HALO TGR28-3755NCTR
HALO TGR28-3755NCTR
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HALO TGR28-3755NCTR

Manufacturer No:

TGR28-3755NCTR

Manufacturer:

HALO

Utmel No:

1034-TGR28-3755NCTR

Package:

-

ECAD Model:

Description:

TGR28-3755NCTR datasheet pdf and Pulse Transformers product details from HALO stock available at Utmel

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
TGR28-3755NCTR information

Specifications
HALO TGR28-3755NCTR technical specifications, attributes, parameters and parts with similar specifications to HALO TGR28-3755NCTR.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Number of Pins
    12
  • Number of Terminals
    12
  • EU RoHS
    Not Compliant
  • ECCN (US)
    EAR99
  • Automotive
    Unknown
  • PPAP
    Unknown
  • Maximum Interwinding Capacitance (pF)
    25
  • Maximum Primary Leakage Inductance (uH)
    0.8
  • Maximum DCR Primary Side (Ohm)
    0.9
  • High Potential
    3750Vrms
  • Minimum Crosstalk (dB)
    -60(Typ)@0.1MHz to 10MHz
  • Mounting
    Surface Mount
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Product Depth (mm)
    15.24
  • RoHS
    Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Termination

    Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

    SMD/SMT
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85 °C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -40 °C
  • Depth

    In electronic components, "Depth" typically refers to the measurement of the distance from the front to the back of the component. It is an important parameter to consider when designing or selecting components for a project, as it determines how much space the component will occupy within a circuit or device. The depth of a component can impact the overall size and layout of the circuit board or enclosure in which it will be installed. It is usually specified in millimeters or inches and is crucial for ensuring proper fit and functionality within the intended application.

    15.24 mm
  • Inductance

    Inductance is a property of an electrical component that quantifies its ability to store energy in a magnetic field when electric current flows through it. It is measured in henries and indicates how much voltage is induced in the component as a result of a change in current. Inductance is an essential characteristic in coils, inductors, and transformers, affecting the behavior of electrical circuits, particularly in alternating current applications. Higher inductance values usually correlate with larger coils or more turns of wire in the component.

    1.5 mH
  • DC Resistance (DCR)

    DC Resistance (DCR) is a measure of the resistance of an electronic component when a direct current (DC) is applied. It quantifies how much opposition the component presents to the flow of electrical current under steady-state conditions. DCR is crucial for understanding power loss, heating, and efficient performance in circuits, as it affects the overall behavior of components such as inductors, transformers, and resistors. Lower DCR values typically indicate better efficiency and performance in a given application.

    900 mΩ
  • Lead Style

    Lead Style in electronic components refers to the configuration and arrangement of leads or terminals that connect the component to a circuit. This parameter affects the component's mounting method, compatibility with PCB layouts, and overall physical dimensions. Common lead styles include through-hole, surface-mount, and post styles, each suited for different applications and manufacturing processes. Lead style is crucial for ensuring proper electrical connections and mechanical stability within electronic assemblies.

    Gull Wing
  • Lead/Base Style

    The parameter "Lead/Base Style" in electronic components refers to the physical configuration of the leads or terminals of the component in relation to its base or body. This parameter describes how the leads are attached to the component and how they are positioned in relation to the base. Common lead/base styles include through-hole, surface mount, gull-wing, J-lead, and many others. Understanding the lead/base style is important for proper installation and connection of the component in a circuit, as different styles may require different soldering techniques or mounting considerations.

    Gull Wing
  • Isolation Voltage

    Isolation voltage refers to a test of the ability of an insulator to minimize the flow of electric current with a high applied voltage.

    3.75 kV
  • Transformer Type

    A variety of types of electrical transformer are made for different purposes. Despite their design differences, the various types employ the same basic principle as discovered in 1831 by Michael Faraday, and share several key functional parts.

    3.75KV SMD Dual Line Interface Modules
  • Turns Ratio

    the ratio of the number of turns in one of two inductively coupled circuits to the number in the other.

    1CT:1CT/1CT:1.36CT
  • Product Length (mm)

    The parameter "Product Length (mm)" in electronic components refers to the physical length of the component, typically measured in millimeters. This measurement is important for determining the size and dimensions of the component, which is crucial for fitting it into a circuit board or enclosure. It helps in ensuring proper alignment and spacing within the overall design of the electronic system. Manufacturers provide this specification to assist engineers and designers in selecting components that will fit and function correctly within their intended application.

    17.15
  • Width
    11.56 mm
  • Height
    8.64 mm
  • Length
    17.15 mm
  • Product Height (mm)

    Product Height (mm) in electronic components refers to the measurement of the component's vertical dimension. It indicates how tall the component is when installed in a circuit or system. This parameter is crucial for determining compatibility with enclosures, ensuring adequate space for components on printed circuit boards, and facilitating proper airflow and cooling in electronic designs.

    8.64
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