AMD XAAU10P-L1SBVB484I
AMD XAAU10P-L1SBVB484I
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AMD XAAU10P-L1SBVB484I

FPGAs Artix? UltraScale+ FPGAs

Manufacturer No:

XAAU10P-L1SBVB484I

Manufacturer:

AMD

Utmel No:

126-XAAU10P-L1SBVB484I

Package:

484-BFBGA, FCBGA

ECAD Model:

Description:

FPGAs Artix? UltraScale+ Series 484-BFBGA, FCBGA

Quantity:

Unit Price: $146.117837

Ext Price: $146.12

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 2553

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $146.117837

    $146.12

  • 10

    $137.847016

    $1,378.47

  • 100

    $130.044355

    $13,004.44

  • 500

    $122.683354

    $61,341.68

  • 1000

    $115.739013

    $115,739.01

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Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
XAAU10P-L1SBVB484I information

Specifications
Product Details
AMD XAAU10P-L1SBVB484I technical specifications, attributes, parameters and parts with similar specifications to AMD XAAU10P-L1SBVB484I.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    484-BFBGA, FCBGA
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    484-FCBGA (19x19)
  • Mfr
    AMD
  • Number of I/Os
    204
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Artix? UltraScale+
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 100°C (TJ)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    0.698V ~ 0.742V
  • Number of Logic Elements/Cells
    96250
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    3670016
  • Number of LABs/CLBs
    5500
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XAAU10P-L1SBVB484I Overview

There is a 484-BFBGA, FCBGA package that includes this component. A fundamental building block consists of 96250 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 0.698V ~ 0.742V is needed in order for fpga chips to operate. As part of the Artix? UltraScale+ series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of -40°C ~ 100°C (TJ). As a space-saving measure, this FPGA model is contained within Tray. There are 3670016 RAM bits that are available with this device. 5500 LABs and CLBs are built into this FPGA. There is a device package provided by 484-FCBGA (19x19) as its supplier.

XAAU10P-L1SBVB484I Features

Up to 3670016 RAM bits

XAAU10P-L1SBVB484I Applications

There are a lot of AMD
XAAU10P-L1SBVB484I FPGAs applications.


  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
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