AMD XC5VLX50-2FFG1153C
AMD XC5VLX50-2FFG1153C
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AMD XC5VLX50-2FFG1153C

FPGAs Virtex®-5 LX FPGAs

Manufacturer No:

XC5VLX50-2FFG1153C

Manufacturer:

AMD

Utmel No:

126-XC5VLX50-2FFG1153C

Package:

1153-BBGA, FCBGA

ECAD Model:

Description:

FPGAs Virtex®-5 LX Series 1153-BBGA, FCBGA

Quantity:

Unit Price: $1,028.980609

Ext Price: $1,028.98

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 690

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $1,028.980609

    $1,028.98

  • 10

    $995.145657

    $9,951.46

  • 25

    $988.228060

    $24,705.70

  • 50

    $981.358550

    $49,067.93

  • 100

    $961.173899

    $96,117.39

  • 500

    $892.454873

    $446,227.44

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
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XC5VLX50-2FFG1153C information

Specifications
Product Details
AMD XC5VLX50-2FFG1153C technical specifications, attributes, parameters and parts with similar specifications to AMD XC5VLX50-2FFG1153C.
  • Type
    Parameter
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    1153-BBGA, FCBGA
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    1153-FCBGA (35x35)
  • Product Status
    Active
  • Mfr
    AMD
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    XC5VLX50
  • Package
    Tray
  • Number of I/Os
    560
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Virtex®-5 LX
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C ~ 85°C (TJ)
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    0.95V ~ 1.05V
  • Number of Logic Elements/Cells
    46080
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    1769472
  • Number of LABs/CLBs
    3600
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XC5VLX50-2FFG1153C Overview

Fpga chips is supplied in the 1153-BBGA, FCBGA package. There are 46080 logic elements/cells to form a fundamental building block. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 0.95V ~ 1.05V. It is a type of FPGA belonging to the Virtex®-5 LX seies. The operating temperature should be kept at 0°C ~ 85°C (TJ) when operating. The RAM bits that this device offer is 1769472. This FPGA is built as an array of 3600 LABs/CLBs. It employs 1153-FCBGA (35x35) as its supplier device package.

XC5VLX50-2FFG1153C Features

Up to 1769472 RAM bits

XC5VLX50-2FFG1153C Applications

There are a lot of AMD
XC5VLX50-2FFG1153C FPGAs applications.


  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
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