ALTERA 5SGSED8N3F45I3L
ALTERA 5SGSED8N3F45I3L
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ALTERA 5SGSED8N3F45I3L

FPGAs Stratix® V GS FPGAs

Manufacturer No:

5SGSED8N3F45I3L

Manufacturer:

ALTERA

Utmel No:

117-5SGSED8N3F45I3L

Package:

1932-BBGA, FCBGA

ECAD Model:

Description:

FPGAs Stratix® V GS Series 1932-BBGA, FCBGA 1 mm mm

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5SGSED8N3F45I3L information

Specifications
Product Details
ALTERA 5SGSED8N3F45I3L technical specifications, attributes, parameters and parts with similar specifications to ALTERA 5SGSED8N3F45I3L.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    1932-BBGA, FCBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    1932-FBGA, FC (45x45)
  • Number of Terminals
    1932
  • Ihs Manufacturer
    INTEL CORP
  • Manufacturer
    Intel Corporation
  • Manufacturer Part Number
    5SGSED8N3F45I3L
  • Number of I/Os
    840
  • Operating Temperature-Max
    100 °C
  • Operating Temperature-Min
    -40 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    BGA
  • Package Description
    BGA, BGA1932,44X44,40
  • Package Equivalence Code
    BGA1932,44X44,40
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY
  • Part Life Cycle Code
    End Of Life
  • Risk Rank
    5.3
  • Rohs Code
    No
  • Supply Voltage-Max
    0.88 V
  • Supply Voltage-Min
    0.82 V
  • Supply Voltage-Nom
    0.85 V
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 100°C (TJ)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Stratix® V GS
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    CMOS
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    0.82 V ~ 0.88 V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    compliant
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    5SGSED8
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PBGA-B1932
  • Number of Outputs
    840
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    0.85,1.5,2.5,2.5/3,1.2/3 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Number of Inputs
    840
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    26240 CLBS
  • Seated Height-Max

    Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.

    3.9 mm
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    695000
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    60968960
  • Number of LABs/CLBs
    262400
  • Number of CLBs
    26240
  • Number of Logic Cells

    An FPGA contains a large number of logic cells. Each logic cell can be configured to implement a certain set of functions. Each logic cell has a fixed number of inputs and outputs. Flip-flop can be incorporated into a multiplexer-based logic module to implement sequential logic.

    695000
  • Length
    45 mm
  • Width
    45 mm
0 Similar Products Remaining

5SGSED8N3F45I3L Overview

In the 1932-BBGA, FCBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. To form a fundamental building block, there are 695000 logic elements/cells. FPGA parts like this belong to the Field Programmable Gate Arrays family. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.82 V ~ 0.88 V-volt supply voltage required for the device to operate. The Stratix® V GS Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C ~ 100°C (TJ) when operating. A total of 840 outputs are incorporated into this device. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 60968960 bFpga chipss. You can find related parts by using the part number 5SGSED8, which is its base part number. A total of 262400 LABs/CLBs are included in this FPGA. There is a 0.85,1.5,2.5,2.5/3,1.2/3 V power supply that is required to operate it. For its architecture, 26240 CLB modules are used. During the construction of the building block, there are 695000 logic cells used. Its supplier package is called 1932-FBGA, FC (45x45). Fpga circuit can be configured using 1932 terminals, each of which has fpga circuits own functions.

5SGSED8N3F45I3L Features

Up to 60968960 RAM bits

5SGSED8N3F45I3L Applications

There are a lot of ALTERA
5SGSED8N3F45I3L FPGAs applications.


  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense