ON Semiconductor KAI-16070-AXA-JD-B2
ON Semiconductor KAI-16070-AXA-JD-B2
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ON Semiconductor KAI-16070-AXA-JD-B2

Manufacturer No:

KAI-16070-AXA-JD-B2

Manufacturer:

ON Semiconductor

Utmel No:

1807-KAI-16070-AXA-JD-B2

Package:

71-BCPGA

Datasheet:

KAI-16070

ECAD Model:

Description:

CCD 7.4μmx7.4μm 1 (Unlimited) 4864H x 3232V 2 Frames per Second 71-BCPGA 14.5V~15.5V -50°C~70°C TA Bulk 70.5 dB

Quantity:

Unit Price: $18,033.608678

Ext Price: $18,033.61

Delivery:

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In Stock : 561

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $18,033.608678

    $18,033.61

  • 10

    $17,440.627348

    $174,406.27

  • 25

    $17,319.391607

    $432,984.79

  • 50

    $17,198.998617

    $859,949.93

  • 100

    $16,845.248400

    $1,684,524.84

  • 500

    $15,640.899165

    $7,820,449.58

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KAI-16070-AXA-JD-B2 information

Specifications
Documents & Media
Product Details
ON Semiconductor KAI-16070-AXA-JD-B2 technical specifications, attributes, parameters and parts with similar specifications to ON Semiconductor KAI-16070-AXA-JD-B2.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    LIFETIME (Last Updated: 2 weeks ago)
  • Factory Lead Time
    9 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    71-BCPGA
  • Number of Pins
    71
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -50°C~70°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Published
    2011
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Type
    CCD
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    IT HAS A SENSITIVITY OF 33 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT HAS OPTICAL FORMAT OF 1.37 INCH
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    14.5V~15.5V
  • Body Breadth

    Body breadth in electronic components refers to the width of the physical body of a component, such as a resistor, capacitor, or integrated circuit. This measurement is crucial for ensuring proper fit within a circuit board or enclosure. It can affect the component's thermal performance, mechanical stability, and overall compatibility with other components in a design. Body breadth is typically specified in millimeters or inches and is an important factor in the selection and design of electronic assemblies.

    45.34 mm
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    15.5V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    15V
  • Frames per Second

    used to measure frame rate – the number of consecutive full-screen images that are displayed each second.

    2
  • Pixel Size

    the horizontal and vertical measurements of an image expressed in pixels.

    7.4μmx7.4μm
  • Active Pixel Array

    The term "Active Pixel Array" refers to the area within an electronic component, such as a camera sensor or display panel, where individual pixels are located and actively capture or display images. This array is made up of a grid of tiny light-sensitive or light-emitting elements that work together to form the overall image. The size and arrangement of the active pixel array directly impact the resolution and quality of the images produced by the electronic component. By controlling the properties of the active pixel array, manufacturers can enhance the performance and capabilities of the device in terms of image clarity, color accuracy, and overall functionality.

    4864H x 3232V
  • Dynamic Range

    Dynamic range in electronic components refers to the ratio between the largest and smallest possible values of a signal that the component can accurately handle. It is a measure of the component's ability to accurately capture and reproduce a wide range of signal amplitudes. A larger dynamic range indicates that the component can handle a greater difference between the strongest and weakest signals without distortion or loss of detail. Dynamic range is an important specification in audio equipment, imaging devices, and other electronic systems where capturing a wide range of signal amplitudes is crucial for maintaining fidelity and accuracy.

    70.5 dB
  • Body Height

    In electronic components, "Body Height" refers to the vertical dimension of the component's physical body or package. It is the measurement from the bottom of the component to the top, excluding any leads or terminals. Body Height is an important parameter to consider when designing circuit boards or enclosures to ensure proper fit and clearance. It is typically specified in datasheets or technical drawings provided by the component manufacturer. Understanding the Body Height of electronic components is crucial for proper placement and integration within a circuit or system.

    3.61mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for ON Semiconductor KAI-16070-AXA-JD-B2.

Product Description

Description

The KAI-16070-AXA-JD-B2 is a high-performance Charge-Coupled Device (CCD) image sensor designed by ON Semiconductor. This sensor is optimized for applications requiring high sensitivity and dynamic range, making it suitable for a variety of imaging tasks. Despite being an older model, published in 2011, it remains a reliable choice for many applications due to its robust design and long lifecycle status.

Features

  • High Sensitivity: The sensor boasts a sensitivity of 33 microvolts per electron, ensuring it can capture detailed images even in low-light conditions.
  • Electronic Shutter: The electronic shutter allows for precise control over exposure times, enabling flexible capture settings.
  • Optical Format: With an optical format of 1.37 inches, this sensor is well-suited for various camera systems.
  • Active Pixel Array: The active pixel array measures 4864H x 3232V pixels, providing high resolution and detailed imaging capabilities.
  • Dynamic Range: The dynamic range of 70.5 dB ensures that the sensor can capture a wide range of brightness levels without losing detail in either the shadows or highlights.
  • Frames per Second: Operating at 2 frames per second, this sensor is ideal for applications where high-speed imaging is not the primary requirement.
  • Operating Temperature: It can operate within the range of -50°C to 70°C, making it suitable for use in various environmental conditions.
  • Mounting Options: Available in through-hole mounting with 71 pins, providing flexibility in circuit board design.

Applications

  1. Primary Applications:
  2. Industrial Inspection: The high sensitivity and dynamic range make it suitable for industrial inspection tasks where detailed images are crucial.
  3. Scientific Research: Its ability to capture high-resolution images in low-light conditions makes it useful in scientific research applications such as astronomy or microscopy.
  4. Medical Imaging: The sensor's sensitivity and resolution can be beneficial in medical imaging applications where detailed images are essential.

  5. Secondary Applications:

  6. Security Surveillance: While not the fastest frame rate, its high sensitivity makes it useful in low-light security surveillance systems.
  7. Automotive Systems: It could be used in automotive systems for tasks such as driver assistance or interior monitoring.

Alternative Parts

Due to its obsolescence, alternative parts may be necessary for new designs or upgrades. Some alternatives include: - ON Semiconductor's newer CCD models like the KAI-16070-AXA-JD-B3 or other third-party sensors with similar specifications.

Embedded Modules

This component is often used in custom camera modules designed for specific applications. It may be integrated into various embedded systems such as: - Industrial cameras - Scientific cameras - Medical imaging devices

In summary, the KAI-16070-AXA-JD-B2 remains a reliable choice for applications requiring high sensitivity and dynamic range despite being an older model. Its robust design ensures continued use in various imaging tasks across different industries.

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