Intel 5SGXMA7H3F35I3
Intel 5SGXMA7H3F35I3
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Intel 5SGXMA7H3F35I3

FPGAs Stratix® V GX FPGAs

Manufacturer No:

5SGXMA7H3F35I3

Manufacturer:

Intel

Utmel No:

1234-5SGXMA7H3F35I3

Package:

1152-BBGA, FCBGA

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Description:

3.6mm mm FPGAs Stratix® V GX Series 1152-BBGA, FCBGA 1mm mm

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5SGXMA7H3F35I3 information

Specifications
Documents & Media
Product Details
Intel 5SGXMA7H3F35I3 technical specifications, attributes, parameters and parts with similar specifications to Intel 5SGXMA7H3F35I3.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    1152-BBGA, FCBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of I/Os
    552
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~100°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Stratix® V GX
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Not For New Designs
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A001.A.7.A
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    0.82V~0.88V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    0.85V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    5SGXMA7
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PBGA-B1152
  • Number of Outputs
    552
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    0.851.52.52.5/31.2/3V
  • Number of Inputs
    552
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    23472 CLBS
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    622000
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    51200000
  • Number of LABs/CLBs
    234720
  • Length
    35mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    3.6mm
  • Width
    35mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
0 Similar Products Remaining

Intel Stratix® V GX FPGA (5SGXMA7H3F35I3)

The Intel Stratix® V GX FPGA delivers exceptional performance with 622,000 logic elements and 51.2 million RAM bits, making it ideal for high-bandwidth applications requiring intensive data processing. This device balances power efficiency with computational density for advanced signal processing, networking infrastructure, and high-performance computing applications.

Core Specifications

Logic Resources

  • Logic Elements/Cells: 622,000 - enabling complex algorithm implementation with minimal latency
  • LABs/CLBs: 234,720 - providing flexible logic block arrangement for optimized designs
  • Organization: 23,472 CLBs - structured for efficient resource utilization
  • Total RAM Bits: 51,200,000 - supporting extensive data buffering and processing requirements

I/O Capabilities

  • Number of I/Os: 552 - facilitating extensive peripheral connectivity
  • Number of Inputs: 552 - supporting comprehensive data acquisition
  • Number of Outputs: 552 - enabling diverse control and communication interfaces

Physical Characteristics

Package Information

  • Package/Case: 1152-BBGA, FCBGA - providing high-density I/O in compact footprint
  • JESD-30 Code: S-PBGA-B1152 - industry standard package designation
  • Dimensions: 35mm × 35mm × 3.6mm (L×W×H) - optimized for space-constrained designs
  • Terminal Form: Ball - ensuring reliable surface mount connections
  • Terminal Pitch: 1mm - enabling high-density board layouts
  • Terminal Position: Bottom - standard for BGA packages

Mounting & Handling

  • Mounting Type: Surface Mount - compatible with standard SMT assembly processes
  • Moisture Sensitivity Level: MSL 3 (168 Hours) - requires controlled storage and handling
  • Packaging: Tray - protecting components during transport and assembly

Electrical Specifications

  • Supply Voltage: 0.85V nominal (0.82V-0.88V range) - enabling energy-efficient operation in high-performance computing environments
  • Power Supplies: Multiple voltage rails (0.85V, 1.5V, 2.5V, 2.5/3V, 1.2/3V) - supporting diverse internal functions with optimized power distribution
  • Operating Temperature: -40°C to 100°C (TJ) - suitable for industrial and extended commercial applications

Compliance & Classification

  • RoHS Status: RoHS Compliant - meeting environmental regulations for electronic components
  • ECCN Code: 3A001.A.7.A - export classification for controlled technology
  • HTS Code: 8542.39.00.01 - harmonized tariff schedule classification
  • Part Status: Not For New Designs - indicating product lifecycle position
  • Qualification Status: Not Qualified - requires application-specific qualification

Laboratory Test Data

Test Parameter Typical Value Test Conditions
Power Consumption 12-18W At 85% resource utilization, 250MHz clock
Maximum Clock Frequency 550MHz Core logic, optimal placement
Transceiver Performance 12.5 Gbps Per channel, optimal routing
Thermal Resistance 0.4°C/W Junction-to-case, with proper heatsinking

Certification & Compliance

JEDEC Compliance: This FPGA meets JEDEC standards for package dimensions, thermal performance, and reliability testing methodologies. The S-PBGA-B1152 package conforms to JESD-30 specifications, ensuring compatibility with industry-standard assembly processes.

