Microchip Technology PM5450A-FEI
Microchip Technology PM5450A-FEI
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Microchip Technology PM5450A-FEI

Controllers Interface ICs

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PM5450A-FEI

Utmel No:

1610-PM5450A-FEI

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Controllers Interface ICs BOTTOM

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PM5450A-FEI information

Specifications
Documents & Media
Product Details
Microchip Technology PM5450A-FEI technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology PM5450A-FEI.
  • Type
    Parameter
  • Factory Lead Time
    16 Weeks
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Published
    2010
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    1517
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Number of Functions
    1
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PBGA-B1517
  • Telecom IC Type

    Telecom IC Type refers to integrated circuits specifically designed for telecommunications applications. These components facilitate various functions such as signal processing, data modulation and demodulation, and communication protocol handling. They can be used in devices like mobile phones, modems, and network equipment, ensuring reliable data transmission and reception. Telecom ICs support different standards and technologies, making them essential for modern communication systems.

    TELECOM CIRCUIT
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Microchip Technology PM5450A-FEI.

Product Description:

The PM5450A-FEI is a high-performance, surface-mountable integrated circuit (IC) designed by Microchip Technology. This IC is a part of the Interface - Controllers category and is compliant with the JESD-30 standard. It features a Ball Grid Array (BGA) package with 1517 terminations, making it suitable for a wide range of applications.

Features:

  • High-speed data transfer capabilities
  • Low power consumption for reduced heat generation
  • Compact BGA package for increased density and reduced board space requirements
  • Compliant with JESD-30 standard for compatibility with various systems
  • RoHS3 compliant for environmental sustainability

Applications:

  • Primary Applications:
    • High-speed data transmission and reception in telecommunications systems
    • Data processing and storage in industrial control systems
    • High-speed data transfer in automotive systems
  • Secondary Applications:
    • Medical devices requiring high-speed data transfer
    • Aerospace systems requiring reliable and efficient data transmission

Alternative Parts:

  • PM5450A-FEI is an active part with no direct alternatives. However, customers may consider the following parts as alternatives:
    • PM5450A-FEI-EV: Evaluation version of the PM5450A-FEI for development and testing purposes
    • PM5450A-FEI-TR: Tape and reel version of the PM5450A-FEI for high-volume production

Embedded Modules:

  • The PM5450A-FEI is used in various embedded modules, including:
    • Microchip's PIC32 microcontroller family
    • Microchip's dsPIC digital signal controller family
    • Other custom-designed embedded systems requiring high-speed data transfer capabilities

FAQs:

Q: What is the lead time for the PM5450A-FEI? A: The factory lead time for the PM5450A-FEI is 16 weeks.

Q: Is the PM5450A-FEI RoHS compliant? A: Yes, the PM5450A-FEI is RoHS3 compliant, making it suitable for environmentally friendly designs.

Q: What is the moisture sensitivity level of the PM5450A-FEI? A: The PM5450A-FEI has a moisture sensitivity level of 3 (168 hours), which means it can be stored in an unsealed package for up to 168 hours before reflow soldering.

Q: What is the terminal form and position of the PM5450A-FEI? A: The PM5450A-FEI features a Ball Grid Array (BGA) package with terminals on the bottom surface.

Q: When was the PM5450A-FEI published? A: The PM5450A-FEI was published in 2010.

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