AMD XC7K325T-3FBG676E
AMD XC7K325T-3FBG676E
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AMD XC7K325T-3FBG676E

FPGAs Kintex®-7 FPGAs

Manufacturer No:

XC7K325T-3FBG676E

Manufacturer:

AMD

Utmel No:

126-XC7K325T-3FBG676E

Package:

676-BBGA, FCBGA

ECAD Model:

Description:

1GB B FPGAs Kintex®-7 Series 676-BBGA, FCBGA

Quantity:

Unit Price: $2,362.481109

Ext Price: $2,362.48

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 548

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $2,362.481109

    $2,362.48

  • 10

    $2,284.797978

    $22,847.98

  • 25

    $2,268.915569

    $56,722.89

  • 50

    $2,253.143564

    $112,657.18

  • 100

    $2,206.800748

    $220,680.07

  • 500

    $2,049.025764

    $1,024,512.88

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
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  • Vacuum packagingStep2:Vacuum packaging
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XC7K325T-3FBG676E information

Specifications
Product Details
AMD XC7K325T-3FBG676E technical specifications, attributes, parameters and parts with similar specifications to AMD XC7K325T-3FBG676E.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    676-BBGA, FCBGA
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    676-FCBGA (27x27)
  • Body Material

    The parameter "Body Material" in electronic components refers to the material used to construct the physical body or casing of the component. This material plays a crucial role in determining the component's durability, thermal conductivity, electrical insulation properties, and resistance to environmental factors such as moisture, heat, and mechanical stress. Common body materials for electronic components include plastics, ceramics, metals, and composites. Selecting the appropriate body material is essential to ensure the reliable performance and longevity of the electronic component in various operating conditions.

    Brass
  • Wire Size
    18 to 14, 18 AWG
  • Tab Size
    5.16 mm²
  • Device Logic Units
    203,800
  • Supplier Package
    Lidless FCBGA
  • Typical Operating Supply Voltage
    1.0000 V
  • Minimum Operating Supply Voltage
    0.97 V
  • Interface Standards
    FMC LPC; I2C; HPC; XADC; SMA; SFP+
  • Maximum Number of User I/Os
    250
  • Memory Card Interface
    SD Card
  • PCIe
    PCIe
  • Maximum Operating Supply Voltage
    1.03 V
  • Mounting
    Surface Mount
  • Memory Types
    DDR3
  • Number of I/Os
    400
  • Package
    Tray
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    XC7K325
  • Mfr
    AMD
  • Product Status
    Active
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0 to 100 °C
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Kintex®-7
  • Gender

    In the context of electronic components, the parameter "Gender" typically refers to the physical characteristics of connectors or interfaces that determine how they can be mated together. Connectors are often designed with specific gender types, such as male or female, to ensure proper alignment and connection between devices. A male connector typically has protruding pins or plugs that fit into a corresponding female connector, which has receptacles or sockets to receive the pins. This design helps prevent incorrect connections and ensures a secure and reliable electrical connection. Understanding the gender of connectors is crucial when designing or assembling electronic systems to ensure compatibility and proper functionality. It is essential to match the gender of connectors correctly to avoid damage and ensure optimal performance of the electronic components.

    Receptacle
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    0.97V ~ 1.03V
  • Pin Count

    a count of all of the component leads (or pins)

    676
  • Plating

    In the context of electronic components, "Plating" refers to a process of depositing a thin layer of metal onto a substrate material. This plating is often used to enhance the component's performance, durability, and conductivity. The plating material can vary depending on the specific requirements of the component, with common choices including gold, silver, tin, and nickel. Plating can also be used for corrosion resistance, solderability, and to improve the overall appearance of the component. Overall, plating plays a crucial role in ensuring the reliability and functionality of electronic components in various applications.

    Tin
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    1GB
  • Number of Logic Elements/Cells
    326080
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    16404480
  • Number of LABs/CLBs
    25475
  • Screening Level

    In electronic components, the term "Screening Level" refers to the level of testing and inspection that a component undergoes to ensure its reliability and performance. This process involves subjecting the component to various tests, such as temperature cycling, burn-in, and electrical testing, to identify any defects or weaknesses that could affect its functionality. The screening level is typically determined based on the application requirements and the criticality of the component in the system. Components that undergo higher screening levels are generally more reliable but may also be more expensive. Overall, the screening level helps to ensure that electronic components meet the necessary quality standards for their intended use.

    Extended
  • Speed Grade

    Speed grade is a specification in electronic components that indicates the maximum operating speed at which the component can reliably function. It is commonly used for integrated circuits, particularly in digital logic devices and programmable logic devices. The speed grade is typically denoted by a number or letter code that correlates to the maximum frequency or propagation delay of the device, influencing its performance in high-speed applications. Components with higher speed grades are capable of faster processing and lower signal delay compared to those with lower grades.

    3
  • Ethernet

    Ethernet is a widely used networking technology that allows devices to communicate with each other over a local area network (LAN). It is a set of standards that define how data is transmitted over a physical medium, typically using twisted-pair cables or fiber optics. Ethernet specifies the protocols for data transmission, addressing, and error detection, ensuring reliable and efficient communication between devices. It is commonly used in homes, businesses, and data centers to connect computers, printers, routers, and other networked devices. Ethernet has evolved over the years to support faster speeds and improved performance, making it a fundamental component of modern networking infrastructure.

    Yes
  • Number of Registers
    407,600
  • USB

    USB stands for Universal Serial Bus, which is a common interface used for connecting various electronic devices to a computer or other host device. It allows for the transfer of data, power, and communication between devices. USB ports are found on a wide range of devices such as computers, smartphones, printers, cameras, and more. The USB standard has evolved over the years to include different versions with varying data transfer speeds and power delivery capabilities. Overall, USB has become a widely adopted and versatile standard for connecting and interacting with electronic components.

    USB-Serial Bridge
  • Display Mode

    Display Mode in electronic components refers to the specific way in which information or data is presented on a display screen or panel. This parameter determines how the content is shown to the user, such as through text, graphics, images, or a combination of these elements. The display mode can also include characteristics like resolution, color depth, refresh rate, and aspect ratio, which all contribute to the overall visual experience. Different electronic devices and components may offer various display modes to cater to different user preferences and requirements.

    HMDI Output
  • GPIO

    GPIO stands for General Purpose Input/Output. It is a type of electronic pin found on microcontrollers, microprocessors, and other integrated circuits that can be configured to either input or output digital signals. GPIO pins can be used to connect and communicate with external devices such as sensors, LEDs, motors, and more. They provide a flexible way to interact with the physical world by allowing the device to both receive and send digital signals. GPIO pins can be programmed and controlled by software to perform various functions based on the specific requirements of the electronic system.

    Yes
  • Product Length

    Product Length in electronic components refers to the physical measurement of an electronic part from one end to the other along its longest axis. It is a crucial specification that helps in determining compatibility with circuit boards, enclosures, and other components. Understanding the Product Length is essential for ensuring proper placement and assembly within electronic designs.

    20.32 mm
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XC7K325T-3FBG676E Overview

There are two packages that contain fpga chips: 676-BBGA, FCBGA package and X package. Logic blocks consist of 326080 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. The supply voltage of the device is 0.97V ~ 1.03V , at which it runs. The Kintex®-7 series FPGA is a type of FPGA that belongs to the Kintex®-7 family of FPGAs. When operating the machine, it is important to keep the temperature within 0 to 100 °C range. A device like this one offers 16404480 RAM bits, which is a considerable amount of memory. A total of 25475 LABs/CLBs make up this FPGA array. This device has a pin count of 676 in fpga semiconductor. Data and programs can be stored in this FPGA module's 1GB memory. The data is stored and transferred using 407,600 registers that are used for this purpose. The device package supplied by 676-FCBGA (27x27) is one of its suppliers.

XC7K325T-3FBG676E Features

Up to 16404480 RAM bits
407,600 registers

XC7K325T-3FBG676E Applications

There are a lot of AMD
XC7K325T-3FBG676E FPGAs applications.


  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
XC7K325T-3FBG676E Relevant information

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