ALTERA EP1C20F324C8N
ALTERA EP1C20F324C8N
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ALTERA EP1C20F324C8N

FPGAs General Purpose Thick Film 275.03 MHz MHz FPGAs

Manufacturer No:

EP1C20F324C8N

Manufacturer:

ALTERA

Utmel No:

117-EP1C20F324C8N

Package:

324-BGA

ECAD Model:

Description:

1.5 V V 36 kB B FPGAs General Purpose Thick Film Series 275.03 MHz MHz 324-BGA 1 mm mm

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DHLTNTUPSFedExSF-Express

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In Stock : 1680

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
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EP1C20F324C8N information

Specifications
Product Details
ALTERA EP1C20F324C8N technical specifications, attributes, parameters and parts with similar specifications to ALTERA EP1C20F324C8N.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    324-BGA
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    324
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    324-FBGA (19x19)
  • Number of Terminals
    324
  • Voltage, Rating
    50 V
  • Case Code - in
    0402
  • Case Code - mm
    1005
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 155 C
  • Minimum Operating Temperature
    - 55 C
  • Factory Pack QuantityFactory Pack Quantity
    10000
  • Mounting Styles
    PCB Mount
  • Manufacturer
    Royalohm
  • Brand
    Royalohm
  • RoHS
    Details
  • Number of I/Os
    233
  • Schedule B
    8542390000
  • Number of Macrocells
    20060
  • Package Description
    19 X 19 MM, 1.0 MM PITCH, FBGA-324
  • Package Style
    GRID ARRAY
  • Moisture Sensitivity Levels
    3
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA324,18X18,40
  • Supply Voltage-Nom
    1.5 V
  • Reflow Temperature-Max (s)
    40
  • Supply Voltage-Min
    1.425 V
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    EP1C20F324C8N
  • Clock Frequency-Max
    275 MHz
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Part Life Cycle Code
    Transferred
  • Samacsys Description
    Cyclone Devices
  • Ihs Manufacturer
    ALTERA CORP
  • Supply Voltage-Max
    1.575 V
  • Risk Rank
    3.13
  • Part Package Code
    BGA
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    General Purpose Thick Film
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C ~ 85°C (TJ)
  • Tolerance

    In electronic components, "tolerance" refers to the acceptable deviation or variation from the specified or ideal value of a particular parameter, such as resistance, capacitance, or voltage. It indicates the range within which the actual value of the component can fluctuate while still being considered acceptable for use in a circuit. Tolerance is typically expressed as a percentage or a specific value and is important for ensuring the accuracy and reliability of electronic devices. Components with tighter tolerances are more precise but may also be more expensive. It is crucial to consider tolerance when selecting components to ensure proper functionality and performance of the circuit.

    1 %
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e1
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    Yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Last Time Buy
  • Termination

    Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

    SMD/SMT
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A991
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    100 PPM / C
  • Resistance

    Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.

    1.27 Ohms
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Silver/Copper (Sn/Ag/Cu)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85 °C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    0 °C
  • Applications

    The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

    General Purpose
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Subcategory
    Resistors
  • Power Rating

    The "Power Rating" of an electronic component refers to the maximum amount of power that the component can handle or dissipate without being damaged. It is typically measured in watts and is an important specification to consider when designing or selecting components for a circuit. Exceeding the power rating of a component can lead to overheating, malfunction, or even permanent damage. It is crucial to ensure that the power rating of each component in a circuit is sufficient to handle the power levels expected during normal operation to maintain the reliability and longevity of the electronic system.

