Würth Elektronik 74270001

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

In the context of electronic components, the parameter "Design" refers to the specific configuration, layout, and structure of the component. It encompasses the physical and electrical characteristics that determine how the component functions within a circuit or system. The design of an electronic component includes considerations such as the materials used, the dimensions, the connections, and the overall performance specifications. A well-designed electronic component is crucial for ensuring optimal functionality, reliability, and efficiency in electronic devices and systems. Manufacturers carefully engineer the design of electronic components to meet the desired performance requirements and to ensure compatibility with other components in a circuit.

Impedance @ Frequency in electronic components refers to the measurement of a component's impedance at a specific frequency. Impedance is a complex quantity that combines resistance and reactance, and it varies with frequency due to the influence of both inductive and capacitive elements within the component.

The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.

Outer Dimension in electronic components refers to the physical size and shape of the component, typically measured in terms of length, width, and height. It is an important parameter as it determines how the component will fit into a circuit board or housing. The outer dimension also plays a crucial role in determining the overall size and form factor of the electronic device in which the component will be used. Manufacturers provide detailed specifications for the outer dimensions of electronic components to ensure compatibility and proper integration within electronic systems.

The parameter "Diameter - Inside" in electronic components refers to the measurement of the inner diameter of a component, such as a connector, socket, or housing. This measurement is crucial for ensuring proper fit and compatibility with other components or devices. It helps determine the size of the opening or cavity within the component where other parts or components will be inserted or connected. Understanding the "Diameter - Inside" specification is important for selecting the right components for a specific application and ensuring seamless integration within an electronic system.

The parameter "Diameter - Inner" in electronic components refers to the measurement of the inner diameter of a circular component, such as a hole or a ring. This measurement is crucial for determining the compatibility and fit of other components that need to be inserted or mounted within the circular space. It is commonly used in various electronic devices and circuit boards where precise dimensions are essential for proper functioning and assembly. The inner diameter measurement helps ensure that components are securely and accurately positioned within the designated space, preventing any potential issues with connectivity or performance.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.