Diotec Semiconductor AG B500S15A
Diotec Semiconductor AG B500S15A
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Diotec Semiconductor AG B500S15A

Manufacturer No:

B500S15A

Utmel No:

672-B500S15A

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-

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Description:

BRIDGE RECTIFIER DIODE SILICON NOT SPECIFIED DUAL Tape and Reel

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The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
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B500S15A information

Specifications
Documents & Media
Product Details
Diotec Semiconductor AG B500S15A technical specifications, attributes, parameters and parts with similar specifications to Diotec Semiconductor AG B500S15A.
  • Type
    Parameter
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Diode Element Material

    The parameter "Diode Element Material" refers to the specific semiconductor material used in the construction of a diode. This material determines the electrical characteristics and performance of the diode, including its forward voltage drop, reverse breakdown voltage, and switching speed. Common diode element materials include silicon, germanium, and gallium arsenide, each offering different advantages for various applications. The choice of material impacts the diode's efficiency, thermal stability, and overall suitability for specific electronic circuits.

    SILICON
  • Number of Terminals
    4
  • ECCN (US)
    EAR99
  • HTS
    8541.10.00.80
  • Bridge Type
    Single Phase
  • Peak Reverse Repetitive Voltage (V)
    1000
  • Peak Average Forward Current (A)
    1.5@Ta=50C
  • Peak RMS Reverse Voltage (V)
    500
  • Peak Non-Repetitive Forward Surge Current (A)
    50
  • Peak Forward Voltage (V)
    1.1@1A
  • Peak Reverse Current (uA)
    5
  • Peak Reverse Recovery Time (ns)
    1500(Typ)
  • Minimum Operating Temperature (°C)
    -50
  • Maximum Operating Temperature (°C)
    150
  • Supplier Temperature Grade
    Commercial
  • AEC Qualified
    Yes
  • Supplier Package
    SO-DIP SMD
  • Military
    No
  • Mounting
    Surface Mount
  • Package Height
    2.5
  • Package Length
    8.3
  • Package Width
    6.4
  • PCB changed
    4
  • Peak Rep Rev Volt
    1000(V)
  • Operating Temperature Classification
    Automotive
  • Avg. Forward Curr (Max)
    1.5(A)
  • Package Type
    SO-DIP SMD
  • Phase Type
    Single Phase
  • Rev Curr
    5(mA)
  • Operating Temp Range
    -50C to 150C
  • Number of Elements
    1
  • RMS Voltage (Max)
    500(V)
  • Peak Non-Repetitive Surge Current (Max)
    50(A)
  • Rad Hardened
    No
  • Package Description
    R-PDSO-G4
  • Package Style
    SMALL OUTLINE
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Min
    -50 °C
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Operating Temperature-Max
    150 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    B500S15A
  • Package Shape
    RECTANGULAR
  • Manufacturer
    Diotec Semiconductor AG
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    DIOTEC SEMICONDUCTOR AG
  • Part Package Code
    DIP
  • Risk Rank
    1.73
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    UL RECOGNIZED
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8541.10.00.80
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    compliant
  • Pin Count

    a count of all of the component leads (or pins)

    4
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PDSO-G4
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    Single
  • Diode Type

    In electronic components, the parameter "Diode Type" refers to the specific type or configuration of a diode, which is a semiconductor device that allows current to flow in one direction only. There are various types of diodes, each designed for specific applications and functions. Common diode types include rectifier diodes, zener diodes, light-emitting diodes (LEDs), and Schottky diodes, among others. The diode type determines the diode's characteristics, such as forward voltage drop, reverse breakdown voltage, and maximum current rating, making it crucial for selecting the right diode for a particular circuit or application. Understanding the diode type is essential for ensuring proper functionality and performance in electronic circuits.

    BRIDGE RECTIFIER DIODE
  • Output Current-Max

    Output Current-Max is a parameter in electronic components that specifies the maximum amount of current that can be safely drawn from the output of the component without causing damage. It is an important specification to consider when designing circuits to ensure that the component can handle the required current without overheating or failing. Exceeding the maximum output current can lead to performance issues, component damage, or even complete failure of the circuit. It is crucial to adhere to the specified maximum output current to ensure the reliable operation of the electronic component and the overall circuit.

    1.5 A
  • Forward Voltage

    the amount of voltage needed to get current to flow across a diode.

    1.1(V)
  • Number of Phases
    1
  • Rep Pk Reverse Voltage-Max

    Rep Pk Reverse Voltage-Max refers to the maximum reverse voltage that an electronic component, such as a diode, can withstand during a specified period of time without failing. This parameter is crucial in determining the safe operating limits of components in circuits where reverse voltage conditions may occur. Exceeding this value can lead to breakdown or permanent damage to the component. It is typically expressed in volts and is a key specification in signal and power applications.

    1000 V
  • Non-rep Pk Forward Current-Max

    Non-rep Pk Forward Current-Max refers to the maximum forward current that a semiconductor device, such as a diode or LED, can handle in a pulsed or non-repetitive manner without being damaged. This parameter is essential for designers to ensure that the component operates reliably under specific conditions, particularly during transient events like switching or fault conditions. Exceeding this limit can lead to overheating or failure of the device.

    50 A
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Yes with exemptions
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Download datasheets and manufacturer documentation for Diotec Semiconductor AG B500S15A.

B500S15A Overview

According to the datasheets, the peak forward voltage is 1.1@1A.With the peak RMS reverse voltage range of 500, this device can operate efficiently.RF diode is recommended to keep the forward voltage of the system above 1.1(V).Diode can read a maximum output current voltage of 1.5 A using this device.

B500S15A Features

the forward peak voltage is 1.1@1A
the peak RMS reverse voltage range of 500
a maximum output current voltage of 1.5 A

B500S15A Applications

There are a lot of Diotec Semiconductor AG
B500S15A applications of RF diodes.


  • Sensor interfaces of security systems
  • Telematic systems
  • Compensators
  • Radar systems for industrial use
  • Ultra high-speed switching
  • Clamping circuits
  • Diode ring mixer
  • RF detector
  • RF voltage doubler
  • Wearables