    62.5 mW (1/16 W)
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    Thick Film
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.425 V ~ 1.575 V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    unknown
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    275.03 MHz
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    EP1C20
  • Pin Count

    a count of all of the component leads (or pins)

    324
  • Termination Style

    "Termination style" in electronic components refers to the method used to connect the component to a circuit board or other electronic devices. It determines how the component's leads or terminals are designed for soldering or mounting onto the circuit board. Common termination styles include through-hole, surface mount, and wire lead terminations.Through-hole components have leads that are inserted through holes in the circuit board and soldered on the other side. Surface mount components have flat terminals that are soldered directly onto the surface of the circuit board. Wire lead terminations involve attaching wires to the component for connection.The choice of termination style depends on factors such as the type of component, the manufacturing process, and the space available on the circuit board. Different termination styles offer various advantages in terms of ease of assembly, reliability, and space efficiency in electronic designs.

    SMD/SMT
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PBGA-B324
  • Number of Outputs
    233
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.5 V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    1.5,1.5/3.3 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    1.575 V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    1.425 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    36 kB
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    36 kB
  • Number of Inputs
    301
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    20060 CLBS
  • Seated Height-Max

    Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.

    2.2 mm
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    20060
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Thick Film Resistors
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    294912
  • Max Frequency

    Max Frequency refers to the highest frequency at which an electronic component can operate effectively without degradation of performance. It is a critical parameter for devices such as transistors, capacitors, and oscillators, indicating their limitations in speed and response time. Exceeding the max frequency can lead to issues like signal distortion, heat generation, and potential failure of the component. Understanding this parameter is essential for designing circuits to ensure reliable and efficient operation.

    250 MHz
  • Number of LABs/CLBs
    2006
  • Number of Logic Blocks (LABs)
    2006
  • Number of CLBs
    20060
  • Number of Logic Cells

    An FPGA contains a large number of logic cells. Each logic cell can be configured to implement a certain set of functions. Each logic cell has a fixed number of inputs and outputs. Flip-flop can be incorporated into a multiplexer-based logic module to implement sequential logic.

    20060
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    Wrap-Around Termination
  • Product Category

    a particular group of related products.

    Thick Film Resistors - SMD
  • Width
    0.5 mm
  • Height
    0.35 mm
  • Length
    1 mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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EP1C20F324C8N Overview

In the 324-BGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. To form a fundamental building block, there are 20060 logic elements/cells. FPGA parts like this belong to the Resistors family. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.425 V ~ 1.575 V-volt supply voltage required for the device to operate. The General Purpose Thick Film Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within 0°C ~ 85°C (TJ) when operating. A total of 233 outputs are incorporated into this device. Unlike other FPGA models, this one is contained in Reel for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 294912 bFpga chipss. You can find related parts by using the part number EP1C20, which is its base part number. It is crucial that the RAM si36 kBe of this FPGA module reaches 36 kB so that the program can run normally. In order to make it work, 324 pins have been designed. A total of 2006 LABs/CLBs are included in this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Its flexibility is fully utilized when operated with a supply voltage of 1.5 V. There is a 1.5,1.5/3.3 V power supply that is required to operate it. As a result of the design of this module, the maximum operating temperature reaches 85 °C. There should be a temperature difference between 0 °C and the operating temperature. With a total of 324 pins, it is equipped with a high level of security. A basic building block of this system consists of 2006 logic blocks (LABs). For storing programs and data, this FPGA module embeds memory 36 kB. For its architecture, 20060 CLB modules are used. The high efficiency of this device is provided by its 275.03 MHz-frequency operation. Fpga semiconductor can accept a maximum voltage of 1.575 V volts as a supply voltage. A minimal supply voltage of 1.425 V is required for it to operate. It is possible to achieve a speed of up to 250 MHz with this FPGA. During the construction of the building block, there are 20060 logic cells used. Its supplier package is called 324-FBGA (19x19). Fpga circuit can be configured using 324 terminals, each of which has fpga circuits own functions.

EP1C20F324C8N Features

Up to 294912 RAM bits
324 LABs/CLBs
85 °C gates
2006 logic blocks (LABs)
Operating from a frequency of 275.03 MHz

EP1C20F324C8N Applications

There are a lot of ALTERA
EP1C20F324C8N FPGAs applications.


  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
EP1C20F324C8N Relevant information

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