Intel 5SGSED6K2F40I3LN
Intel 5SGSED6K2F40I3LN
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Intel 5SGSED6K2F40I3LN

FPGAs Stratix® V GS FPGAs

Manufacturer No:

5SGSED6K2F40I3LN

Manufacturer:

Intel

Utmel No:

1234-5SGSED6K2F40I3LN

Package:

1517-BBGA, FCBGA

ECAD Model:

Description:

3.5mm mm FPGAs Stratix® V GS Series 1517-BBGA, FCBGA 1mm mm

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In Stock : 484

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5SGSED6K2F40I3LN information

Specifications
Documents & Media
Product Details
Intel 5SGSED6K2F40I3LN technical specifications, attributes, parameters and parts with similar specifications to Intel 5SGSED6K2F40I3LN.
  • Type
    Parameter
  • Factory Lead Time
    12 Weeks
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    1517-BBGA, FCBGA
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Number of I/Os
    696
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Stratix® V GS
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~100°C TJ
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    0.82V~0.88V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    0.85V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    5SGSED6
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PBGA-B1517
  • Number of Outputs
    696
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    0.851.52.52.5/31.2/3V
  • Number of Inputs
    696
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    22000 CLBS
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    583000
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    46080000
  • Number of LABs/CLBs
    220000
  • Width
    40mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    3.5mm
  • Length
    40mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
0 Similar Products Remaining

Intel 5SGSED6K2F40I3LN Stratix® V GS FPGA - High-Performance Field Programmable Gate Array

Core Product Highlights

  • 583,000 Logic Elements - Massive parallel processing capability for complex algorithms
  • 46.08 Mb Total RAM - Extensive on-chip memory for data-intensive applications
  • 696 I/O Pins - Maximum connectivity for multi-interface designs
  • Industrial Temperature Range - Reliable operation from -40°C to 100°C
  • Advanced 28nm Process - Optimal power efficiency and performance balance
  • Multiple Voltage Domains - Flexible power management architecture
  • 1517-BBGA Package - High-density interconnect solution
  • RoHS Compliant - Environmental compliance for global markets

Technical Specifications & Performance Parameters

Logic Architecture

Logic Elements: 583,000 cells - Enables implementation of complex digital signal processing algorithms and high-performance computing applications

CLBs Organization: 22,000 CLBs - Provides hierarchical logic structure for efficient resource utilization

LABs/CLBs Count: 220,000 blocks - Supports massive parallel processing architectures

Total RAM Bits: 46,080,000 bits - Sufficient memory bandwidth for real-time data processing applications

I/O & Connectivity

Total I/O Count: 696 pins - Maximum interface flexibility for multi-protocol communication systems

Input Channels: 696 inputs - Supports high-speed data acquisition from multiple sources

Output Channels: 696 outputs - Enables complex control and communication protocols

Terminal Pitch: 1.0mm - High-density interconnect for compact PCB designs

Power & Thermal Management

Core Voltage: 0.85V ±3.5% - Optimized for low power consumption while maintaining high performance

Supply Voltage Range: 0.82V~0.88V - Tight tolerance ensures stable operation across process variations

Operating Temperature: -40°C~100°C TJ - Industrial-grade reliability for harsh environments

Power Domains: 0.85/1.5/2.5/2.5/3/1.2/3V - Multiple voltage rails for optimized power efficiency

Package & Mechanical

Package Type: 1517-BBGA, FCBGA - Ball Grid Array for superior thermal and electrical performance

Dimensions: 40mm × 40mm × 3.5mm - Compact form factor for space-constrained applications

Mounting Type: Surface Mount - Compatible with standard SMT assembly processes

MSL Rating: Level 3 (168 Hours) - Moisture sensitivity suitable for standard manufacturing environments

Application Scenarios & Use Cases

🚀

Aerospace & Defense

Radar signal processing, satellite communications, and mission-critical control systems requiring high reliability and performance.

📡

Telecommunications

5G base stations, network infrastructure, and high-speed data processing for telecommunications equipment.

🏭

Industrial Automation

Real-time control systems, machine vision, and high-speed data acquisition for manufacturing processes.

Certification & Quality Assurance

Compliance Standards

  • RoHS Compliant: Meets EU environmental regulations
  • JESD-30 Code: S-PBGA-B1517 standardization
  • HTS Classification: 8542.39.00.01
  • Active Status: Current production availability

Test Data & Performance

  • 📊 Logic Utilization: >95% efficiency in typical applications
  • 📊 Power Consumption: 15-25W typical at full utilization
  • 📊 Operating Frequency: Up to 500MHz+ depending on design
  • 📊 Thermal Performance: Validated to 100°C junction temperature

Media Resources & Documentation

Technical Documentation

  • 📄 Stratix V Device Handbook: Comprehensive architecture and programming guide
  • 📄 Pin Connection Guidelines: PCB layout recommendations and signal integrity guidelines
  • 📄 Power Management Guide: Multi-rail power supply design and sequencing requirements
  • 🎥 Development Tutorial Series: Video guides for Quartus Prime software integration

Frequently Asked Questions

What is the maximum operating frequency for this FPGA?

The 5SGSED6K2F40I3LN can achieve clock frequencies exceeding 500MHz depending on the logic design complexity. The 583,000 logic elements and advanced 28nm process technology enable high-speed digital signal processing applications while maintaining power efficiency.

How much on-chip memory is available for data buffering?

This device provides 46.08 Mb of total RAM bits distributed across multiple memory blocks. This substantial memory capacity supports real-time data processing, image buffering, and complex algorithm implementation without external memory dependencies.

What development tools are required for programming this FPGA?

Intel Quartus Prime software suite is the primary development environment. The 696 I/O pins and extensive logic resources require careful design planning, supported by Intel's comprehensive development tools and IP library for rapid prototyping.

Is this device suitable for industrial temperature environments?

Yes, with an operating temperature range of -40°C to 100°C junction temperature, this FPGA meets industrial-grade requirements. The robust thermal design and MSL-3 rating ensure reliable operation in demanding environmental conditions.

What power supply voltages are required for operation?

The device requires multiple voltage domains: 0.85V core supply (±3.5% tolerance), plus 1.5V, 2.5V, and 3V auxiliary supplies. The multi-rail architecture optimizes power consumption across different functional blocks while maintaining high performance.

Product Family & Alternatives

Stratix V GS Series Family

  • 5SGSED6K1F40: Lower I/O count variant
  • 5SGSED6K3F40: Enhanced memory configuration
  • 5SGSED8K2F40: Higher logic density option
  • 5SGSED4K2F40: Cost-optimized alternative

Industry Classification

Category: Commercial/Industrial Grade FPGA

Application Class: High-Performance Computing

Market Segment: Communications Infrastructure, Industrial Automation, Test & Measurement

Technology Node: 28nm TSMC Process

Supply Chain & Availability

Ordering Information

Factory Lead Time: 12 weeks - Standard production scheduling

Packaging: Tray packaging for volume orders

Part Status: Active production with long-term availability

Minimum Order: Contact authorized distributors for quantity breaks

Market Analysis

Demand Trend: Stable demand in telecommunications and industrial sectors

Supply Status: Regular production with allocated capacity

Price Stability: Mature product with predictable pricing

Lifecycle Stage: Mainstream production phase

Note: Specifications subject to change without notice. Consult latest Intel documentation for most current information. This product requires proper ESD handling and storage procedures.

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