

Microchip LSM170JE3/TR13
Manufacturer No:
LSM170JE3/TR13
Tiny WHSLManufacturer:
Utmel No:
1610-LSM170JE3/TR13
Package:
-
Description:
Reel
Quantity:
Unit Price: $0.474164
Ext Price: $0.47
Delivery:





Payment:











In Stock : 14
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$0.474164
$0.47
10
$0.447324
$4.47
100
$0.422004
$42.20
500
$0.398117
$199.06
1000
$0.375582
$375.58
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- TypeParameter
- Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - RoHSNon-Compliant
- PackageTape & Reel (TR)
- Base Product Number
"Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.
LSM170 - MfrMicrochip Technology
- Product StatusActive
- Factory Pack QuantityFactory Pack Quantity3000
- ManufacturerMicrochip
- BrandMicrochip Technology
- Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
* - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Reel - SubcategoryDiodes & Rectifiers
- Technology
In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.
Si - Product Type
a group of products which fulfill a similar need for a market segment or market as a whole.
Schottky Diodes & Rectifiers - Product Category
a particular group of related products.
Schottky Diodes & Rectifiers - Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No
SBR6030LE3
Microchip Technology1N5711UR-1/TR
Microchip Technology1N5711-1/TR
Microchip TechnologyJAN1N5711-1/TR
Microchip TechnologyJANTX1N5552/TR
Microchip Technology1N5809URS
Microchip TechnologyJANTXV1N5819-1/TR
Microchip TechnologyJAN1N914/TR
Microchip TechnologyCDLL5817/TR
Microchip TechnologyJANTX1N3595-1/TR
Microchip Technology