TT Electronics/Optek Technology OPB865T55
TT Electronics/Optek Technology OPB865T55
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TT Electronics/Optek Technology OPB865T55

Manufacturer No:

OPB865T55

Utmel No:

1815-OPB865T55

Package:

PCB Mount

ECAD Model:

Description:

SENSOR OPT SLOT PHOTOTRAN PCB MT

Quantity:

Unit Price: $3.105096

Ext Price: $3.11

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 476

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $3.105096

    $3.11

  • 10

    $2.929336

    $29.29

  • 100

    $2.763524

    $276.35

  • 500

    $2.607098

    $1,303.55

  • 1000

    $2.459527

    $2,459.53

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
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OPB865T55 information

Specifications
Documents & Media
Product Comparison
TT Electronics/Optek Technology OPB865T55 technical specifications, attributes, parameters and parts with similar specifications to TT Electronics/Optek Technology OPB865T55.
  • Type
    Parameter
  • Factory Lead Time
    12 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Screw, Through Hole
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    PCB Mount
  • Number of Pins
    4
  • Collector-Emitter Breakdown Voltage
    30V
  • Current-Collector (Ic) (Max)
    30mA
  • Number of Elements
    1
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Published
    2011
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Type
    Unamplified
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -40°C
  • Output Configuration

    Output Configuration in electronic components refers to the arrangement or setup of the output pins or terminals of a device. It defines how the output signals are structured and how they interact with external circuits or devices. The output configuration can determine the functionality and compatibility of the component in a circuit design. Common types of output configurations include single-ended, differential, open-drain, and push-pull configurations, each serving different purposes and applications in electronic systems. Understanding the output configuration of a component is crucial for proper integration and operation within a circuit.

    Phototransistor
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    100mW
  • Forward Current

    Current which flows upon application of forward voltage.

    50mA
  • Collector Emitter Voltage (VCEO)

    Collector-Emitter Voltage (VCEO) is a key parameter in electronic components, particularly in transistors. It refers to the maximum voltage that can be applied between the collector and emitter terminals of a transistor while the base terminal is open or not conducting. Exceeding this voltage limit can lead to breakdown and potential damage to the transistor. VCEO is crucial for ensuring the safe and reliable operation of the transistor within its specified limits. Designers must carefully consider VCEO when selecting transistors for a circuit to prevent overvoltage conditions that could compromise the performance and longevity of the component.

    30V
  • Max Collector Current

    Max Collector Current is a parameter used to specify the maximum amount of current that can safely flow through the collector terminal of a transistor or other electronic component without causing damage. It is typically expressed in units of amperes (A) and is an important consideration when designing circuits to ensure that the component operates within its safe operating limits. Exceeding the specified max collector current can lead to overheating, degradation of performance, or even permanent damage to the component. Designers must carefully consider this parameter when selecting components and designing circuits to ensure reliable and safe operation.

    30mA
  • Sensing Distance

    It is the sensing range for which the sensor can stably detect the standard sensing object even if there is an ambient temperature drift and/or supply voltage fluctuation. (Normally, it is 70 to 80 % of the maximum operation distance.)

    0.125 (3.18mm)
  • Voltage - Collector Emitter Breakdown (Max)

    Voltage - Collector Emitter Breakdown (Max) is a parameter that specifies the maximum voltage that can be applied between the collector and emitter terminals of a transistor or other semiconductor device before it breaks down and allows excessive current to flow. This parameter is crucial for ensuring the safe and reliable operation of the component within its specified limits. Exceeding the maximum breakdown voltage can lead to permanent damage or failure of the device. Designers and engineers must carefully consider this parameter when selecting components for their circuits to prevent potential issues and ensure proper functionality.

    30V
  • Reverse Breakdown Voltage

    Reverse Breakdown Voltage is the maximum reverse voltage a semiconductor device can withstand before it starts to conduct heavily in the reverse direction. It is a critical parameter in diodes and other components, indicating the threshold at which the material's insulating properties fail. Beyond this voltage, the device may enter a breakdown region, leading to potential damage if not properly managed. This parameter is essential for ensuring safe operation and reliability in electronic circuits.

    2V
  • Sensing Method

    The sensing method in electronic components refers to the technique or mechanism used to detect and measure physical phenomena such as temperature, pressure, light, or motion. This includes a variety of technologies such as resistive, capacitive, inductive, and optical sensing methods. The choice of sensing method affects the accuracy, response time, and application suitability of the electronic component. It plays a crucial role in determining how effectively a device can interact with and interpret its environment.

    Through-Beam
  • Max Breakdown Voltage

    The "Max Breakdown Voltage" of an electronic component refers to the maximum voltage that the component can withstand across its terminals before it breaks down and allows current to flow uncontrollably. This parameter is crucial in determining the operating limits and safety margins of the component in a circuit. Exceeding the maximum breakdown voltage can lead to permanent damage or failure of the component. It is typically specified by the manufacturer in datasheets to guide engineers and designers in selecting the appropriate components for their applications.

    30V
  • Current - DC Forward (If) (Max)

    The parameter "Current - DC Forward (If) (Max)" in electronic components refers to the maximum forward current that can safely pass through the component without causing damage. This parameter is typically specified in datasheets for diodes and LEDs, indicating the maximum current that can flow through the component in the forward direction. Exceeding this maximum current rating can lead to overheating and potentially permanent damage to the component. It is important to ensure that the current flowing through the component does not exceed this specified maximum to maintain proper functionality and reliability.

    50mA
  • Touchscreen

    A touchscreen is a type of input device that allows users to interact with electronic devices by touching the display screen directly with their fingers or a stylus. It is a user-friendly interface that enables users to navigate through menus, input data, and perform various functions by simply touching the screen. Touchscreens can be found in a wide range of electronic devices such as smartphones, tablets, laptops, and interactive kiosks. They are designed to be intuitive and responsive, providing a more engaging and efficient user experience compared to traditional input methods like keyboards and mice. Touchscreens can be either resistive or capacitive, each with its own advantages and limitations in terms of accuracy, sensitivity, and durability.

    Infrared (IR)
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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