a device, influencing how many applications can be installed or how much data can be retained.

    --
0 Similar Products Remaining

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).

A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is embedded in this SoC.It has been assigned a package 672-FBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Cyclone® V SE is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C ~ 100°C (TJ) on a regular basis.This SoC security combines FPGA - 110K Logic Elements and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This flash has a size of --.5CSEMA6 can help you find system on chips with similar specs and purposes.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.

64KB RAM.
Built on MCU, FPGA.
-- extended flash.

There are a lot of ALTERA

5CSEMA6U23I7N System On Chip (SoC) applications.


  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare