Texas Instruments TUSB7340RKMR
Texas Instruments TUSB7340RKMR
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Texas Instruments TUSB7340RKMR

USB 3.0 USB, PCIe Controllers Interface ICs

Manufacturer No:

TUSB7340RKMR

Manufacturer:

Texas Instruments

Utmel No:

2502-TUSB7340RKMR

Package:

100-WQFN Dual Rows, Exposed Pad

ECAD Model:

Description:

1.1V 3.3V USB 3.0 USB, PCIe Controllers Interface ICs QUAD TUSB7340 100 Pins Host Controller 0.6mm 100-WQFN Dual Rows, Exposed Pad

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TUSB7340RKMR information

Specifications
Documents & Media
Product Details
Texas Instruments TUSB7340RKMR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments TUSB7340RKMR.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    NRND (Last Updated: 3 days ago)
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Gold
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    100-WQFN Dual Rows, Exposed Pad
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    100
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape (CT)
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Not For New Designs
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    100
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A001.A.3
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.1V 3.3V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.1V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.6mm
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    TUSB7340
  • Function

    The parameter "Function" in electronic components refers to the specific role or purpose that the component serves within an electronic circuit. It defines how the component interacts with other elements, influences the flow of electrical signals, and contributes to the overall behavior of the system. Functions can include amplification, signal processing, switching, filtering, and energy storage, among others. Understanding the function of each component is essential for designing effective and efficient electronic systems.

    Host Controller
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    USB, PCIe
  • Operating Supply Current

    Operating Supply Current, also known as supply current or quiescent current, is a crucial parameter in electronic components that indicates the amount of current required for the device to operate under normal conditions. It represents the current drawn by the component from the power supply while it is functioning. This parameter is important for determining the power consumption of the component and is typically specified in datasheets to help designers calculate the overall power requirements of their circuits. Understanding the operating supply current is essential for ensuring proper functionality and efficiency of electronic systems.

    15μA
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    4
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    BUS CONTROLLER, UNIVERSAL SERIAL BUS
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    50MHz
  • Protocol

    In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.

    USB
  • Standards

    The parameter "Standards" in electronic components refers to established criteria or specifications that ensure interoperability, safety, and performance across various electronic devices and systems. These standards are often set by recognized organizations and describe the characteristics, dimensions, and testing methods for components. Adherence to these standards helps manufacturers produce compatible and reliable products, facilitates communication between devices, and ensures compliance with regulatory requirements. Standards play a crucial role in the consistency and quality of electronic components in the industry.

    USB 3.0
  • Bus Compatibility

    Bus compatibility in electronic components refers to the ability of a device to communicate effectively with other devices on a shared data bus. This parameter is crucial in ensuring that different components can exchange information seamlessly and operate together without compatibility issues. It involves factors such as voltage levels, signal timing, and data protocols that need to be standardized for proper communication. Components with good bus compatibility can work together efficiently in a system, while those with poor compatibility may lead to communication errors or system malfunctions. Manufacturers often specify the bus compatibility of their components to help users ensure proper integration and functionality within their electronic systems.

    PCI; I2C
  • Data Transfer Rate-Max

    The parameter "Data Transfer Rate-Max" in electronic components refers to the maximum rate at which data can be transferred between different devices or components within a system. It is typically measured in bits per second (bps) or bytes per second (Bps) and indicates the peak speed at which data can be transmitted. This parameter is crucial for determining the overall performance and efficiency of a system, especially in applications where high-speed data transfer is essential, such as in networking equipment, storage devices, and communication systems. Manufacturers often specify the Data Transfer Rate-Max to help users understand the capabilities and limitations of the component when it comes to transferring data quickly and reliably.

    625 MBps
  • Height
    800μm
  • Length
    9mm
  • Width
    9mm
  • Thickness

    Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

    750μm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for Texas Instruments TUSB7340RKMR.

Product Description:

The TUSB7340RKMR is a high-performance, low-power USB 3.0 host controller from Texas Instruments, designed to provide a reliable and efficient interface between a host system and USB devices. This 100-pin WQFN package is compatible with both PCI and I2C buses, making it an ideal solution for a wide range of applications.

Features:

  • High-speed data transfer rate of up to 625 MBps
  • Low power consumption of 15μA
  • Operating temperature range of 0°C to 70°C
  • Compatible with USB 3.0 standards
  • Lead-free and RoHS3 compliant
  • Radiation hardened for reliable performance

Applications:

  • Primary applications: Embedded systems, industrial automation, medical devices, and consumer electronics
  • Secondary applications: Automotive systems, aerospace, and defense

Alternative Parts:

  • TUSB7340RMR (similar specifications but with a different package)
  • TUSB7340RMRG4 (similar specifications but with a different lead-free status)

Embedded Modules:

  • This component is used in various embedded systems, including:
    • Industrial control systems
    • Medical devices
    • Consumer electronics
    • Automotive systems

FAQs:

Q: What is the maximum data transfer rate of the TUSB7340RKMR? A: The maximum data transfer rate is 625 MBps.

Q: What is the operating temperature range of the TUSB7340RKMR? A: The operating temperature range is 0°C to 70°C.

Q: Is the TUSB7340RKMR compatible with USB 3.0 standards? A: Yes, the TUSB7340RKMR is compatible with USB 3.0 standards.

Q: What is the power consumption of the TUSB7340RKMR? A: The power consumption is 15μA.

Q: Is the TUSB7340RKMR lead-free? A: Yes, the TUSB7340RKMR is lead-free and RoHS3 compliant.

Q: What is the package type of the TUSB7340RKMR? A: The package type is 100-WQFN Dual Rows, Exposed Pad.

Q: What is the packaging type of the TUSB7340RKMR? A: The packaging type is Cut Tape (CT).

Q: Is the TUSB7340RKMR suitable for new designs? A: No, the TUSB7340RKMR is not suitable for new designs due to its lifecycle status of NRND (Not Recommended for New Designs).

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