ROHM Semiconductor MCR18EZHJ1R0
ROHM Semiconductor MCR18EZHJ1R0
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ROHM Semiconductor MCR18EZHJ1R0

Chip Resistor - SMD 1Ohm ±5% 0.25W 1/4W 1206 (3216 Metric)

Manufacturer No:

MCR18EZHJ1R0

Tiny WHSL

Manufacturer:

ROHM Semiconductor

Utmel No:

2078-MCR18EZHJ1R0

Package:

1206 (3216 Metric)

ECAD Model:

Description:

RES SMD 1 OHM 5% 1/4W 1206

Quantity:

Unit Price: $0.003945

Ext Price: $0.01

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

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In Stock : 421499

Minimum: 5 Multiples: 1

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
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MCR18EZHJ1R0 information

Specifications
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Product Comparison
ROHM Semiconductor MCR18EZHJ1R0 technical specifications, attributes, parameters and parts with similar specifications to ROHM Semiconductor MCR18EZHJ1R0.
  • Type
    Parameter
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    1206 (3216 Metric)
  • Terminal Shape

    Terminal Shape in electronic components refers to the physical design of the connection points on the component that allow for electrical connections to be made. These terminals can come in various shapes such as pins, leads, pads, or terminals with specific configurations like surface mount or through-hole. The terminal shape is important as it determines how the component can be mounted on a circuit board or connected to other components. Different terminal shapes are used based on the specific requirements of the electronic circuit design and manufacturing process.

    WRAPAROUND
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C~155°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    MCR
  • Published
    2001
  • Size / Dimension

    In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

    0.126Lx0.063W 3.20mmx1.60mm
  • Tolerance

    In electronic components, "tolerance" refers to the acceptable deviation or variation from the specified or ideal value of a particular parameter, such as resistance, capacitance, or voltage. It indicates the range within which the actual value of the component can fluctuate while still being considered acceptable for use in a circuit. Tolerance is typically expressed as a percentage or a specific value and is important for ensuring the accuracy and reliability of electronic devices. Components with tighter tolerances are more precise but may also be more expensive. It is crucial to consider tolerance when selecting components to ensure proper functionality and performance of the circuit.

    ±5%
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Discontinued
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    2
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    150/ +850ppm/°C
  • Resistance

    Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.

    1Ohm
  • Composition

    Parameter "Composition" in electronic components refers to the specific materials and substances used in the construction of the component. It encompasses the chemical and physical elements that make up the component, influencing its electrical, thermal, and mechanical properties. The composition can affect the performance, reliability, and durability of the component in various applications. Understanding the composition is essential for optimizing the design and functionality of electronic devices.

    Thick Film
  • Power (Watts)

    The parameter "Power (Watts)" in electronic components refers to the amount of electrical energy consumed or dissipated by the component. It is a measure of how much energy the component can handle or generate. Power is typically measured in watts, which is a unit of power that indicates the rate at which energy is transferred. Understanding the power rating of electronic components is crucial for ensuring they operate within their specified limits to prevent overheating and potential damage. It is important to consider power requirements when designing circuits or selecting components to ensure proper functionality and reliability.

    0.25W 1/4W
  • Power Rating

    The "Power Rating" of an electronic component refers to the maximum amount of power that the component can handle or dissipate without being damaged. It is typically measured in watts and is an important specification to consider when designing or selecting components for a circuit. Exceeding the power rating of a component can lead to overheating, malfunction, or even permanent damage. It is crucial to ensure that the power rating of each component in a circuit is sufficient to handle the power levels expected during normal operation to maintain the reliability and longevity of the electronic system.

    250mW
  • Voltage - Rated DC

    Voltage - Rated DC is a parameter that specifies the maximum direct current (DC) voltage that an electronic component can safely handle without being damaged. This rating is crucial for ensuring the proper functioning and longevity of the component in a circuit. Exceeding the rated DC voltage can lead to overheating, breakdown, or even permanent damage to the component. It is important to carefully consider this parameter when designing or selecting components for a circuit to prevent any potential issues related to voltage overload.

    200V
  • Packing Method

    The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.

    TR, PAPER, 7 INCH
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    250mW
  • Construction

    Construction in electronic components refers to the design and materials used in the manufacturing of the components. It encompasses the physical structure, arrangement, and integration of various parts like substrates, conductors, and insulators. The construction impacts the performance, reliability, and thermal properties of the component, influencing how it interacts with electrical signals and other components in a circuit. Different construction techniques can also affect the size, weight, and cost of the electronic component.

    Rectangular
  • Resistor Type

    The parameter "Resistor Type" in electronic components refers to the specific material and construction of a resistor that determines its electrical properties and performance characteristics. There are various types of resistors available, such as carbon film, metal film, wirewound, and thick film resistors, each with its own advantages and applications. The resistor type affects factors like tolerance, temperature coefficient, power rating, and stability, which are important considerations when selecting a resistor for a particular circuit. Choosing the right resistor type is crucial for ensuring proper functionality and reliability of electronic devices and circuits.

    FIXED RESISTOR
  • Case Code (Metric)

    Case Code (Metric) in electronic components refers to a standardized system that specifies the dimensions of surface-mount devices (SMD) in millimeters, consisting of a four-digit number where the first two digits represent the width and the last two digits represent the height of the component, measured in tenths of a millimeter. The metric case codes are standardized by organizations such as the EIA and IEC, and are often compared to the Imperial code which uses inches, allowing for easier identification and selection of components across different regions and industries. This coding system is widely used in the design and manufacturing of electronic devices, particularly in applications requiring compact and efficient component layouts, and is essential for engineers and designers to ensure proper component selection and facilitate the assembly process in electronic manufacturing.

    3216
  • Case Code (Imperial)

    The term "Case Code (Imperial)" in electronic components refers to a standardized system used to specify the physical dimensions and package types of components, particularly capacitors and resistors. This code helps manufacturers and engineers identify the size and form factor of the component, ensuring compatibility with circuit designs and PCB layouts. In the context of electronic components, the Case Code (Imperial) typically follows a numerical format that indicates the length and width of the component in inches. For example, a Case Code of 1206 signifies a component that measures 0.12 inches by 0.06 inches. This coding system is essential for selecting the correct components for specific applications, as it provides a quick reference to the physical characteristics of the part, including its footprint and mounting style.

    1206
  • Height
    660.4μm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    0.026 0.65mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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