The FIN1027 series is a dual driver designed for high-speed interconnects utilizing Low Voltage Differential Signaling (LVDS) technology. The driver translates LVTTL signal levels to LVDS levels with a typical differential output swing of 350mV which provides low EMI at ultra-low power dissipation, even at high frequencies.
ON Semiconductor FIN1027 series Drivers Interface ICs
Comprehensive Guide to FIN1027 Integrated Circuits (ICs) Drivers Interface ICs
This post lists the Key Component Features, Diverse Applications, Associated Series Parts, Technical Documents(PDF Datasheets, User Guides), Frequently asked questions, and Related Series of ON Semiconductor FIN1027 series Drivers Interface ICs products.
FEATURES
- It is a dual driver designed for high-speed interconnects utilizing Low Voltage Differential Signaling (LVDS) technology
- The driver translates LVTTL signal levels to LVDS levels with a typical differential output swing of 350mV which provides low EMI at ultra-low power dissipation, even at high frequencies
- It has a data rate of 600Mbps
- It has a voltage supply of 3V ~ 3.6V
- It has an operating temperature range of -40°C ~ 85°C
Applications
- Datacom module
- Building automation
Associated Products
Part Number | Description | Stock | RFQ |
---|---|---|---|
FIN1027MX | LVDS Driver 0.45V 8-Pin SOIC N T/R | 124844 | BUY |
FIN1027K8X | IC DRIVER DUAL 3.3V HS LVDS US8 | 23405 | BUY |
FIN1027M | LVDS Driver 0.45V 8-Pin SOIC N Tray | 25255 | RFQ |
FIN1027AM | IC DRIVER 3.3V LVDS HS 8SOIC | 0 | RFQ |
FIN1027AMX | IC DRIVER 3.3V LVDS HS 8-SOIC | 2100 | BUY |
Technical Documents
- FIN1027(A)
- Material Declaration FIN1027AMX
- Mold Compound 12/Sept/2008
- Logo 17/Aug/2017
- Assembly/Test Site Addition 24/Sep/2014
- Mult Devices 24/Oct/2017
- Mult MSL1 Pkg Chg 20/Dec/2018
- FIN1027/A
- Mold Compound 27/Aug/2008
- Fairchild-Semiconductor-company-9.pdf
- 3Q Mult Dev EOL 9/Nov/2017
Frequently Asked Questions
Where can we use ON Semiconductor FIN1027 series Drivers Interface ICs
The FIN1027 series is a dual driver designed for high-speed interconnects utilizing Low Voltage Differential Signaling (LVDS) technology . It is used in applications such as: High-speed data transmission. Clock distribution. Data acquisition systems.