AMD XC6VLX130T-1FF1156I
AMD XC6VLX130T-1FF1156I
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AMD XC6VLX130T-1FF1156I

FPGAs Virtex®-6 LXT FPGAs

Manufacturer No:

XC6VLX130T-1FF1156I

Manufacturer:

AMD

Utmel No:

126-XC6VLX130T-1FF1156I

Package:

1156-BBGA, FCBGA

ECAD Model:

Description:

FPGAs Virtex®-6 LXT Series 1156-BBGA, FCBGA

Quantity:

Unit Price: $2,462.742199

Ext Price: $2,462.74

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 590

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $2,462.742199

    $2,462.74

  • 10

    $2,381.762281

    $23,817.62

  • 25

    $2,365.205840

    $59,130.15

  • 50

    $2,348.764489

    $117,438.22

  • 100

    $2,300.454935

    $230,045.49

  • 500

    $2,135.984155

    $1,067,992.08

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
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XC6VLX130T-1FF1156I information

Specifications
Product Details
AMD XC6VLX130T-1FF1156I technical specifications, attributes, parameters and parts with similar specifications to AMD XC6VLX130T-1FF1156I.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    1156-BBGA, FCBGA
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    1156-FCBGA (35x35)
  • Number of I/Os
    600
  • Package
    Tray
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    XC6VLX130
  • Mfr
    AMD
  • Product Status
    Active
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 100°C (TJ)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Virtex®-6 LXT
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    0.95V ~ 1.05V
  • Number of Logic Elements/Cells
    128000
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    9732096
  • Number of LABs/CLBs
    10000
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XC6VLX130T-1FF1156I Overview

In the 1156-BBGA, FCBGA package, you will find fpga chips. To form a fundamental building block, there are 128000 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.95V ~ 1.05V-volt supply voltage required for the device to operate. The Virtex®-6 LXT Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C ~ 100°C (TJ) when operating. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 9732096 bFpga chipss. A total of 10000 LABs/CLBs are included in this FPGA. Its supplier package is called 1156-FCBGA (35x35).

XC6VLX130T-1FF1156I Features

Up to 9732096 RAM bits

XC6VLX130T-1FF1156I Applications

There are a lot of AMD
XC6VLX130T-1FF1156I FPGAs applications.


  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense