Atmel (Microchip Technology) M2S150T-1FC1152I
Atmel (Microchip Technology) M2S150T-1FC1152I
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Atmel (Microchip Technology) M2S150T-1FC1152I

SoC SmartFusion2 Series System On Chip

Manufacturer No:

M2S150T-1FC1152I

Utmel No:

225-M2S150T-1FC1152I

Package:

FCBGA-1152

ECAD Model:

Description:

System On Chip SmartFusion2 Series

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User Guide

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
M2S150T-1FC1152I information

Specifications
Product Details
Atmel (Microchip Technology) M2S150T-1FC1152I technical specifications, attributes, parameters and parts with similar specifications to Atmel (Microchip Technology) M2S150T-1FC1152I.
  • Type
    Parameter
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    FCBGA-1152
  • RoHS
    N
  • Mounting Styles
    SMD/SMT
  • Maximum Clock Frequency
    166 MHz
  • L1 Cache Instruction Memory
    -
  • L1 Cache Data Memory
    -
  • Data RAM Size
    64 kB
  • Number of Logic Elements
    146124 LE
  • Moisture Sensitive
    Yes
  • Number of Logic Array Blocks - LABs
    12177 LAB
  • Factory Pack QuantityFactory Pack Quantity
    24
  • Unit Weight
    1.234218 oz
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    SmartFusion2
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    512 kB
  • Number of Cores
    1 Core
0 Similar Products Remaining

Package FCBGA-1152 is assigned to this system on a chip by the manufacturer.The system on a chip is part of the series SmartFusion2.A state-of-the-art Tray package houses this SoC system on a chip.


There are a lot of Atmel (Microchip Technology)

M2S150T-1FC1152I System On Chip (SoC) applications.


  • Body control module
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  • Industrial robot
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