Xilinx Inc. XCV405E-8FG676C
Xilinx Inc. XCV405E-8FG676C
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Xilinx Inc. XCV405E-8FG676C

FPGAs Virtex®-E EM FPGAs

Manufacturer No:

XCV405E-8FG676C

Manufacturer:

Xilinx Inc.

Utmel No:

2773-XCV405E-8FG676C

Package:

676-BBGA, FCBGA

ECAD Model:

Description:

1.8V V FPGAs Virtex®-E EM Series 676-BBGA, FCBGA

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XCV405E-8FG676C information

Specifications
Documents & Media
Product Details
Xilinx Inc. XCV405E-8FG676C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCV405E-8FG676C.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    676-BBGA, FCBGA
  • Number of Pins
    676
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    676-FCBGA (27x27)
  • Number of I/Os
    404
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~85°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Virtex®-E EM
  • Published
    1999
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    0°C
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.71V~1.89V
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    XCV405E
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.8V
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    70kB
  • Number of Logic Elements/Cells
    10800
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    573440
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    129600
  • Number of LABs/CLBs
    2400
  • Number of Logic Blocks (LABs)
    2400
  • Speed Grade

    Speed grade is a specification in electronic components that indicates the maximum operating speed at which the component can reliably function. It is commonly used for integrated circuits, particularly in digital logic devices and programmable logic devices. The speed grade is typically denoted by a number or letter code that correlates to the maximum frequency or propagation delay of the device, influencing its performance in high-speed applications. Components with higher speed grades are capable of faster processing and lower signal delay compared to those with lower grades.

    8
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Contains Lead
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Download datasheets and manufacturer documentation for Xilinx Inc. XCV405E-8FG676C.

Xilinx XCV405E-8FG676C Virtex-E FPGA Technical Overview

Core Product Specifications

Logic Capacity: 129,600 gates with 2,400 CLBs delivering high-density programmable logic for complex digital signal processing applications
I/O Performance: 404 user I/Os enabling extensive connectivity for multi-interface system designs
Memory Resources: 70kB embedded RAM (573,440 total bits) optimizing data buffering and storage operations
Operating Range: 0°C to 85°C industrial temperature range with 1.8V core voltage for reliable operation

Technical Parameter Analysis

Logic Architecture Specifications

Parameter Value Application Benefit
Logic Elements 10,800 cells Supports complex algorithm implementation for telecommunications and DSP applications
CLB Count 2,400 blocks Enables modular design approach for scalable system architectures
Speed Grade -8 (fastest) Optimized for high-performance real-time processing requirements

Power and Environmental Specifications

  • Supply Voltage: 1.71V~1.89V nominal 1.8V - optimized for low-power operation while maintaining performance
  • Operating Temperature: 0°C~85°C TJ - industrial grade reliability for harsh environment deployment
  • Package Type: 676-FCBGA (27x27mm) - compact form factor for space-constrained applications
  • MSL Rating: Level 3 (168 Hours) - standard moisture sensitivity for manufacturing processes

Product Family & Classification

Virtex-E Series Positioning

Series: Virtex®-E EM (Enhanced Memory)

Industry Class: Commercial/Industrial Grade

Target Applications: High-performance computing, telecommunications infrastructure, digital signal processing

Architecture Generation: Second-generation Virtex platform with enhanced memory capabilities

Key Differentiators

  • Enhanced memory architecture with 70kB embedded RAM
  • High I/O count (404) for complex interfacing
  • Speed grade -8 for maximum performance
  • Industrial temperature range operation
  • Proven Virtex-E reliability and ecosystem support

⚠️ Important Product Status Notice

Part Status: Obsolete - This product is no longer in active production. Consider migration to current Xilinx FPGA families such as Zynq UltraScale+ or Versal for new designs. Existing inventory may be available through authorized distributors and surplus suppliers.

Technical Documentation & Resources

Available Documentation

  • Virtex-E FPGA Data Sheet: Complete electrical and timing specifications
  • Configuration Guide: Programming and configuration procedures
  • Package and Pinout Information: 676-FCBGA mechanical drawings and pin assignments
  • Application Notes: Design guidelines and best practices for Virtex-E implementation
  • Migration Guides: Transition paths to current FPGA families

Certification & Compliance

Regulatory Status

RoHS Compliance: Non-RoHS Compliant
Contains lead - suitable for legacy applications where RoHS exemptions apply
Quality Standards: ISO 9001 Manufacturing
Xilinx certified production processes
Radiation Hardening: No
Commercial grade - not suitable for space applications

Alternative Products & Migration Path

Recommended Alternatives

Current Generation Logic Capacity Key Advantages
Zynq-7000 Series 28K-444K Logic Cells ARM processor integration, lower power
Kintex-7 Series 41K-478K Logic Cells Higher performance, advanced DSP blocks
Artix-7 Series 16K-215K Logic Cells Cost-optimized, lower power consumption

Frequently Asked Questions

What is the maximum operating frequency for the XCV405E-8FG676C?

The speed grade -8 indicates this is the fastest version of the XCV405E, typically supporting system clock frequencies up to 200MHz depending on the design complexity and routing. Actual performance varies based on implementation and should be verified through timing analysis.

How much embedded memory is available in this FPGA?

The device includes 70kB of embedded RAM (573,440 total bits) distributed as block RAM resources. This memory can be configured as single or dual-port RAM, ROM, or FIFO structures to support various data storage and buffering requirements.

What development tools support the Virtex-E series?

Legacy Xilinx ISE Design Suite versions 6.1i through 14.7 support Virtex-E devices. For new designs, migration to Vivado-supported devices is recommended. The device is also supported by third-party synthesis tools like Synplify Pro.

Is this device suitable for automotive applications?

While the 0°C to 85°C operating range covers many automotive requirements, this commercial-grade device lacks automotive qualification (AEC-Q100). For automotive applications, consider current automotive-qualified Xilinx devices with extended temperature ranges.

What is the power consumption of this FPGA?

Power consumption varies significantly based on design utilization, clock frequency, and I/O activity. Typical static power is approximately 1-2W, with dynamic power scaling with switching activity. Use Xilinx Power Estimator tools for accurate power analysis based on your specific design.

Market Analysis & Supply Chain Status

Current Market Situation

Availability: Limited to existing inventory from authorized distributors and surplus suppliers. Lead times may be extended due to obsolete status.

Pricing Trends: Prices may fluctuate based on remaining inventory levels. Consider lifecycle buy strategies for critical applications.

Supply Chain Recommendations: Evaluate migration to current FPGA families for new designs. Maintain strategic inventory for existing product support requirements.

End-of-Life Timeline: Originally published in 1999, this device has completed its product lifecycle. Final shipments occurred several years ago, with support transitioning to legacy status.