

Infineon Technologies BBY5802WE6127XT
Manufacturer No:
BBY5802WE6127XT
Tiny WHSLManufacturer:
Utmel No:
1211-BBY5802WE6127XT
Package:
SC-80
Datasheet:
Description:
BBY58 Single Surface Mount 5.5pF @ 6V 1MHz -55°C~150°C TJ Capacitance Ratio-3.5 10V SC-80
Quantity:
Unit Price: $0.169903
Ext Price: $0.17
Delivery:





Payment:











In Stock : 13
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$0.169903
$0.17
10
$0.160286
$1.60
100
$0.151213
$15.12
500
$0.142654
$71.33
1000
$0.134579
$134.58
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- TypeParameter
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
SC-80 - Supplier Device Package
The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.
SCD-80 - Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-55°C~150°C TJ - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - Published2007
- Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Discontinued - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
BBY58 - Diode Type
In electronic components, the parameter "Diode Type" refers to the specific type or configuration of a diode, which is a semiconductor device that allows current to flow in one direction only. There are various types of diodes, each designed for specific applications and functions. Common diode types include rectifier diodes, zener diodes, light-emitting diodes (LEDs), and Schottky diodes, among others. The diode type determines the diode's characteristics, such as forward voltage drop, reverse breakdown voltage, and maximum current rating, making it crucial for selecting the right diode for a particular circuit or application. Understanding the diode type is essential for ensuring proper functionality and performance in electronic circuits.
Single - Capacitance @ Vr, F
Capacitance @ Vr, F refers to the capacitance value of a capacitor measured at a specified rated voltage (Vr). It indicates how much electrical charge the capacitor can store per volt when subjected to this voltage. This parameter is essential for understanding the behavior of capacitors in circuits, particularly under different voltage conditions, and ensures that the component operates within its safe limits. The unit of measurement is Farads (F), which quantifies the capacitor's ability to hold an electrical charge.
5.5pF @ 6V 1MHz - Voltage - Peak Reverse (Max)
Voltage - Peak Reverse (Max) refers to the maximum voltage that a semiconductor device, typically a diode, can withstand in the reverse-bias direction without undergoing breakdown. It is crucial for ensuring reliable operation in circuits where the direction of the voltage may change. Exceeding this parameter can result in permanent damage to the component, leading to failure in its intended function. This specification is particularly important in applications involving rectification or signal modulation.
10V - Capacitance Ratio
The amount of electric charge stored on a conductor to a difference in electric potential.
3.5 - Capacitance Ratio Condition
Capacitance is the ratio of the amount of electric charge stored on a conductor to a difference in electric potential. The capacitance C is the ratio of the amount of charge q on either conductor to the potential difference V between the conductors, or simply C = q/V.
C1/C4 - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant
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