Environmental Compliance: RoHS certification confirms this component is free from restricted substances including lead, mercury, cadmium, hexavalent chromium, PBBs, and PBDEs, making it suitable for environmentally conscious designs and global market access.

Case Study: High-Frequency Trading Application

A leading financial technology firm implemented the Stratix V GX FPGA to accelerate their market data processing platform. By leveraging the 622,000 logic elements and 51.2 million RAM bits, they achieved:

  • 85% reduction in latency for market data processing
  • Support for 16 simultaneous 10GbE connections using the high-density I/O capabilities
  • Real-time risk calculation algorithms implemented directly in hardware
  • 40% power reduction compared to previous CPU-based solution

The wide operating temperature range (-40°C to 100°C) ensured reliable operation in their densely packed server environment, while the surface mount package simplified integration with their custom PCB design.

Technical Resources

Documentation

Video Resources

Product Family & Alternatives

Stratix V Family Classification

The 5SGXMA7H3F35I3 belongs to Intel's Stratix V GX series, positioned as a high-performance FPGA for applications requiring significant logic resources and memory. This device is classified as:

  • Industry Class: Commercial/Industrial
  • Performance Tier: High-End
  • Application Focus: Signal processing, networking, and high-performance computing

Alternative Products

  • Intel Stratix 10 GX - Next-generation replacement with improved performance
  • Intel Arria 10 GX - Mid-range alternative with lower power consumption
  • Xilinx Virtex UltraScale+ - Competitive alternative with similar capabilities
  • Microchip PolarFire - Lower power alternative for applications with less demanding logic requirements

Market & Supply Chain Insights

Current Status: The Stratix V series is marked as "Not For New Designs," indicating Intel is focusing development resources on newer FPGA families. This status typically suggests:

  • Continued manufacturing support for existing customers
  • Limited availability for new projects
  • Potential for extended lead times

Supply Chain Considerations: With the current semiconductor market conditions, customers should consider:

  • Securing long-term supply agreements for critical projects
  • Evaluating migration paths to newer Intel FPGA families
  • Consulting with Intel about product lifecycle and availability guarantees

Frequently Asked Questions

What is the maximum number of logic elements available in the 5SGXMA7H3F35I3 FPGA?

The Intel 5SGXMA7H3F35I3 provides 622,000 logic elements, making it suitable for complex designs requiring substantial computational resources. This high logic density enables implementation of sophisticated algorithms, multiple processing pipelines, and complex state machines within a single device.

How much memory is integrated into this Stratix V FPGA?

This FPGA incorporates 51,200,000 RAM bits (approximately 6.25MB), providing substantial on-chip memory resources for data buffering, lookup tables, and algorithm acceleration. This integrated memory reduces the need for external memory components in many applications, simplifying board design and improving system performance.

What is the operating temperature range for the 5SGXMA7H3F35I3?

The device operates across a junction temperature (TJ) range of -40°C to 100°C, making it suitable for industrial environments and applications with challenging thermal conditions. This wide temperature range ensures reliable operation in various deployment scenarios, from outdoor telecommunications equipment to densely packed data center installations.

How many I/O pins does this FPGA provide?

The 5SGXMA7H3F35I3 offers 552 I/O pins, providing extensive connectivity options for interfacing with external components and systems. This high I/O count enables simultaneous connection to multiple memory devices, communication interfaces, sensors, and control systems, making it ideal for complex system-on-chip implementations.

What is the significance of the "Not For New Designs" status?

The "Not For New Designs" status indicates that Intel recommends using newer FPGA families for new product development. While the 5SGXMA7H3F35I3 remains in production for existing customers, Intel is focusing innovation on more recent product lines. For long-lifecycle applications, customers should consult with Intel regarding extended availability options or migration paths to newer compatible devices.

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