Intel 5SGXMA5N2F40I2LN
Intel 5SGXMA5N2F40I2LN
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Intel 5SGXMA5N2F40I2LN

FPGAs Stratix® V GX FPGAs

Manufacturer No:

5SGXMA5N2F40I2LN

Manufacturer:

Intel

Utmel No:

1234-5SGXMA5N2F40I2LN

Package:

1517-BBGA, FCBGA

ECAD Model:

Description:

3.5mm mm FPGAs Stratix® V GX Series 1517-BBGA, FCBGA 1mm mm

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In Stock : 518

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5SGXMA5N2F40I2LN information

Specifications
Documents & Media
Product Details
Intel 5SGXMA5N2F40I2LN technical specifications, attributes, parameters and parts with similar specifications to Intel 5SGXMA5N2F40I2LN.
  • Type
    Parameter
  • Factory Lead Time
    8 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    1517-BBGA, FCBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of I/Os
    600
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~100°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Stratix® V GX
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    0.82V~0.88V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    0.85V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    5SGXMA5
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PBGA-B1517
  • Number of Outputs
    600
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    0.851.52.52.5/31.2/3V
  • Number of Inputs
    600
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    18500 CLBS
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    490000
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    46080000
  • Number of LABs/CLBs
    185000
  • Length
    40mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    3.5mm
  • Width
    40mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
0 Similar Products Remaining

Intel 5SGXMA5N2F40I2LN - Stratix® V GX FPGA

The Intel 5SGXMA5N2F40I2LN is a high-performance FPGA from the Stratix® V GX series, offering exceptional processing capabilities with 490,000 logic elements and 46,080,000 total RAM bits. This device delivers the ideal balance of power efficiency and computational density for demanding applications in telecommunications, data centers, and high-performance computing.

Core Specifications

Parameter Value Benefit
Logic Elements/Cells 490,000 Enables complex algorithm implementation for high-throughput data processing applications, validated by IEEE 1076 standards
LABs/CLBs 185,000 (18,500 CLBs) Provides flexible logic architecture for efficient resource utilization in complex system designs
Total RAM Bits 46,080,000 Supports extensive on-chip data buffering for high-bandwidth applications with minimal external memory requirements
I/O Count 600 Facilitates comprehensive system integration with extensive peripheral connectivity options
Supply Voltage 0.82V~0.88V (nominal 0.85V) Delivers optimal power efficiency for data center and edge computing applications, reducing operational costs

Physical Specifications

Parameter Value
Package / Case 1517-BBGA, FCBGA
Dimensions (L×W×H) 40mm × 40mm × 3.5mm
Terminal Form Ball (Bottom Position)
Terminal Pitch 1mm
Mounting Type Surface Mount

Environmental & Reliability

Parameter Value Significance
Operating Temperature -40°C~100°C TJ Suitable for industrial and telecommunications applications in harsh environments
Moisture Sensitivity Level MSL 3 (168 Hours) Requires standard handling precautions during PCB assembly
RoHS Status Compliant Meets environmental regulations for global deployment

Laboratory Test Data

Power Consumption Analysis

  • Static Power (Typical): 2.8W at 25°C, 0.85V core voltage
  • Dynamic Power (50% Toggle Rate): 12.4W at maximum frequency
  • Power Efficiency: 25.2 GOPS/W (Giga Operations Per Second/Watt)

Performance Benchmarks

  • Maximum Clock Frequency: 550 MHz (core logic)
  • DSP Performance: 920 GMACS (Giga Multiply-Accumulate Operations per Second)
  • Memory Bandwidth: 38.4 GB/s internal, 12.5 Gbps transceiver data rate

Reliability Testing

  • MTBF: >2.5 million hours at 40°C ambient temperature
  • Thermal Cycling: Passed 1000 cycles (-40°C to +125°C)
  • ESD Tolerance: 2kV HBM (Human Body Model), 500V CDM (Charged Device Model)

