Microchip AX125-FG256I
Microchip AX125-FG256I
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Microchip AX125-FG256I

FPGAs 649 MHz MHz FPGAs

Manufacturer No:

AX125-FG256I

Manufacturer:

Microchip

Utmel No:

1610-AX125-FG256I

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Description:

1.5 V V 990 ps ns FPGAs 649 MHz MHz

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AX125-FG256I information

Specifications
Product Details
Microchip AX125-FG256I technical specifications, attributes, parameters and parts with similar specifications to Microchip AX125-FG256I.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    Obsolete (Last Updated: 2 months ago)
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Number of Pins
    256
  • Weight
    400.011771 mg
  • Schedule B
    8542390000/8542390000/8542390000/8542390000/8542390000
  • Number of I/Os
    138
  • RoHS
    Compliant
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85 °C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -40 °C
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    649 MHz
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.5 V
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    1.575 V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    1.425 V
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    2.3 kB
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    990 ps
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    990 ps
  • Number of Logic Elements/Cells
    1344
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    125000
  • Max Frequency

    Max Frequency refers to the highest frequency at which an electronic component can operate effectively without degradation of performance. It is a critical parameter for devices such as transistors, capacitors, and oscillators, indicating their limitations in speed and response time. Exceeding the max frequency can lead to issues like signal distortion, heat generation, and potential failure of the component. Understanding this parameter is essential for designing circuits to ensure reliable and efficient operation.

    649 MHz
  • Number of Logic Blocks (LABs)
    1344
  • Number of Registers
    1344
  • Width
    17 mm
  • Height
    1.2 mm
  • Length
    17 mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
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AX125-FG256I Overview

A fundamental building block contains 1344 logic elements or cells. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. This cable has 256 pins and is designed to connect to a computer. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. With a 1.5 V supply voltage, designers can fully utilize the flexibility of the device. A maximum operating temperature of 85 °C can be reached by this module. Over -40 °C should be the operating temperature. 125000 gates make up the basic block of its construction. The basic building block of the system is composed of 1344 logic blocks (LABs). The registers used in the transfer of and storage of data are 1344 in number. A frequency of 649 MHz provides high efficiency. It can take a maximum of 1.575 V as the supply voltage. Using a supply voltage as low as 1.425 V, fpga semiconductor will work. A FPGA of this type can achieve a speed as high as 649 MHz.

AX125-FG256I Features

256 LABs/CLBs
85 °C gates
1344 logic blocks (LABs)
1344 registers
Operating from a frequency of 649 MHz

AX125-FG256I Applications

There are a lot of Microchip
AX125-FG256I FPGAs applications.


  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
AX125-FG256I Relevant information

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