ON Semiconductor KAI-02170-FBA-JD-BA
ON Semiconductor KAI-02170-FBA-JD-BA
KAI-02170-FBA-JD-BA-ON-Semiconductor-datasheet-37174747.pdf  Pinout Diagram_1
KAI-02170-FBA-JD-BA-ON-Semiconductor-datasheet-37174747.pdf  Pinout Diagram_2
KAI-02170-FBA-JD-BA-ON-Semiconductor-datasheet-37174747.pdf  Pinout Diagram_3
KAI-02170-FBA-JD-BA-ON-Semiconductor-datasheet-37174747.pdf  Pinout Diagram_4
KAI-02170-FBA-JD-BA-ON-Semiconductor-datasheet-37174747.pdf  Pinout Diagram_5
KAI-02170-FBA-JD-BA-ON-Semiconductor-datasheet-37174747.pdf  Pinout Diagram_6
KAI-02170-FBA-JD-BA-ON-Semiconductor-datasheet-37174747.pdf  Pinout Diagram_7
KAI-02170-FBA-JD-BA-ON-Semiconductor-datasheet-37174747.pdf  Pinout Diagram_8
KAI-02170-FBA-JD-BA-ON-Semiconductor-datasheet-37174747.pdf  Pinout Diagram_9
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ON Semiconductor KAI-02170-FBA-JD-BA

Manufacturer No:

KAI-02170-FBA-JD-BA

Manufacturer:

ON Semiconductor

Utmel No:

1807-KAI-02170-FBA-JD-BA

Package:

68-BPGA

ECAD Model:

Description:

CCD 7.4μmx7.4μm 1 (Unlimited) 1920H x 1080V 60 Frames per Second 68-BPGA 14.5V~15.5V -50°C~70°C TA Tray 70.2 dB

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KAI-02170-FBA-JD-BA information

Specifications
Documents & Media
Product Details
ON Semiconductor KAI-02170-FBA-JD-BA technical specifications, attributes, parameters and parts with similar specifications to ON Semiconductor KAI-02170-FBA-JD-BA.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    LAST SHIPMENTS (Last Updated: 6 days ago)
  • Factory Lead Time
    9 Weeks
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    68-BPGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Mounting Feature

    a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

    THROUGH HOLE MOUNT
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -50°C~70°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Published
    2014
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Type
    CCD
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    IT HAS SENSITIVITY OF 8.7 MICRO VOLT PER ELECTRON LOW AND 33 MICRO VOLT PER ELECTRON HIGH; ELECTRONIC SHUTTER; DYNAMIC RANGE, EXTENDED LINEAR OF 82.5
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    14.5V~15.5V
  • Body Length or Diameter

    Body length or diameter in electronic components refers to the physical dimensions of a component's housing, typically measured in millimeters or inches. It indicates the size of the component that affects its fit within a circuit board or system. This parameter is crucial for ensuring compatibility with the design and mounting of electronic devices. It can impact heat dissipation, electrical performance, and overall assembly efficiency. Accurate measurement of body length or diameter is essential for proper component selection and placement in electronic applications.

    33.02mm
  • Body Breadth

    Body breadth in electronic components refers to the width of the physical body of a component, such as a resistor, capacitor, or integrated circuit. This measurement is crucial for ensuring proper fit within a circuit board or enclosure. It can affect the component's thermal performance, mechanical stability, and overall compatibility with other components in a design. Body breadth is typically specified in millimeters or inches and is an important factor in the selection and design of electronic assemblies.

    20.07 mm
  • Frames per Second

    used to measure frame rate – the number of consecutive full-screen images that are displayed each second.

    60
  • Pixel Size

    the horizontal and vertical measurements of an image expressed in pixels.

    7.4μmx7.4μm
  • Active Pixel Array

    The term "Active Pixel Array" refers to the area within an electronic component, such as a camera sensor or display panel, where individual pixels are located and actively capture or display images. This array is made up of a grid of tiny light-sensitive or light-emitting elements that work together to form the overall image. The size and arrangement of the active pixel array directly impact the resolution and quality of the images produced by the electronic component. By controlling the properties of the active pixel array, manufacturers can enhance the performance and capabilities of the device in terms of image clarity, color accuracy, and overall functionality.

    1920H x 1080V
  • Dynamic Range

    Dynamic range in electronic components refers to the ratio between the largest and smallest possible values of a signal that the component can accurately handle. It is a measure of the component's ability to accurately capture and reproduce a wide range of signal amplitudes. A larger dynamic range indicates that the component can handle a greater difference between the strongest and weakest signals without distortion or loss of detail. Dynamic range is an important specification in audio equipment, imaging devices, and other electronic systems where capturing a wide range of signal amplitudes is crucial for maintaining fidelity and accuracy.

    70.2 dB
  • Optical Format

    The "Optical Format" parameter in electronic components refers to the physical size and shape of the optical sensor or imaging device within the component. It typically describes the dimensions of the sensor's active area, which directly impacts its field of view and resolution capabilities. The optical format is crucial for determining the compatibility of lenses and other optical components with the sensor, as well as for understanding the overall performance and characteristics of the imaging system. Different optical formats are used in various applications, ranging from small sensors in smartphones to larger sensors in professional cameras and scientific instruments.

    1 inch
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for ON Semiconductor KAI-02170-FBA-JD-BA.

KAI-02170-FBA-JD-BA Overview

The image sensors are put into 68-BPGA packages for safety protection. The image sensors should supply the voltage of 14.5V~15.5V. We will package these image sensors in the Tray to protect them from damage. The dynamic range of the image sensor should be 70.2 dB. As specified, the optical format of the image sensor is 1 inch.

KAI-02170-FBA-JD-BA Features

Moisture Sensitivity Level (MSL): 1 (Unlimited)
Pixel Size: 7.4μmx7.4μm
Active Pixel Array: 1920H x 1080V
Operating Temperature: -50°C~70°C TA

KAI-02170-FBA-JD-BA Applications

There are a lot of ON Semiconductor
KAI-02170-FBA-JD-BA Image Sensors applications.


  • Altimeter for drones
  • Scanner for SLAM data acquisition in mobile robots
  • People and object counting
  • Door opening, machine controlling and safeguarding
  • Volumetric mapping of objects
  • Automatic vehicle guidance
  • Low cost seating position detection in cars
  • Gesture control (man-machine interface)
  • Embedded Notebook,
  • Mobile Devices
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