Xilinx Inc. XCVU095-H1FFVC2104E
Xilinx Inc. XCVU095-H1FFVC2104E
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Xilinx Inc. XCVU095-H1FFVC2104E

FPGAs Virtex® UltraScale™ FPGAs

Manufacturer No:

XCVU095-H1FFVC2104E

Manufacturer:

Xilinx Inc.

Utmel No:

2773-XCVU095-H1FFVC2104E

Package:

2104-BBGA, FCBGA

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Description:

FPGAs Virtex® UltraScale™ Series 2104-BBGA, FCBGA

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XCVU095-H1FFVC2104E information

Specifications
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Product Details
Xilinx Inc. XCVU095-H1FFVC2104E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCVU095-H1FFVC2104E.
  • Type
    Parameter
  • Factory Lead Time
    10 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    2104-BBGA, FCBGA
  • Number of I/Os
    416
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~100°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Virtex® UltraScale™
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    4 (72 Hours)
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    0.922V~1.030V
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    1176000
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    62259200
  • Number of LABs/CLBs
    67200
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Xilinx Inc. XCVU095-H1FFVC2104E.

XCVU095-H1FFVC2104E Overview

A 2104-BBGA, FCBGA package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. A fundamental building block is made up of 1176000 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 0.922V~1.030V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Virtex® UltraScale™ series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~100°C TJ. It is for space saving reasons that this FPGA model is contained in Tray. The RAM bits that are offered by this fpga chips are 62259200. Fpga electronics contains 67200 LABs/CLBs in an array.

XCVU095-H1FFVC2104E Features

Up to 62259200 RAM bits

XCVU095-H1FFVC2104E Applications

There are a lot of Xilinx Inc.
XCVU095-H1FFVC2104E FPGAs applications.


  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
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