Microchip Technology COM20020I3V-HT
Microchip Technology COM20020I3V-HT
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Microchip Technology COM20020I3V-HT

ARCNET 878.1 Controllers Interface ICs

Manufacturer No:

COM20020I3V-HT

Utmel No:

1610-COM20020I3V-HT

Package:

48-LQFP

Datasheet:

COM20020I 3.3V

Usage Grade:

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ECAD Model:

Description:

ARCNET 878.1 Controllers Interface ICs QUAD COM20020 48 Pins Controller 0.5mm 48-LQFP

Quantity:

Unit Price: $133.515359

Ext Price: $133.52

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

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In Stock : 2547

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $133.515359

    $133.52

  • 10

    $125.957886

    $1,259.58

  • 100

    $118.828194

    $11,882.82

  • 500

    $112.102070

    $56,051.04

  • 1000

    $105.756670

    $105,756.67

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COM20020I3V-HT information

Specifications
Documents & Media
Product Details
Microchip Technology COM20020I3V-HT technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology COM20020I3V-HT.
  • Type
    Parameter
  • Factory Lead Time
    6 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    48-LQFP
  • Number of Pins
    48
  • Usage Level
    Industrial grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Published
    2006
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    48
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn) - annealed
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3.3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    COM20020
  • Function

    The parameter "Function" in electronic components refers to the specific role or purpose that the component serves within an electronic circuit. It defines how the component interacts with other elements, influences the flow of electrical signals, and contributes to the overall behavior of the system. Functions can include amplification, signal processing, switching, filtering, and energy storage, among others. Understanding the function of each component is essential for designing effective and efficient electronic systems.

    Controller
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3V
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    3.465V
  • Max Supply Current

    Max Supply Current refers to the maximum amount of electrical current that a component can draw from its power supply under normal operating conditions. It is a critical parameter that ensures the component operates reliably without exceeding its thermal limits or damaging internal circuitry. Exceeding this current can lead to overheating, performance degradation, or failure of the component. Understanding this parameter is essential for designing circuits that provide adequate power while avoiding overload situations.

    40mA
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    40MHz
  • Current - Supply

    Current - Supply is a parameter in electronic components that refers to the maximum amount of electrical current that the component can provide to the circuit it is connected to. It is typically measured in units of amperes (A) and is crucial for determining the power handling capability of the component. Understanding the current supply rating is important for ensuring that the component can safely deliver the required current without overheating or failing. It is essential to consider this parameter when designing circuits to prevent damage to the component and ensure proper functionality of the overall system.

    35mA
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    5 Mbps
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    3
  • Protocol

    In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.

    ARCNET
  • Boundary Scan

    Boundary scan is a testing technique used in electronic components to verify the interconnections between integrated circuits on a printed circuit board. It allows for the testing of digital circuits by providing a way to shift data in and out of devices through a serial interface. This method helps in identifying faults such as short circuits, open circuits, and incorrect connections without the need for physical access to the individual components. Boundary scan is commonly used during manufacturing, testing, and debugging processes to ensure the quality and reliability of electronic products.

    NO
  • Low Power Mode

    Low Power Mode is a feature found in electronic components, such as microcontrollers, processors, and devices, that allows them to operate at reduced power consumption levels. When activated, the component typically reduces its clock speed, voltage, or disables certain functions to conserve energy. This mode is often used to extend battery life in portable devices or reduce overall power consumption in energy-efficient systems. Low Power Mode can be triggered automatically based on certain conditions, such as low battery levels, or manually by the user or software. It is a crucial feature in modern electronics to balance performance with energy efficiency.

    NO
  • External Data Bus Width

    The External Data Bus Width refers to the number of bits that can be transmitted simultaneously between a microprocessor and external components, such as memory or peripherals. It determines the amount of data that can be transferred in a single clock cycle. A wider data bus allows for faster data transfer rates and can improve overall system performance. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with larger widths generally offering higher throughput but requiring more complex circuitry. The External Data Bus Width is an important parameter to consider when designing or evaluating electronic components to ensure compatibility and optimal performance.

    8
  • Number of Transceivers
    1
  • RAM (words)

    RAM (words) is a parameter used to describe the memory capacity of a random access memory (RAM) module in terms of the number of words it can store. In the context of electronic components, a word typically refers to the amount of data that can be processed or stored by the RAM module in a single operation. The RAM (words) specification indicates the total number of words that can be stored in the RAM module, with each word typically consisting of a fixed number of bits. This parameter is important for determining the overall memory capacity and performance of the RAM module in electronic devices.

    2000
  • Number of Serial I/Os
    1
  • Standards

    The parameter "Standards" in electronic components refers to established criteria or specifications that ensure interoperability, safety, and performance across various electronic devices and systems. These standards are often set by recognized organizations and describe the characteristics, dimensions, and testing methods for components. Adherence to these standards helps manufacturers produce compatible and reliable products, facilitates communication between devices, and ensures compliance with regulatory requirements. Standards play a crucial role in the consistency and quality of electronic components in the industry.

    ARCNET 878.1
  • On Chip Data RAM Width

    The "On Chip Data RAM Width" parameter in electronic components refers to the number of bits that can be processed simultaneously by the on-chip data random access memory (RAM) within the component. This parameter determines the amount of data that can be accessed and manipulated in a single operation, affecting the speed and efficiency of data processing. A wider RAM width allows for faster data transfer and processing, as more bits can be handled at once. It is an important specification to consider when evaluating the performance capabilities of electronic components, especially in applications where high-speed data processing is critical.

    8
  • Data Encoding/Decoding Method

    Data Encoding/Decoding Method in electronic components refers to the process of converting data from one format to another for transmission or storage purposes. This method involves encoding the data into a specific format before transmission and decoding it back to its original form upon reception. The encoding process typically involves converting the data into a series of bits or symbols that can be easily transmitted over a communication channel. Common encoding methods include techniques such as Manchester encoding, NRZ (Non-Return-to-Zero) encoding, and differential encoding. Decoding, on the other hand, involves reversing the encoding process to retrieve the original data from the received signals. The choice of data encoding/decoding method can impact factors such as data transmission speed, error detection, and compatibility with different communication protocols.

    NRZ
  • Length
    7mm
  • Width
    7mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for Microchip Technology COM20020I3V-HT.

COM20020I3V-HT Overview

It is a part of the 48-LQFP package. This packaging has a Tray-shape, making it convenient to carry around. A reliable operation requires a temperature that is regulated to -40°C~85°C. Among other things, it contains 48 terminations. 3.3V is the supply voltage that enables high efficiency. This number is part of the COM20020 family. To operate, 48 pins are required. It is important to note that the device's clock runs at a frequency called 40MHz. A 3.3V-volt supply voltage is recommended for maximum efficiency. 35mA supplies are available at the moment. Integrated serial 1 I/Os are provided by the part. In this case, 1 transceivers are involved. 40mA is the highest current it requires to function. It is set to 3.465V for the maximum supply voltage (Vsup).

COM20020I3V-HT Features

40MHz clock frequency

COM20020I3V-HT Applications

There are a lot of Microchip Technology
COM20020I3V-HT Controllers Interface ICs applications.


  • Dimmable LED Power Supply
  • Dimming Control Devices
  • Commercial LED Lighting
  • Smart LED Lighting
  • Portable Appliances
  • Battery-Operated Devices
  • Cellular Data Devices
  • Factory Automation and Process Controls
  • IrDA transmission control
  • Remote transmission formatter
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