Xilinx Inc. XC7VX485T-2FFG1158I
Xilinx Inc. XC7VX485T-2FFG1158I
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Xilinx Inc. XC7VX485T-2FFG1158I

FPGAs Virtex®-7 XT FPGAs

Manufacturer No:

XC7VX485T-2FFG1158I

Manufacturer:

Xilinx Inc.

Utmel No:

2773-XC7VX485T-2FFG1158I

Package:

1156-BBGA, FCBGA

ECAD Model:

Description:

3.35mm mm FPGAs Virtex®-7 XT Series 1156-BBGA, FCBGA 1mm mm 1158

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In Stock : 9300

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XC7VX485T-2FFG1158I information

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Product Details
Product Comparison
Xilinx Inc. XC7VX485T-2FFG1158I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7VX485T-2FFG1158I.
  • Type
    Parameter
  • Factory Lead Time
    10 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    1156-BBGA, FCBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of I/Os
    350
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~100°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Virtex®-7 XT
  • Published
    2010
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e1
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    4 (72 Hours)
  • Number of Terminations
    1158
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A991.D
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    0.97V~1.03V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    XC7VX485T
  • Pin Count

    a count of all of the component leads (or pins)

    1158
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PBGA-B1158
  • Number of Outputs
    350
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    11.8V
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    4.5MB
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    1818MHz
  • Number of Inputs
    350
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    485760
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    37969920
  • Number of LABs/CLBs
    37950
  • Speed Grade

    Speed grade is a specification in electronic components that indicates the maximum operating speed at which the component can reliably function. It is commonly used for integrated circuits, particularly in digital logic devices and programmable logic devices. The speed grade is typically denoted by a number or letter code that correlates to the maximum frequency or propagation delay of the device, influencing its performance in high-speed applications. Components with higher speed grades are capable of faster processing and lower signal delay compared to those with lower grades.

    -2
  • Number of Registers
    607200
  • Combinatorial Delay of a CLB-Max

    The Combinatorial Delay of a CLB-Max in electronic components refers to the time it takes for a signal to propagate through a combinational logic block (CLB) within a Field-Programmable Gate Array (FPGA) to reach its output. This delay is influenced by factors such as the complexity of the logic function being implemented, the routing resources available, and the physical distance the signal needs to travel within the CLB. Understanding and optimizing the Combinatorial Delay of a CLB-Max is crucial in designing efficient and high-performance digital circuits, as it directly impacts the overall speed and functionality of the FPGA design. By minimizing this delay, designers can achieve faster operation and improved performance in their electronic systems.

    0.61 ns
  • Length
    35mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    3.35mm
  • Width
    35mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Xilinx Inc. XC7VX485T-2FFG1158I.

Product Description:

The XC7VX485T-2FFG1158I is a high-performance Field Programmable Gate Array (FPGA) from Xilinx Inc., part of the Virtex-7 XT series. This device is designed to provide exceptional logic density, high-speed performance, and low power consumption, making it an ideal choice for a wide range of applications.

Features:

  • High Logic Density: With 37950 LABs/CLBs and 485760 Logic Elements/Cells, this FPGA offers unparalleled logic density, allowing for complex designs to be implemented with ease.
  • High-Speed Performance: The XC7VX485T-2FFG1158I operates at a clock frequency of 1818MHz, ensuring fast data processing and transmission.
  • Large RAM Capacity: The device features 4.5MB of RAM, providing ample storage for data and program instructions.
  • Surface Mount Package: The 1156-BBGA, FCBGA package is designed for surface mount applications, making it easy to integrate into modern electronic systems.
  • Operating Temperature Range: The device operates within a temperature range of -40°C to 100°C, making it suitable for use in a variety of environments.

Applications:

  • Primary Applications:
  • High-performance computing and data processing
  • Advanced telecommunications and networking
  • High-speed digital signal processing
  • Secondary Applications:
  • Medical imaging and diagnostics
  • Aerospace and defense systems
  • Automotive electronics

Alternative Parts:

  • XC7VX485T-1FFG1158I
  • XC7VX485T-3FFG1158I

Embedded Modules:

  • Virtex-7 XT FPGA family
  • Zynq-7 XT SoC family

FAQs:

Q: What is the operating temperature range of the XC7VX485T-2FFG1158I? A: The operating temperature range is -40°C to 100°C.

Q: What is the clock frequency of the XC7VX485T-2FFG1158I? A: The clock frequency is 1818MHz.

Q: What is the RAM size of the XC7VX485T-2FFG1158I? A: The RAM size is 4.5MB.

Q: Is the XC7VX485T-2FFG1158I RoHS compliant? A: Yes, the device is ROHS3 compliant.

Q: What is the packaging type of the XC7VX485T-2FFG1158I? A: The packaging type is Tray.

Q: Is the XC7VX485T-2FFG1158I radiation hardened? A: No, the device is not radiation hardened.

Q: What is the supply voltage of the XC7VX485T-2FFG1158I? A: The supply voltage is 1V.

Q: What is the terminal finish of the XC7VX485T-2FFG1158I? A: The terminal finish is Tin/Silver/Copper (Sn/Ag/Cu).

The three parts on the right have similar specifications to Xilinx Inc. & XC7VX485T-2FFG1158I.