HARTING 20100016233

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

The ferrule material in electronic components refers to the material used to construct the ferrule, which is a small metal or plastic component that is typically used to secure and protect the end of a cable or wire. The choice of ferrule material is important as it can impact the durability, conductivity, and overall performance of the electronic component.Common materials used for ferrules include metals such as copper, brass, and stainless steel, as well as plastics like nylon and PVC. Each material has its own set of properties that make it suitable for different applications. For example, copper ferrules are known for their excellent conductivity, while stainless steel ferrules offer high strength and corrosion resistance.When selecting a ferrule material for electronic components, factors such as the environment in which the component will be used, the electrical requirements, and the mechanical stresses it will be subjected to should be taken into consideration to ensure optimal performance and longevity.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

There are 5 Main Types of Fastening Type: Screws, Nails, Bolts, Anchors, Rivets.

MIL Conformance refers to the compliance of electronic components with military standards set by the Department of Defense. These standards define rigorous requirements for reliability, performance, and durability under extreme conditions. Components that meet MIL Conformance are often used in defense, aerospace, and other critical applications where failure is not an option. Adherence to these standards ensures that the components can withstand harsh environments, such as extreme temperatures, vibrations, and humidity.

DIN Conformance refers to the compliance of an electronic component with the standards set by the Deutsches Institut für Normung (DIN), which is the German Institute for Standardization. DIN standards cover a wide range of technical specifications and requirements for various products, including electronic components. When a component is labeled as DIN-conformant, it means that it meets the specific criteria outlined by DIN for factors such as dimensions, materials, performance, and safety. Ensuring DIN conformance helps to guarantee interoperability, quality, and reliability of electronic components in various applications and industries. Manufacturers often adhere to DIN standards to demonstrate the quality and reliability of their products to customers and to ensure compatibility with other DIN-compliant devices.

IEC Conformance refers to the compliance of electronic components with standards set by the International Electrotechnical Commission (IEC). These standards ensure that the components meet specific safety, performance, and interoperability criteria. Adhering to IEC conformance helps manufacturers produce reliable and compatible products, facilitating international trade and promoting consumer safety. Components that conform to IEC standards are often preferred in global markets due to their quality assurance and regulatory acceptance.

Connector Style in electronic components refers to the physical design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the shape, size, and layout of the connector, as well as the method of attachment and the number of pins or contacts it has. Different connector styles are used for various applications, such as board-to-board connections, cable-to-board connections, or wire-to-board connections. The connector style plays a crucial role in determining the compatibility and functionality of electronic devices, as it ensures proper signal transmission and power delivery between interconnected components.

The parameter "Insulation Diameter" in electronic components refers to the measurement of the diameter of the insulation material surrounding a conductor or wire within the component. This measurement is crucial for ensuring proper insulation and protection of the conductor from external factors such as moisture, heat, and electrical interference. A sufficient insulation diameter helps prevent short circuits, electrical leakage, and other potential hazards in electronic circuits. Manufacturers specify insulation diameter requirements to meet safety standards and ensure the reliable performance of the electronic component in various applications.

In electronic components, the parameter "Simplex/Duplex" refers to the type of communication or data transmission mode supported by the component. Simplex communication is a one-way communication mode where data flows only in one direction, from the sender to the receiver. This means that the sender can only transmit data, and the receiver can only receive data. On the other hand, duplex communication is a two-way communication mode where data can flow in both directions, allowing for simultaneous transmission and reception of data between two devices. Understanding whether a component supports simplex or duplex communication is important for determining how data will be exchanged between devices and ensuring compatibility in a given system.

In electronic components, the parameter "Mode" typically refers to the operating mode or configuration in which the component is designed to function. This parameter specifies how the component should be used and under what conditions it will perform optimally. For example, a transistor may have different modes such as cutoff, saturation, and active mode, each with specific characteristics and behaviors. Understanding the mode of operation is crucial for proper integration of the component into a circuit and ensuring its reliable performance. It is important to consult the component's datasheet or technical specifications to determine its supported modes and operating conditions.

The Fiber Cladding Diameter is a parameter used to describe the outer diameter of the cladding layer in an optical fiber. The cladding layer is the outermost layer of the fiber that surrounds the core, which is where the light travels through. The cladding diameter is an important specification as it affects the overall size and performance of the optical fiber. A smaller cladding diameter can result in better flexibility and bending capabilities, while a larger cladding diameter may offer better protection and durability. It is typically measured in micrometers (µm) or millimeters (mm) depending on the size of the fiber.

Fiber size in electronic components refers to the diameter of the optical fiber used for signal transmission. It can influence the amount of light that can be carried and the effective bandwidth of the fiber. Smaller fiber sizes typically allow for higher data transmission rates and better performance over long distances, while larger sizes may be easier to work with and install. The specific fiber size can affect loss characteristics, modal dispersion, and overall system performance in fiber optic communications.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.