Integrated Device Technology (IDT)  89H24NT24G2ZCHLG
Integrated Device Technology (IDT)  89H24NT24G2ZCHLG
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Integrated Device Technology (IDT) 89H24NT24G2ZCHLG

Interface 1mm Specialized Interface IC 324 Pin

Manufacturer No:

89H24NT24G2ZCHLG

Utmel No:

1179-89H24NT24G2ZCHLG

Package:

FCBGA

ECAD Model:

Description:

1mm Copper, Silver, Tin Specialized Interface IC 324 Pin 1V FCBGA

Quantity:

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DHLTNTUPSFedExSF-Express

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In Stock : 160

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FedEx International, 5-7 business days.

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  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
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89H24NT24G2ZCHLG information

Specifications
Documents & Media
Product Details
Integrated Device Technology (IDT) 89H24NT24G2ZCHLG technical specifications, attributes, parameters and parts with similar specifications to Integrated Device Technology (IDT) 89H24NT24G2ZCHLG.
  • Type
    Parameter
  • Factory Lead Time
    10 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Copper, Silver, Tin
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    FCBGA
  • Number of Pins
    324
  • Frequency(Max)
    125MHz
  • Published
    1999
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e1
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    4 (72 Hours)
  • Number of Terminations
    324
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Silver/Copper (Sn/Ag/Cu)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    70°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    0°C
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    ALSO OPERATES AT 100 MHZ
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Pin Count

    a count of all of the component leads (or pins)

    324
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3V
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    1.1V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    PCI Express
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    24
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    BUS CONTROLLER, PCI
  • Supply Current-Max

    Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.

    3400mA
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    192 Gbps
  • Bus Compatibility

    Bus compatibility in electronic components refers to the ability of a device to communicate effectively with other devices on a shared data bus. This parameter is crucial in ensuring that different components can exchange information seamlessly and operate together without compatibility issues. It involves factors such as voltage levels, signal timing, and data protocols that need to be standardized for proper communication. Components with good bus compatibility can work together efficiently in a system, while those with poor compatibility may lead to communication errors or system malfunctions. Manufacturers often specify the bus compatibility of their components to help users ensure proper integration and functionality within their electronic systems.

    I2C; ISA; VGA
  • Length
    19mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    2.88mm
  • Width
    19mm
  • Thickness

    Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

    3.02mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for Integrated Device Technology (IDT) 89H24NT24G2ZCHLG.

89H24NT24G2ZCHLG Overview

It's a good fit for the FCBGA package.There are 324 terminations on it.Keep in mind that this device should be set to 1V.There are a total of 324 pins on it.324 pins are used for operation.It is mounted by Surface Mount.It operates at a minimum working temperature of 0°C to ensure reliability.The maximum value of 70°C assures that the part runs consistently.The interface IC conducts in a supply voltage of 3.3V.The uPs/uCs/Peripheral IC this device incoporates is BUS CONTROLLER, PCI.ALSO OPERATES AT 100 MHZ can also be founded when using this device.The device has a total of 24 ports.

89H24NT24G2ZCHLG Features

Set the part at 1V volts
BUS CONTROLLER, PCI of uPs/uCs/Peripheral ICs Type

89H24NT24G2ZCHLG Applications

There are a lot of Integrated Device Technology (IDT)
89H24NT24G2ZCHLG Specialized Interface ICs applications.


  • High-Voltage
  • Transmit and
  • Low-Voltage
  • Isolation
  • Medical/Industrial
  • Imaging
  • Ultrasound
  • Audio and video switching
  • Automatic test equipment
  • Precision data acquisition