Sharp Microelectronics GP2A200LCS
Sharp Microelectronics GP2A200LCS
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Sharp Microelectronics GP2A200LCS

Manufacturer No:

GP2A200LCS

Utmel No:

2201-GP2A200LCS

Package:

Module, Connector

Datasheet:

GP2A200LCS

ECAD Model:

Description:

SENSOR OPT REFL 5MM-15MM MODULE

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
GP2A200LCS information

Specifications
Documents & Media
Sharp Microelectronics GP2A200LCS technical specifications, attributes, parameters and parts with similar specifications to Sharp Microelectronics GP2A200LCS.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Chassis Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Chassis Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    Module, Connector
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Published
    1999
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    4.75V~5.25V
  • Output Current

    The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.

    30mA
  • Sensing Distance

    It is the sensing range for which the sensor can stably detect the standard sensing object even if there is an ambient temperature drift and/or supply voltage fluctuation. (Normally, it is 70 to 80 % of the maximum operation distance.)

    0.197 ~ 0.591 (5mm ~ 15mm) ADJ
  • Sensing Method

    The sensing method in electronic components refers to the technique or mechanism used to detect and measure physical phenomena such as temperature, pressure, light, or motion. This includes a variety of technologies such as resistive, capacitive, inductive, and optical sensing methods. The choice of sensing method affects the accuracy, response time, and application suitability of the electronic component. It plays a crucial role in determining how effectively a device can interact with and interpret its environment.

    Reflective
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    Long Focal Distance
  • Sensing Object

    The parameter "Sensing Object" in electronic components refers to the specific type of object or material that the component is designed to detect or interact with. This parameter is crucial in determining the functionality and application of the electronic component. For example, in sensors, the sensing object could be temperature, pressure, light, motion, or any other physical quantity that needs to be measured or monitored.Understanding the sensing object is essential for selecting the right electronic component for a particular application. Different components are designed to sense different types of objects, so knowing the sensing object helps in choosing the most suitable component for the desired functionality. Additionally, the sensing object parameter also influences the sensitivity, accuracy, and reliability of the electronic component in detecting and responding to changes in the environment or system it is monitoring.

    Black Paper, Kodak® Gray Card, White Paper
  • Sensing Light

    a photoelectric device that converts light energy (photons) detected to electrical energy (electrons).

    Infrared
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Contains Lead
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Download datasheets and manufacturer documentation for Sharp Microelectronics GP2A200LCS.