Panduit Corp LCAX2/0-14H-X

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

The parameter "Body Material" in electronic components refers to the material used to construct the physical body or casing of the component. This material plays a crucial role in determining the component's durability, thermal conductivity, electrical insulation properties, and resistance to environmental factors such as moisture, heat, and mechanical stress. Common body materials for electronic components include plastics, ceramics, metals, and composites. Selecting the appropriate body material is essential to ensure the reliable performance and longevity of the electronic component in various operating conditions.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

In electronic components, "Depth" typically refers to the measurement of the distance from the front to the back of the component. It is an important parameter to consider when designing or selecting components for a project, as it determines how much space the component will occupy within a circuit or device. The depth of a component can impact the overall size and layout of the circuit board or enclosure in which it will be installed. It is usually specified in millimeters or inches and is crucial for ensuring proper fit and functionality within the intended application.

Contact finish refers to the surface coating or treatment applied to the electrical contacts of electronic components. This finish is crucial for ensuring reliable electrical connections and preventing corrosion or oxidation of the contacts. Common contact finishes include gold, silver, tin, and nickel, each offering different levels of conductivity, durability, and resistance to environmental factors. The choice of contact finish depends on the specific application requirements, such as operating conditions, cost considerations, and compatibility with other components in the circuit. Selecting the appropriate contact finish is essential for maintaining the performance and longevity of electronic devices.

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

Body Plating in electronic components refers to a process where a thin layer of metal is applied to the body of the component for various purposes such as improving electrical conductivity, corrosion resistance, and mechanical strength. This plating is typically done using techniques like electroplating or chemical deposition. The choice of plating material can vary depending on the specific requirements of the component and the application it is intended for. Overall, body plating plays a crucial role in enhancing the performance and durability of electronic components in various electronic devices and systems.

Insulation in electronic components refers to the material properties that prevent the flow of electric current between conductive parts. It is critical for ensuring safety and reliability in circuits by minimizing unintended current paths. High insulation resistance helps protect against short circuits and enhances the durability of electronic devices by insulating high-voltage components from sensitive areas. Insulation can also affect signal integrity and can be a key factor in high-frequency applications.

Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.

Stud/Tab Size is a parameter used to describe the physical dimensions of a stud or tab on an electronic component, such as a diode or transistor. This measurement typically refers to the diameter or width of the stud or tab, which is used for mounting or connecting the component to a circuit board or other components. The stud/tab size is important for ensuring proper fit and compatibility with other components or mounting hardware. Manufacturers provide specifications for stud/tab size to help users select the appropriate components for their specific application requirements.

The term "Terminal Style" in electronic components refers to the physical design and configuration of the terminals or connection points on the component. These terminals are used for connecting the component to a circuit or other components. The terminal style can vary depending on the type of component and its intended application.Common terminal styles include through-hole, surface mount, wire lead, and solder tab terminals. Through-hole terminals are typically cylindrical pins that pass through holes in a circuit board for soldering. Surface mount terminals are flat pads on the surface of the component that are soldered directly to the circuit board. Wire lead terminals are wires attached to the component for connection, while solder tab terminals are metal tabs that are soldered to the circuit board.The choice of terminal style can impact the ease of assembly, reliability, and overall performance of the electronic component in a circuit. Designers must consider the terminal style when selecting components to ensure compatibility with the circuit design and manufacturing processes.

Width - Outer Edges is a parameter used to describe the physical dimensions of an electronic component, specifically referring to the measurement of the outer edges of the component. This parameter typically indicates the distance between the outermost points of the component, providing important information for designing and fitting the component into a circuit or system. Understanding the width of the outer edges is crucial for ensuring proper alignment and spacing within the overall electronic assembly. Manufacturers often provide this specification in datasheets to help engineers and designers accurately incorporate the component into their projects.

Tab Thickness in electronic components refers to the thickness of the metal tab or lead that is used for electrical connections. This parameter is important as it determines the durability and conductivity of the component. A thicker tab can provide better current-carrying capacity and mechanical strength, while a thinner tab may be more suitable for applications where space is limited. Manufacturers specify the tab thickness in their component datasheets to ensure proper performance and compatibility with the intended application. It is essential to consider the tab thickness when selecting electronic components to ensure reliable operation and longevity of the device.

The parameter "Diameter - Barrel ID" in electronic components refers to the inner diameter of the barrel or cylindrical part of a component, such as a connector or a jack. This measurement is important for ensuring compatibility and proper fit with other components or cables that need to be inserted into the barrel. A precise measurement of the diameter helps in determining the appropriate size of connectors or cables that can be accommodated by the component. It is a critical specification to consider when designing or selecting components for electronic assemblies to ensure proper functionality and connectivity.

The parameter "Diameter - Barrel OD" in electronic components refers to the outer diameter of the barrel or cylindrical body of a component, such as a connector or a jack. This measurement is important for ensuring proper fit and compatibility with other components or devices. The diameter of the barrel OD is typically specified in millimeters or inches and is a critical dimension for designing and manufacturing electronic assemblies. It is essential to accurately measure and specify this parameter to avoid compatibility issues and ensure the proper functioning of the electronic system.

Diameter - Ring ID refers to the internal diameter measurement of a ring component used in electronic assemblies. It is crucial for ensuring proper fit and alignment within circuits or housings. This parameter helps in determining compatibility with other components and in optimizing the performance of the device. Accurate measurement of the Ring ID is essential for maintaining electrical integrity and mechanical stability in electronic applications.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.