AMD XC2S100-5FG256C
AMD XC2S100-5FG256C
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AMD XC2S100-5FG256C

FPGAs MIL-DTL-38999 Series III, Tri-Start™ TV FPGAs

Manufacturer No:

XC2S100-5FG256C

Manufacturer:

AMD

Utmel No:

126-XC2S100-5FG256C

Package:

256-BGA

ECAD Model:

Description:

FPGAs MIL-DTL-38999 Series III, Tri-Start™ TV Series 256-BGA

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XC2S100-5FG256C information

Specifications
Product Details
AMD XC2S100-5FG256C technical specifications, attributes, parameters and parts with similar specifications to AMD XC2S100-5FG256C.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Free Hanging (In-Line)
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    256-BGA
  • Mounting Feature

    a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

    -
  • Shell Material

    The "Shell Material" parameter in electronic components refers to the material used to encase or cover the internal components of the device. This material is chosen based on various factors such as durability, heat resistance, electrical insulation properties, and environmental considerations. Common shell materials include plastics, metals, and ceramics, each offering different levels of protection and performance characteristics. The choice of shell material can impact the overall reliability, safety, and functionality of the electronic component in different operating conditions.

    Composite
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    256-FBGA (17x17)
  • Insert Material

    The parameter "Insert Material" in electronic components refers to the specific material used to create the insert portions of connectors or other components that facilitate assembly or enhance performance. This material is chosen for its electrical, thermal, and mechanical properties, which can influence the overall functionality and reliability of the component in its intended application. Common insert materials include plastics, ceramics, and metals, each selected based on the requirements of the environment in which the component will operate.

    Thermoplastic
  • Backshell Material, Plating

    Backshell Material, Plating refers to the material and plating used in the backshell of electronic components. The backshell is a protective covering or housing that is typically located at the rear end of a connector or cable assembly. The material and plating used in the backshell are chosen based on factors such as durability, conductivity, corrosion resistance, and compatibility with the surrounding environment. Common materials used for backshells include aluminum, stainless steel, and plastic, while plating options may include nickel, zinc, or gold to provide additional protection and improve electrical performance. The choice of backshell material and plating is crucial in ensuring the reliability and longevity of electronic components in various applications.

    -
  • Voltage, Rating
    -
  • Package
    Bulk
  • Primary Material
    Composite
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    CTV06RW
  • Mfr
    Amphenol Aerospace Operations
  • Product Status
    Active
  • Contact Materials
    Copper Alloy
  • Contact Finish Mating
    Gold
  • Number of I/Os
    176
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -65°C ~ 175°C
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    MIL-DTL-38999 Series III, Tri-Start™ TV
  • Termination

    Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

    Crimp
  • Connector Type

    Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

    Plug, Female Sockets
  • Number of Positions
    5
  • Color
    Olive Drab
  • Applications

    The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

    Aviation, Marine, Military
  • Fastening Type

    There are 5 Main Types of Fastening Type: Screws, Nails, Bolts, Anchors, Rivets.

    Threaded
  • Current Rating (Amps)

    The parameter "Current Rating (Amps)" in electronic components refers to the maximum amount of electrical current that the component can safely handle without being damaged. It is typically measured in amperes (A) and is an important specification to consider when designing or selecting components for a circuit. Exceeding the current rating of a component can lead to overheating, malfunction, or even failure of the component. It is crucial to ensure that the current rating of a component matches the requirements of the circuit to prevent any potential issues and ensure reliable operation.

    -
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    2.375V ~ 2.625V
  • Orientation

    In electronic components, the parameter "Orientation" refers to the specific alignment or positioning of the component with respect to its intended installation or operation. This parameter is crucial for ensuring proper functionality and performance of the component within a circuit or system. Orientation may include factors such as the physical orientation of the component on a circuit board, the direction of current flow through the component, or the alignment of specific features or terminals for correct connection. Manufacturers often provide orientation guidelines in datasheets or technical specifications to help users correctly install and use the component. Paying attention to the orientation of electronic components is essential to prevent errors, ensure reliability, and optimize the overall performance of electronic devices.

    C
  • Shielding

    Shielding in electronic components refers to the practice of enclosing or surrounding sensitive electronic circuits or components with a conductive material to protect them from electromagnetic interference (EMI) or radio frequency interference (RFI). The shielding material acts as a barrier that blocks or absorbs unwanted electromagnetic signals, preventing them from affecting the performance of the electronic device. Shielding can be achieved using materials such as metal enclosures, conductive coatings, or shielding tapes. Proper shielding is essential in electronic design to ensure the reliable operation of electronic devices in environments where electromagnetic interference is present.

