Pulse Electronics Network EX2024FNLT

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.

Inductance is a property of an electrical component that quantifies its ability to store energy in a magnetic field when electric current flows through it. It is measured in henries and indicates how much voltage is induced in the component as a result of a change in current. Inductance is an essential characteristic in coils, inductors, and transformers, affecting the behavior of electrical circuits, particularly in alternating current applications. Higher inductance values usually correlate with larger coils or more turns of wire in the component.

DC Resistance (DCR) is a measure of the resistance of an electronic component when a direct current (DC) is applied. It quantifies how much opposition the component presents to the flow of electrical current under steady-state conditions. DCR is crucial for understanding power loss, heating, and efficient performance in circuits, as it affects the overall behavior of components such as inductors, transformers, and resistors. Lower DCR values typically indicate better efficiency and performance in a given application.

Isolation voltage refers to a test of the ability of an insulator to minimize the flow of electric current with a high applied voltage.

A variety of types of electrical transformer are made for different purposes. Despite their design differences, the various types employ the same basic principle as discovered in 1831 by Michael Faraday, and share several key functional parts.

The parameter "Turns Ratio - Primary:Secondary" in electronic components refers to the ratio of the number of turns in the primary winding to the number of turns in the secondary winding of a transformer or inductor. It is a crucial specification that determines the voltage transformation capability of the component. A higher turns ratio results in a higher voltage output relative to the input, while a lower turns ratio results in a lower voltage output. This parameter is essential for designing and selecting transformers and inductors for various applications, such as voltage regulation, impedance matching, and signal isolation.

Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.