

NTE Electronics, Inc NTE555A
Manufacturer No:
NTE555A
Tiny WHSLManufacturer:
Utmel No:
1780-NTE555A
Package:
Axial
Description:
PIN - Single 1.2pF @ 3V, 100MHz 150°C (TJ) SILICON NOT SPECIFIED AXIAL Axial
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- TypeParameter
- Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
Axial - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
NO - Supplier Device Package
The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.
- - Diode Element Material
The parameter "Diode Element Material" refers to the specific semiconductor material used in the construction of a diode. This material determines the electrical characteristics and performance of the diode, including its forward voltage drop, reverse breakdown voltage, and switching speed. Common diode element materials include silicon, germanium, and gallium arsenide, each offering different advantages for various applications. The choice of material impacts the diode's efficiency, thermal stability, and overall suitability for specific electronic circuits.
SILICON - Number of Terminals2
- MfrNTE Electronics, Inc
- PackageBag
- Product StatusActive
- Manufacturer Part NumberNTE555A
- ManufacturerNTE Electronics
- Package DescriptionO-LALF-W2
- Package StyleLONG FORM
- Package Body MaterialGLASS
- Reflow Temperature-Max (s)NOT SPECIFIED
- Rohs CodeYes
- Package ShapeROUND
- Number of Elements1
- Part Life Cycle CodeActive
- Ihs ManufacturerNTE ELECTRONICS INC
- Risk Rank2.11
- Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
- - Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
150°C (TJ) - ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - Applications
The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.
SWITCHING - HTS Code
HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.
8541.10.00.80 - SubcategoryPIN Diodes
- Technology
In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.
POSITIVE-INTRINSIC-NEGATIVE - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
AXIAL - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
WIRE - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
NOT SPECIFIED - Reach Compliance Code
Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.
unknown - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
O-LALF-W2 - Qualification Status
An indicator of formal certification of qualifications.
Not Qualified - Configuration
The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.
SINGLE - Diode Type
In electronic components, the parameter "Diode Type" refers to the specific type or configuration of a diode, which is a semiconductor device that allows current to flow in one direction only. There are various types of diodes, each designed for specific applications and functions. Common diode types include rectifier diodes, zener diodes, light-emitting diodes (LEDs), and Schottky diodes, among others. The diode type determines the diode's characteristics, such as forward voltage drop, reverse breakdown voltage, and maximum current rating, making it crucial for selecting the right diode for a particular circuit or application. Understanding the diode type is essential for ensuring proper functionality and performance in electronic circuits.
PIN - Single - Case Connection
Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.
ISOLATED - Current - Max
The parameter "Current - Max" in electronic components refers to the maximum amount of electrical current that a component can safely handle without risking damage or degradation. Exceeding this current can lead to overheating, reduced performance, or failure of the component. This specification is crucial for ensuring reliable operation and longevity of electronic circuits and devices. It is typically specified in amperes (A) and is a key factor in circuit design and component selection.
100 mA - JEDEC-95 Code
JEDEC-95 Code is a standardized identification system used by the Joint Electron Device Engineering Council to categorize and describe semiconductor devices. This code provides a unique alphanumeric identifier for various memory components, ensuring consistency in documentation and communication across the electronics industry. The format includes information about the type, capacity, and technology of the device, facilitating easier specification and understanding for manufacturers and engineers.
DO-34 - Capacitance @ Vr, F
Capacitance @ Vr, F refers to the capacitance value of a capacitor measured at a specified rated voltage (Vr). It indicates how much electrical charge the capacitor can store per volt when subjected to this voltage. This parameter is essential for understanding the behavior of capacitors in circuits, particularly under different voltage conditions, and ensures that the component operates within its safe limits. The unit of measurement is Farads (F), which quantifies the capacitor's ability to hold an electrical charge.
1.2pF @ 3V, 100MHz - Voltage - Peak Reverse (Max)
Voltage - Peak Reverse (Max) refers to the maximum voltage that a semiconductor device, typically a diode, can withstand in the reverse-bias direction without undergoing breakdown. It is crucial for ensuring reliable operation in circuits where the direction of the voltage may change. Exceeding this parameter can result in permanent damage to the component, leading to failure in its intended function. This specification is particularly important in applications involving rectification or signal modulation.
35V - Breakdown Voltage-Min
Breakdown Voltage-Min, also known as minimum breakdown voltage, is a crucial parameter in electronic components, especially in devices like diodes, transistors, and capacitors. It refers to the minimum voltage at which the component experiences a breakdown and allows a significant current to flow through it. This breakdown voltage is a critical threshold beyond which the component may get damaged or exhibit unexpected behavior. Manufacturers specify this parameter to ensure that the component operates within safe limits and to help designers select the appropriate components for their circuit requirements. It is essential to consider the Breakdown Voltage-Min when designing circuits to prevent overloading or damaging the components.
35 V - Frequency Band
Frequency band refers to a range of frequencies within the electromagnetic spectrum that a particular electronic component or device is designed to operate within. It is a crucial parameter that determines the performance and functionality of the component. The frequency band specifies the upper and lower limits of frequencies that the component can effectively transmit, receive, or process signals. Components such as antennas, filters, amplifiers, and transceivers are designed with specific frequency bands in mind to ensure optimal performance and compatibility with other components in a system. Understanding the frequency band of electronic components is essential for designing and integrating them into electronic systems for efficient and reliable operation.
VERY HIGH FREQUENCY - Diode Capacitance-Nom
Diode Capacitance-Nom refers to the nominal capacitance of a diode, which is a semiconductor device that allows current to flow in one direction only. The capacitance of a diode is a measure of its ability to store electrical charge when a voltage is applied across it. This parameter is important in determining the diode's behavior in high-frequency applications, as it can affect the speed at which the diode can switch on and off. A lower capacitance value typically indicates a faster diode response time, making it suitable for applications requiring quick switching speeds. Manufacturers provide the nominal capacitance value to help engineers select the right diode for their specific circuit requirements.
1.2 pF - Resistance @ If, F
The parameter "Resistance @ If, F" in electronic components refers to the resistance of the component at a specific current level (If) and frequency (F). Resistance is a measure of how much a component resists the flow of electric current through it. By specifying the resistance at a particular current and frequency, manufacturers provide important information about how the component will perform under specific operating conditions. This parameter helps engineers and designers select the right components for their circuits to ensure proper functionality and performance.
700mOhm @ 3mA, 200MHz - Diode Capacitance-Max
The parameter "Diode Capacitance-Max" refers to the maximum capacitance value that a diode can exhibit under specified conditions. Capacitance in a diode is a measure of its ability to store and release electrical charge, which can affect the diode's performance in certain applications. A higher capacitance value can lead to slower response times and increased signal distortion in high-frequency circuits. It is important to consider the maximum capacitance of a diode when designing electronic circuits to ensure proper functionality and performance.
1.2 pF - Diode Forward Resistance-Max
The parameter "Diode Forward Resistance-Max" refers to the maximum resistance that a diode exhibits when it is forward-biased. When a diode is forward-biased, it allows current to flow in the forward direction, and the diode's resistance in this direction is known as the forward resistance. This parameter is important because it indicates how effectively the diode conducts current when it is in the forward-biased state. A lower forward resistance value indicates that the diode can conduct current more efficiently, while a higher value means that there will be more resistance to the flow of current through the diode.
0.7 Ω