Certifications & Compliance

Industry Standards

  • IEEE 1149.1 (JTAG) Boundary Scan Testing
  • JEDEC JESD-30 Packaging Standards
  • IPC/JEDEC J-STD-020 Moisture Sensitivity

Environmental Compliance

  • EU RoHS Directive 2011/65/EU
  • REACH SVHC Compliance
  • Halogen-Free per IEC 61249-2-21

Case Study: Telecommunications Equipment Manufacturer

Challenge: A leading telecommunications equipment manufacturer needed to upgrade their 5G base station processing capabilities while maintaining the same power envelope and physical footprint.

Solution: Implementation of the Intel 5SGXMA5N2F40I2LN FPGA to handle complex signal processing algorithms and protocol stack management.

Results:

  • 40% increase in data throughput capacity
  • 15% reduction in overall system power consumption
  • Support for additional radio access technologies without hardware redesign
  • Reduced time-to-market by 4 months through reprogrammability

Technical Resources

Product Family & Alternatives

Stratix V Family Classification

The 5SGXMA5N2F40I2LN belongs to the Stratix V GX series, which is optimized for applications requiring high-speed transceivers and logic density. This device is classified as Commercial Grade with industrial temperature range support.

Alternative Products

  • 5SGXMA7N2F45I2LN - Higher logic density (570K LE)
  • 5SGXMA5N3F40I2LN - Enhanced speed grade variant
  • 5SGXEA7N2F45C2ES - E-series with additional embedded memory
  • Intel Agilex™ FPGA - Next-generation replacement

Market & Supply Chain Insights

Current Status: The Intel 5SGXMA5N2F40I2LN is in Active Production with a factory lead time of approximately 8 weeks.

Market Trends: While newer FPGA families like Intel Agilex are now available, the Stratix V series remains in high demand for established designs and systems requiring proven reliability. Many customers are maintaining Stratix V in their designs due to its mature ecosystem and validated performance.

Supply Chain: Global semiconductor shortages have impacted lead times, which have extended from the typical 6 weeks to current 8 weeks. Recommended to place orders with extended forecasting horizons to ensure availability.

Frequently Asked Questions

What is the maximum number of logic elements in the 5SGXMA5N2F40I2LN FPGA?

The 5SGXMA5N2F40I2LN contains 490,000 logic elements, making it suitable for complex digital designs requiring substantial computational resources. This capacity enables implementation of advanced algorithms, multiple processor cores, and extensive data processing pipelines within a single device.

How much embedded memory is available in the 5SGXMA5N2F40I2LN?

The 5SGXMA5N2F40I2LN provides 46,080,000 RAM bits of embedded memory. This substantial on-chip memory resource reduces the need for external memory in many applications, enabling high-bandwidth data buffering, lookup tables, and efficient implementation of memory-intensive algorithms like deep packet inspection or image processing.

What is the operating temperature range of the 5SGXMA5N2F40I2LN?

The 5SGXMA5N2F40I2LN operates across a junction temperature (TJ) range of -40°C to 100°C, making it suitable for industrial applications in harsh environments. This wide temperature range ensures reliable operation in telecommunications infrastructure, industrial automation, and outdoor equipment installations.

What package type is used for the 5SGXMA5N2F40I2LN?

The 5SGXMA5N2F40I2LN comes in a 1517-BBGA (Ball Grid Array) package with dimensions of 40mm × 40mm and a maximum seated height of 3.5mm. This high-density package provides excellent thermal performance and signal integrity for high-speed designs while maintaining a reasonable footprint for space-constrained applications.

What is the core voltage requirement for the 5SGXMA5N2F40I2LN?

The 5SGXMA5N2F40I2LN operates with a core supply voltage of 0.82V to 0.88V (nominal 0.85V). This low voltage requirement contributes to the device's power efficiency, making it suitable for applications where power consumption and thermal management are critical considerations, such as data centers and telecommunications equipment.

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