    Shielded
  • Ingress Protection

    Ingress Protection rating (or just IP rating), is an international standard (IEC 60529) used to rate the degree of protection or sealing effectiveness in electrical enclosures against intrusion of objects, water, dust or accidental contact. It corresponds to the European standard EN 60529.

    Environment Resistant
  • Shell Finish

    Shell Finish in electronic components refers to the surface treatment or coating applied to the outer shell or casing of the component. This finish is designed to provide protection against environmental factors such as moisture, dust, and corrosion, as well as to enhance the component's appearance. Common types of shell finishes include nickel plating, anodizing, powder coating, and epoxy resin coating. The choice of shell finish depends on the specific requirements of the component, such as the operating environment, durability needs, and aesthetic considerations.

    Olive Drab Cadmium
  • Shell Size - Insert

    The parameter "Shell Size - Insert" in electronic components refers to the physical size of the connector shell or housing that holds the insert or contact arrangement within the component. The shell size is typically specified by a numerical designation that corresponds to a specific size and configuration of the connector. This parameter is important for ensuring compatibility and proper fit between different components or devices that use the same type of connector. Manufacturers provide detailed specifications for shell size to help users select the appropriate connector for their specific application requirements.

    11-5
  • Shell Size, MIL

    The parameter "Shell Size, MIL" in electronic components refers to the physical size of the component's outer shell or housing, measured in thousandths of an inch (mil). It is a standardized measurement used to ensure compatibility and interchangeability of components within a specific series or family. The shell size typically includes dimensions such as diameter, length, and overall shape of the component, and is important for determining how the component will fit into a system or assembly. Manufacturers provide shell size information to help users select the appropriate components for their specific application requirements.

    -
  • Cable Opening

    Cable Opening in electronic components refers to the physical opening or port through which a cable can be connected to the component. This opening is designed to accommodate the specific type and size of cable that is intended to be used with the component. The cable opening is an important feature as it allows for the secure and proper connection of the cable to the component, ensuring reliable data or power transmission. It is essential to match the cable opening size and type with the corresponding cable to prevent any compatibility issues and to maintain the integrity of the connection.

    -
  • Number of Logic Elements/Cells
    2700
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    40960
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    100000
  • Number of LABs/CLBs
    600
  • Speed Grade

    Speed grade is a specification in electronic components that indicates the maximum operating speed at which the component can reliably function. It is commonly used for integrated circuits, particularly in digital logic devices and programmable logic devices. The speed grade is typically denoted by a number or letter code that correlates to the maximum frequency or propagation delay of the device, influencing its performance in high-speed applications. Components with higher speed grades are capable of faster processing and lower signal delay compared to those with lower grades.

    5
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    Coupling Nut, Self Locking
  • Contact Finish Thickness - Mating

    Contact Finish Thickness - Mating is a parameter in electronic components that refers to the thickness of the plating or finish on the contact surfaces of a connector or terminal that come into direct contact with mating components. This parameter is crucial for ensuring proper electrical conductivity and mechanical stability during mating and unmating processes. The contact finish thickness affects the overall reliability and performance of the connection by influencing factors such as contact resistance, wear resistance, and corrosion resistance. Manufacturers specify this parameter to ensure compatibility and optimal performance in various applications.

    50.0µin (1.27µm)
  • Material Flammability Rating

    The Material Flammability Rating is a parameter used to indicate the flammability characteristics of materials used in electronic components. It is typically measured according to standards such as UL94, which classifies materials into different categories based on their flammability properties. The rating helps in assessing the fire safety of electronic devices and components, as materials with higher flammability ratings are more resistant to ignition and combustion. Manufacturers often specify the Material Flammability Rating of their components to ensure compliance with safety regulations and standards. It is important to consider this parameter when designing and selecting electronic components to minimize fire hazards and ensure the overall safety of the end product.

    -
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XC2S100-5FG256C Overview

A 256-BGA package contains it, and it is available for download. A fundamental building block contains 2700 logic elements or cells. The Free Hanging (In-Line)-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 2.375V ~ 2.625V and uses a battery to supply power. FPGAs belonging to the MIL-DTL-38999 Series III, Tri-Start™ TV series are a type of FPGA that belong to the MIL-DTL-38999 Series III, Tri-Start™ TV series of FPGAs. Operating temperatures should be maintained within the -65°C ~ 175°C range at all times when the unit is in use. Having a RAM bit size of 40960 means that this device will offer you a lot of memory. 600 LABs/CLBs are integrated into this FPGA. 100000 gates make up the basic block of its construction. There is a device package provided by 256-FBGA (17x17), which is the supplier.

XC2S100-5FG256C Features

Up to 40960 RAM bits

XC2S100-5FG256C Applications

There are a lot of AMD
XC2S100-5FG256C FPGAs applications.


  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems