Preci-Dip 90029-AS

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Contact Type in electronic components refers to the specific design and configuration of the electrical contacts used to establish connections between components or devices. The contact type determines how the electrical signals are transmitted between the components, and it can vary based on factors such as the application requirements, signal type, and environmental conditions. Common contact types include pin contacts, socket contacts, surface mount contacts, and wire-to-board contacts. Understanding the contact type is crucial for ensuring proper connectivity and reliable performance in electronic systems.

The parameter "Current Rating (Amps)" in electronic components refers to the maximum amount of electrical current that the component can safely handle without being damaged. It is typically measured in amperes (A) and is an important specification to consider when designing or selecting components for a circuit. Exceeding the current rating of a component can lead to overheating, malfunction, or even failure of the component. It is crucial to ensure that the current rating of a component matches the requirements of the circuit to prevent any potential issues and ensure reliable operation.

Contact finish refers to the surface coating or treatment applied to the electrical contacts of electronic components. This finish is crucial for ensuring reliable electrical connections and preventing corrosion or oxidation of the contacts. Common contact finishes include gold, silver, tin, and nickel, each offering different levels of conductivity, durability, and resistance to environmental factors. The choice of contact finish depends on the specific application requirements, such as operating conditions, cost considerations, and compatibility with other components in the circuit. Selecting the appropriate contact finish is essential for maintaining the performance and longevity of electronic devices.

to the number of a times a physical connector can “mate” or connect to it's counterpart.

Plunger size in electronic components refers to the dimensions and specifications of the plunger mechanism used in devices like relays, solenoids, or switches. It is critical for determining the mechanical performance, actuation force, and compatibility with specific applications. The size affects the overall design, efficiency, and reliability of the component, influencing how effectively it engages or disengages circuits or mechanical systems. Proper consideration of plunger size is essential for achieving the desired operational characteristics in electronic assemblies.

Operating Force - Initial is a parameter used to describe the amount of force required to actuate or operate an electronic component, such as a switch or button, when it is brand new or in its initial state. This force is typically measured in units of grams or newtons. It is an important specification as it determines the tactile feedback and feel of the component when it is pressed or activated. A higher operating force may require more effort to operate the component, while a lower operating force may result in a more sensitive or easier-to-press component. Manufacturers provide this specification to help users understand the physical characteristics of the component and ensure it meets the desired performance requirements for a particular application.

Pad Layout Dimension in electronic components refers to the physical dimensions and arrangement of the pads on a printed circuit board (PCB) or other electronic device where components are mounted. These pads are used for soldering the electronic components onto the PCB. The pad layout dimension includes parameters such as pad size, pad spacing, and pad shape, which are crucial for ensuring proper alignment and connection of the components during the assembly process. The pad layout dimension is typically specified in the component's datasheet or design documentation to guide manufacturers and designers in creating a reliable and functional electronic product.

The parameter "Minimum Working Height" in electronic components refers to the minimum distance required between the component and any other object or surface for proper operation, maintenance, or servicing. This specification is crucial to ensure that there is enough space around the component for safe and effective handling, such as soldering, testing, or troubleshooting. It helps prevent potential damage to the component or surrounding components due to heat, electromagnetic interference, or physical contact. Manufacturers provide this information to guide users in setting up and working with the electronic components in a way that ensures optimal performance and longevity.

Operating Force - Mid Compression is a parameter that refers to the amount of force required to activate a switch or button on an electronic component at the midpoint of its compression range. This measurement is important in determining the tactile feedback and responsiveness of the component when it is being used. A higher operating force indicates that more pressure is needed to activate the switch, while a lower operating force means that less pressure is required. Manufacturers provide this specification to help users understand the feel and functionality of the component before incorporating it into their designs.

Contact Finish Thickness refers to the measurement of the layer of conductive material applied to the surfaces of electrical contacts in electronic components. This thickness is critical as it influences the electrical conductivity, solderability, wear resistance, and overall performance of the connection. The materials used for the contact finish can include gold, silver, or other metals, and the specified thickness is designed to ensure reliable operation over the component's lifespan.

Stack Height (Max) refers to the maximum vertical distance between the lowest point of a component and the highest point of its structure when assembled. This parameter is crucial in determining the physical compatibility of components within a given space in electronic designs. It helps ensure that components fit within specified dimensions and meet design constraints, particularly in compact or densely populated circuit boards.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.