Microchip LSM170JE3/TR13
Microchip LSM170JE3/TR13
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Microchip LSM170JE3/TR13

Manufacturer No:

LSM170JE3/TR13

Manufacturer:

Microchip

Utmel No:

1610-LSM170JE3/TR13

Package:

-

ECAD Model:

Description:

Reel

Quantity:

Unit Price: $0.474164

Ext Price: $0.47

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 14

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $0.474164

    $0.47

  • 10

    $0.447324

    $4.47

  • 100

    $0.422004

    $42.20

  • 500

    $0.398117

    $199.06

  • 1000

    $0.375582

    $375.58

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
LSM170JE3/TR13 information

Specifications
Product Details
Microchip LSM170JE3/TR13 technical specifications, attributes, parameters and parts with similar specifications to Microchip LSM170JE3/TR13.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • RoHS
    Non-Compliant
  • Package
    Tape & Reel (TR)
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    LSM170
  • Mfr
    Microchip Technology
  • Product Status
    Active
  • Factory Pack QuantityFactory Pack Quantity
    3000
  • Manufacturer
    Microchip
  • Brand
    Microchip Technology
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    *
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Subcategory
    Diodes & Rectifiers
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    Si
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Schottky Diodes & Rectifiers
  • Product Category

    a particular group of related products.

    Schottky Diodes & Rectifiers
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
0 Similar Products Remaining

LSM170JE3/TR13 Overview


LSM170JE3/TR13 Features


LSM170JE3/TR13 Applications

There are a lot of Microchip
LSM170JE3/TR13 applications of single-phase diode rectifier.


  • DC motor control and drives
  • Battery chargers
  • Welders
  • Power converters
  • Reverse Polarity Protection
  • Ultra High-Speed Switching
  • Freewheeling
  • Polarity Protection Diode
  • Recirculating Diode
  • Switching Diode
LSM170JE3/TR13 Relevant information

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